SG91884A1 - Component recognizing method and apparatus - Google Patents

Component recognizing method and apparatus

Info

Publication number
SG91884A1
SG91884A1 SG200005491A SG200005491A SG91884A1 SG 91884 A1 SG91884 A1 SG 91884A1 SG 200005491 A SG200005491 A SG 200005491A SG 200005491 A SG200005491 A SG 200005491A SG 91884 A1 SG91884 A1 SG 91884A1
Authority
SG
Singapore
Prior art keywords
recognizing method
component recognizing
component
recognizing
Prior art date
Application number
SG200005491A
Other languages
English (en)
Inventor
Morimoto Masamichi
Hachiya Eiichi
Tanabe Atsushi
Noudo Akira
Sano Kimiaki
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP04784998A external-priority patent/JP3883279B2/ja
Priority claimed from JP04841498A external-priority patent/JP3949257B2/ja
Priority claimed from JP04984098A external-priority patent/JP3923168B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of SG91884A1 publication Critical patent/SG91884A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49462—Gear making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53539—Means to assemble or disassemble including work conveyor
    • Y10T29/53543—Means to assemble or disassemble including work conveyor including transporting track

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG200005491A 1998-02-27 1999-02-25 Component recognizing method and apparatus SG91884A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP04784998A JP3883279B2 (ja) 1998-02-27 1998-02-27 電子部品実装方法及び装置
JP04841498A JP3949257B2 (ja) 1998-02-27 1998-02-27 部品認識方法および部品検査、実装方法
JP04984098A JP3923168B2 (ja) 1998-03-02 1998-03-02 部品認識方法及び部品実装方法

Publications (1)

Publication Number Publication Date
SG91884A1 true SG91884A1 (en) 2002-10-15

Family

ID=27293110

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200005491A SG91884A1 (en) 1998-02-27 1999-02-25 Component recognizing method and apparatus
SG200005492A SG108814A1 (en) 1998-02-27 1999-02-25 Component recognizing method and apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200005492A SG108814A1 (en) 1998-02-27 1999-02-25 Component recognizing method and apparatus

Country Status (6)

Country Link
US (1) US6606788B1 (fr)
EP (3) EP1062853B1 (fr)
CN (1) CN1205847C (fr)
DE (3) DE69934116T2 (fr)
SG (2) SG91884A1 (fr)
WO (1) WO1999044408A1 (fr)

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US6765666B1 (en) 2000-08-03 2004-07-20 Semiconductor Technologies & Instruments, Inc. System and method for inspecting bumped wafers
DE10043197A1 (de) * 2000-09-01 2002-03-28 Siemens Ag Verfahren zur Verarbeitung von kontrastschwachen Bildsignalen
JP2003058601A (ja) * 2001-08-14 2003-02-28 Matsushita Electric Ind Co Ltd 画像処理装置用教示データの配送方法及びシステム
JP4330512B2 (ja) * 2004-10-08 2009-09-16 パナソニック株式会社 部品実装装置
TWM265687U (en) * 2004-10-15 2005-05-21 Inventec Corp Foolproof device for heat sink module of notebook computer
CN100435611C (zh) * 2005-08-05 2008-11-19 华南理工大学 一种贴片机自适应式光源照明系统及方法
EP1809087A3 (fr) 2006-01-13 2013-07-24 ASM Assembly Systems GmbH & Co. KG Procédé et dispositif destinés à la mesure de coplanarité de connexions de composants
JP4888013B2 (ja) * 2006-09-28 2012-02-29 富士通株式会社 高さ制限算出装置、高さ制限算出方法および高さ制限算出プログラム
DE102007026900A1 (de) 2007-06-11 2008-12-18 Siemens Ag Auswerten der Oberflächenstruktur von Bauelementen unter Verwendung von unterschiedlichen Präsentationswinkeln
JP5059686B2 (ja) * 2008-05-22 2012-10-24 Ｊｕｋｉ株式会社 表面実装装置
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
TW201120405A (en) * 2009-12-11 2011-06-16 Jeteazy System Co Ltd Height measurement device having probe and method for using the device to measure height.
DE112011104989T5 (de) * 2011-03-02 2014-01-16 Panasonic Corporation Eine Bauteilmontageeinrichtung, ein Bauteilmontageverfahren, eine Bilderzeugungseinrichtung und ein Bilderzeugungsverfahren
JP5842523B2 (ja) * 2011-10-07 2016-01-13 富士通株式会社 設計支援装置、設計支援プログラムおよび設計支援方法
JP6023415B2 (ja) * 2011-10-17 2016-11-09 キヤノン株式会社 三次元計測装置、三次元計測装置の制御方法およびプログラム
CN103249295B (zh) * 2012-02-08 2017-07-07 Juki株式会社 电子部件安装方法、电子部件安装装置以及电子部件安装系统
JP5647652B2 (ja) * 2012-08-27 2015-01-07 ヤマハ発動機株式会社 半導体部品用実装装置
JP6242098B2 (ja) * 2013-07-16 2017-12-06 株式会社キーエンス 三次元画像処理装置、三次元画像処理方法及び三次元画像処理プログラム並びにコンピュータで読み取り可能な記録媒体及び記録した機器
US20160192552A1 (en) * 2013-08-07 2016-06-30 Fuji Machine Mfg, Co., Ltd. Electronic component mounting machine and transfer confirmation method
CN103582310B (zh) * 2013-09-18 2015-03-25 江苏腾世机电有限公司 一种贴片机贴装元件的贴装控制方法及系统
JP6479497B2 (ja) * 2015-02-16 2019-03-06 Juki株式会社 電子部品実装装置及び電子部品実装方法
US10551181B2 (en) * 2015-06-24 2020-02-04 Fuji Corporation Board inspection machine
CN107852860B (zh) * 2015-07-23 2020-07-31 株式会社富士 元件安装机
JP6524418B2 (ja) * 2016-02-04 2019-06-05 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法
JP6761477B2 (ja) * 2016-09-01 2020-09-23 株式会社Ｆｕｊｉ 部品実装装置および位置認識方法
EP3537862B1 (fr) * 2016-11-02 2024-03-06 Fuji Corporation Système d'alimentation en composants
CN108575086A (zh) * 2017-03-08 2018-09-25 台达电子电源(东莞)有限公司 电子元器件接脚位置采集装置、识别装置及自动插件机
JP2019021709A (ja) * 2017-07-13 2019-02-07 Juki株式会社 電子部品実装装置及び電子部品実装方法
KR102236269B1 (ko) * 2018-05-09 2021-04-05 한화정밀기계 주식회사 부품 실장 장치
CN108901119B (zh) * 2018-06-22 2020-06-23 广州兴森快捷电路科技有限公司 用于测量激光钻机孔位精度的治具及方法
WO2020105138A1 (fr) * 2018-11-21 2020-05-28 株式会社Ｆｕｊｉ Dispositif de montage de composant
JP7314608B2 (ja) * 2019-05-10 2023-07-26 スミダコーポレーション株式会社 電子部品評価方法、電子部品評価装置及び電子部品評価プログラム
WO2021177236A1 (fr) * 2020-03-05 2021-09-10 ファナック株式会社 Dispositif de mesure tridimensionnel et procédé de mesure tridimensionnel
JP7653650B2 (ja) * 2020-06-05 2025-03-31 パナソニックＩｐマネジメント株式会社 検査装置、部品装着システムおよび基板製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0488292A2 (fr) * 1990-11-29 1992-06-03 Matsushita Electric Industrial Co., Ltd. Système de mesure de valeurs de forme tridimensionelle
EP0417736B1 (fr) * 1989-09-12 1994-11-30 Matsushita Electric Industrial Co., Ltd. Système d'inspection optique de conditions des parties insérées sur un substrat
WO1999000661A1 (fr) * 1997-06-30 1999-01-07 Semiconductor Technologies & Instruments, Inc. Procede et appareil d'inspection de pieces

