SG92702A1 - Singulation and sorting system for electronic devices - Google Patents

Singulation and sorting system for electronic devices

Info

Publication number
SG92702A1
SG92702A1 SG200002465A SG200002465A SG92702A1 SG 92702 A1 SG92702 A1 SG 92702A1 SG 200002465 A SG200002465 A SG 200002465A SG 200002465 A SG200002465 A SG 200002465A SG 92702 A1 SG92702 A1 SG 92702A1
Authority
SG
Singapore
Prior art keywords
singulation
electronic devices
sorting system
sorting
electronic
Prior art date
Application number
SG200002465A
Inventor
Todorov Krastev Krassimire
Chee Kong Fong
Original Assignee
Avalon Technology Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avalon Technology Pte Ltd filed Critical Avalon Technology Pte Ltd
Priority to TW089108862A priority Critical patent/TW460912B/en
Priority to SG200002465A priority patent/SG92702A1/en
Priority to AU2001255136A priority patent/AU2001255136A1/en
Priority to PCT/SG2001/000082 priority patent/WO2001085367A1/en
Publication of SG92702A1 publication Critical patent/SG92702A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
SG200002465A 2000-05-08 2000-05-08 Singulation and sorting system for electronic devices SG92702A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW089108862A TW460912B (en) 2000-05-08 2000-05-08 Singulation and sorting system for electronic devices
SG200002465A SG92702A1 (en) 2000-05-08 2000-05-08 Singulation and sorting system for electronic devices
AU2001255136A AU2001255136A1 (en) 2000-05-08 2001-04-26 Singulation and sorting system for electronic devices
PCT/SG2001/000082 WO2001085367A1 (en) 2000-05-08 2001-04-26 Singulation and sorting system for electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200002465A SG92702A1 (en) 2000-05-08 2000-05-08 Singulation and sorting system for electronic devices

Publications (1)

Publication Number Publication Date
SG92702A1 true SG92702A1 (en) 2002-11-19

Family

ID=20430582

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002465A SG92702A1 (en) 2000-05-08 2000-05-08 Singulation and sorting system for electronic devices

Country Status (4)

Country Link
AU (1) AU2001255136A1 (en)
SG (1) SG92702A1 (en)
TW (1) TW460912B (en)
WO (1) WO2001085367A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1789998B1 (en) 2004-08-23 2014-04-09 Rokko Systems Pte Ltd Supply mechanism for the chuck of an integrated circuit dicing device
SG120197A1 (en) * 2004-08-23 2006-03-28 Rokko Systems Pte Ltd Supply mechanism for the chuck of an integrated circuit dicing device
WO2007073356A2 (en) * 2005-12-20 2007-06-28 Rokko Systems Pte Ltd Improved singulation system and method
SG151109A1 (en) * 2007-09-12 2009-04-30 Rokko Ventures Pte Ltd An apparatus and method for dicing an ic substrate
SG169913A1 (en) * 2009-09-28 2011-04-29 Rokko Technology Pte Ltd Punch singulation system and method
CN102688861A (en) * 2012-06-04 2012-09-26 太仓越华精密机械配件有限公司 Cleaning machine
CN103962736B (en) * 2014-05-22 2016-02-03 江苏金方圆数控机床有限公司 Laser cutting sheet material waste material is separated and componentselected system
CN105731035B (en) * 2016-04-27 2018-01-23 西安晨宇环境工程有限公司 A kind of cull automatic cleaning machine
CN112642787A (en) * 2020-12-14 2021-04-13 成都金斯特节能门窗有限公司 All-round aluminum alloy door and window processing belt cleaning device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983002243A1 (en) * 1981-12-30 1983-07-07 Nutechnomex Ltd Decontamination method and apparatus for semiconductor wafer handling equipment
JPH11145102A (en) * 1997-11-06 1999-05-28 Dainippon Screen Mfg Co Ltd Substrate drying method and device
US5913985A (en) * 1997-08-08 1999-06-22 International Business Machines Corporation Fixture and method for securing electronic modules during wet processing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH635769A5 (en) * 1980-03-10 1983-04-29 Far Fab Assortiments Reunies INSTALLATION FOR SAWING PLATES AND HANDLING DEVICE FOR SUCH AN INSTALLATION.
US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
JP3265133B2 (en) * 1994-08-23 2002-03-11 株式会社日立製作所 Inspection device
JP3570018B2 (en) * 1995-07-21 2004-09-29 ソニー株式会社 IC test system
US6139243A (en) * 1997-07-09 2000-10-31 Systemation Engineering Method and system for flipping a tray of parts
JPH1149276A (en) * 1997-08-07 1999-02-23 Sumitomo Kinzoku Electro Device:Kk Ic package substrate holding body
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
US6156580A (en) * 1998-11-18 2000-12-05 Advanced Micro Devices, Inc. Semiconductor wafer analysis system and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1983002243A1 (en) * 1981-12-30 1983-07-07 Nutechnomex Ltd Decontamination method and apparatus for semiconductor wafer handling equipment
US5913985A (en) * 1997-08-08 1999-06-22 International Business Machines Corporation Fixture and method for securing electronic modules during wet processing
JPH11145102A (en) * 1997-11-06 1999-05-28 Dainippon Screen Mfg Co Ltd Substrate drying method and device

Also Published As

Publication number Publication date
AU2001255136A1 (en) 2001-11-20
TW460912B (en) 2001-10-21
WO2001085367A1 (en) 2001-11-15

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