SG87207A1 - Gold wire for semiconductor element bonding - Google Patents

Gold wire for semiconductor element bonding

Info

Publication number: SG87207A1
Authority: SG; Singapore
Prior art keywords: ppm; mass; semiconductor element; gold wire; element bonding
Prior art date: 2000-06-19

Application number

SG200101081A

Other languages

English (en)

Inventor

Itabashi Ichimitsu

Takaura Shin

Original Assignee

Tanaka Electronics Ind

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-06-19

Filing date

2001-02-24

Publication date

2002-03-19

2001-02-24 Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind

2002-03-19 Publication of SG87207A1 publication Critical patent/SG87207A1/en

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01565—Thermally treating
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/521—Structures or relative sizes of bond wires
- H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/553—Materials of bond wires not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)
Die Bonding (AREA)

SG200101081A 2000-06-19 2001-02-24 Gold wire for semiconductor element bonding SG87207A1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2000183521A JP3323185B2 (ja)	2000-06-19	2000-06-19	半導体素子接続用金線

Publications (1)

Publication Number	Publication Date
SG87207A1 true SG87207A1 (en)	2002-03-19

Family

ID=18684099

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG200101081A SG87207A1 (en)	2000-06-19	2001-02-24	Gold wire for semiconductor element bonding

Country Status (8)

Country	Link
EP (1)	EP1168439B1 (fr)
JP (1)	JP3323185B2 (fr)
KR (1)	KR100695925B1 (fr)
CN (1)	CN1267991C (fr)
DE (1)	DE60127768T2 (fr)
MY (1)	MY136914A (fr)
SG (1)	SG87207A1 (fr)
TW (1)	TW480635B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100899322B1 (ko) *	2004-09-30	2009-05-27	타나카 덴시 코오교오 카부시키가이샤	Ａｕ 합금 본딩·와이어
WO2006057230A1 (fr)	2004-11-26	2006-06-01	Tanaka Denshi Kogyo K.K.	Fil de connexion en or pour élément semi-conducteur
JP4595018B2 (ja) *	2009-02-23	2010-12-08	株式会社新川	半導体装置の製造方法およびボンディング装置
CN107644716B (zh) *	2017-09-15	2019-09-13	绍兴市高砚智生物科技有限公司	添加蜜胺甲醛树脂的复合铜丝生产方法
CN107958850A (zh) *	2017-11-28	2018-04-24	宁波尚进自动化科技有限公司	一种焊点焊接质量监控系统及其监控方法
CN109811176A (zh) *	2019-03-25	2019-05-28	杭州辰卓科技有限公司	一种电子器件封装高阻尼键合线用金合金及其工艺

Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5649534A (en) *	1979-09-28	1981-05-06	Tanaka Kikinzoku Kogyo Kk	Bonding wire for semiconductor device
GB2116208A (en) *	1981-12-04	1983-09-21	Mitsubishi Metal Corp	Fine gold alloy wire for bonding of a semiconductor device
JPS61110735A (ja) *	1984-10-31	1986-05-29	Tatsuta Electric Wire & Cable Co Ltd	耐熱性に優れた金合金
JPS62228440A (ja) *	1986-03-28	1987-10-07	Matsuda Kikinzoku Kogyo Kk	半導体素子ボンデイング用金線
EP0743679A2 (fr) *	1995-05-17	1996-11-20	Tanaka Denshi Kogyo Kabushiki Kaisha	Fil en or pour relier des puces
JPH10172998A (ja) *	1996-12-11	1998-06-26	Sumitomo Metal Mining Co Ltd	Ａｕボンディングワイヤー
JPH10303235A (ja) *	1997-04-25	1998-11-13	Tanaka Denshi Kogyo Kk	半導体素子ボンディング用金合金線

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3657087B2 (ja) *	1996-07-31	2005-06-08	田中電子工業株式会社	ウエッジボンディング用金合金線
US5945065A (en) *	1996-07-31	1999-08-31	Tanaka Denshi Kogyo	Method for wedge bonding using a gold alloy wire
US5745418A (en) *	1996-11-25	1998-04-28	Macronix International Co., Ltd.	Flash memory mass storage system
JP2000040710A (ja) *	1998-07-24	2000-02-08	Sumitomo Metal Mining Co Ltd	ボンディング用金合金細線

2000
- 2000-06-19 JP JP2000183521A patent/JP3323185B2/ja not_active Expired - Lifetime
2001
- 2001-02-23 TW TW090104260A patent/TW480635B/zh not_active IP Right Cessation
- 2001-02-24 SG SG200101081A patent/SG87207A1/en unknown
- 2001-02-26 KR KR1020010009692A patent/KR100695925B1/ko not_active Expired - Fee Related
- 2001-02-27 DE DE60127768T patent/DE60127768T2/de not_active Expired - Lifetime
- 2001-02-27 EP EP01250061A patent/EP1168439B1/fr not_active Expired - Lifetime
- 2001-02-28 MY MYPI20010898A patent/MY136914A/en unknown
- 2001-02-28 CN CNB011089202A patent/CN1267991C/zh not_active Expired - Fee Related