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EP0020879A1 (fr) 1979-06-06 1981-01-07 Erwin Sick GmbH Optik-Elektronik Détecteur de distance électro-optique
DE69015375T2 (de) * 1989-01-13 1995-05-04 Matsushita Electric Ind Co Ltd Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers.
US5628110A (en) * 1994-07-15 1997-05-13 Matsushita Electric Industrial Co., Ltd. Inspecting method of an electronic component during a mounting operation of the same onto a substrate
US5817957A (en) * 1996-01-29 1998-10-06 Samsung Aerospace Industries, Ltd. Electronic parts loading device
EP0897657B1 (fr) * 1996-04-23 2002-02-27 Matsushita Electric Industrial Co., Ltd. Appareil de montage de composants electroniques
KR100332525B1 (ko) * 1997-08-29 2002-04-17 마츠시타 덴끼 산교 가부시키가이샤 부품 장착 방법 및 부품 장착 장치
JPH11220298A (ja) * 1998-02-02 1999-08-10 Matsushita Electric Ind Co Ltd 電子部品実装方法
US6195165B1 (en) * 1998-08-04 2001-02-27 Cyberoptics Corporation Enhanced sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417736B1 (fr) * 1989-09-12 1994-11-30 Matsushita Electric Industrial Co., Ltd. Système d'inspection optique de conditions des parties insérées sur un substrat
EP0488292A2 (fr) * 1990-11-29 1992-06-03 Matsushita Electric Industrial Co., Ltd. Système de mesure de valeurs de forme tridimensionelle
WO1999000661A1 (fr) * 1997-06-30 1999-01-07 Semiconductor Technologies & Instruments, Inc. Procede et appareil d'inspection de pieces

Also Published As

Publication number Publication date
CN1292208A (zh) 2001-04-18
DE69933870T2 (de) 2007-04-12
EP1062853A1 (fr) 2000-12-27
EP1089607A3 (fr) 2001-04-18
DE69933870D1 (de) 2006-12-14
DE69934116T2 (de) 2007-06-21
EP1089607A2 (fr) 2001-04-04
SG108814A1 (en) 2005-02-28
CN1205847C (zh) 2005-06-08
DE69934103T2 (de) 2007-07-12
DE69934103D1 (de) 2007-01-04
EP1089608A2 (fr) 2001-04-04
EP1089608A3 (fr) 2001-04-18
EP1089608B1 (fr) 2006-11-02
WO1999044408A1 (fr) 1999-09-02
EP1089607B1 (fr) 2006-11-22
DE69934116D1 (de) 2007-01-04
US6606788B1 (en) 2003-08-19
EP1062853B1 (fr) 2006-11-22

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