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5649534A (en) *	1979-09-28	1981-05-06	Tanaka Kikinzoku Kogyo Kk	Bonding wire for semiconductor device
GB2116208A (en) *	1981-12-04	1983-09-21	Mitsubishi Metal Corp	Fine gold alloy wire for bonding of a semiconductor device
JPS61110735A (ja) *	1984-10-31	1986-05-29	Tatsuta Electric Wire & Cable Co Ltd	耐熱性に優れた金合金
JPS62228440A (ja) *	1986-03-28	1987-10-07	Matsuda Kikinzoku Kogyo Kk	半導体素子ボンデイング用金線
EP0743679A2 (fr) *	1995-05-17	1996-11-20	Tanaka Denshi Kogyo Kabushiki Kaisha	Fil en or pour relier des puces
JPH10172998A (ja) *	1996-12-11	1998-06-26	Sumitomo Metal Mining Co Ltd	Ａｕボンディングワイヤー
JPH10303235A (ja) *	1997-04-25	1998-11-13	Tanaka Denshi Kogyo Kk	半導体素子ボンディング用金合金線

Also Published As

Publication number	Publication date
JP3323185B2 (ja)	2002-09-09
MY136914A (en)	2008-11-28
EP1168439A2 (fr)	2002-01-02
DE60127768T2 (de)	2007-12-27
EP1168439B1 (fr)	2007-04-11
CN1267991C (zh)	2006-08-02
KR20010113459A (ko)	2001-12-28
EP1168439A3 (fr)	2002-04-10
JP2002009101A (ja)	2002-01-11
CN1330404A (zh)	2002-01-09
KR100695925B1 (ko)	2007-03-20
DE60127768D1 (de)	2007-05-24
TW480635B (en)	2002-03-21

Publication	Publication Date	Title
ATE328128T1 (de)	2006-06-15	Herstellungsverfahren für hartes goldlegierungsteil
TWI265642B (en)	2006-11-01	Surface-mountable miniature-luminescence-and/or photo-diode and its production method
CY1109626T1 (el)	2014-08-13	Ενωσεις με ιδιοτητες αποδεσμευσης αυξητικης ορμονης
ZA200108918B (en)	2003-03-26	Coleopteran-toxic polypeptide compositions and insect-resistant transgenic plants.
GB2116208B (en)	1985-12-04	Fine gold alloy wire for bonding of a semiconductor device
SG77142A1 (en)	2000-12-19	Gold alloy wire for wedge bonding and use thereof in wedge bonding
MY120121A (en)	2005-09-30	Gold alloy wire and method for making a bump
EP1168439A3 (fr)	2002-04-10	Fil de connexion en or pour un dispositif semi-conducteur
ZA200500065B (en)	2006-03-29	Crystalline 2,5,-dione-3-(1-methyl-1H-indol-3-yl)-Ä1-(pyridin-2-ylmethyl)piperidin-4-ylÜ-1H-indol-3-ylÜ-1H-pyrrole mono-hydrochloride
WO2007022399A3 (fr)	2008-02-14	Ensemble semi-conducteur et boitier pour applications a courant eleve et a faible inductance
MY116424A (en)	2004-01-31	Saw strip for fixing a crystal and process for cutting off wafers
MY122351A (en)	2006-04-29	Fine wire of gold alloy, method for manufacture thereof and use thereof
ATE466115T1 (de)	2010-05-15	Graue goldlegierung
SG44586A1 (en)	1997-12-19	Palladium alloy thin wire for wire bonding semiconductor elements
DE69615746D1 (de)	2001-11-15	Golddraht zum Bonden von Chips
DE50105603D1 (de)	2005-04-21	Aufbrennfähige, hochgoldhaltige Dentallegierung
PL373612A1 (en)	2005-09-05	Sieving device having beating elements
WO2004109813A3 (fr)	2005-04-21	Diode luminescente
IT8119201A0 (it)	1981-01-19	Dispositivo per separare in modocontinuo la polpa di frutti dalla buccia e dal nocciolo o noccioli e semi di essi, nonche' procedimento per produrre vino.
EP1487073A3 (fr)	2005-03-30	Montage d'une diode laser par soudage
JPH11126788A5 (ja)	2005-06-30	振動破断特性に優れたｉｃチップ接続用金合金線
ATE252046T1 (de)	2003-11-15	Vorrichtung zur streifenweisen abgabe von klebband
EP0178506A3 (en)	1987-12-23	Application of silver-palladium alloys for bonding dental ceramics by firing
KR950701982A (ko)	1995-05-17	반도체소자용 금합금 세선(gold alloy wire for bonding semiconductor device)
GB2229859A (en)	1990-10-03	Roll surface cutting method