SG97183A1 - Pick-up tool - Google Patents

Pick-up tool

Info

Publication number
SG97183A1
SG97183A1 SG200103977A SG200103977A SG97183A1 SG 97183 A1 SG97183 A1 SG 97183A1 SG 200103977 A SG200103977 A SG 200103977A SG 200103977 A SG200103977 A SG 200103977A SG 97183 A1 SG97183 A1 SG 97183A1
Authority
SG
Singapore
Prior art keywords
pick
tool
Prior art date
Application number
SG200103977A
Other languages
English (en)
Inventor
Rene Josef Ulrich
Original Assignee
Esec Trading Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Trading Sa filed Critical Esec Trading Sa
Publication of SG97183A1 publication Critical patent/SG97183A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)
SG200103977A 2000-07-03 2001-06-26 Pick-up tool SG97183A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH13092000 2000-07-03

Publications (1)

Publication Number Publication Date
SG97183A1 true SG97183A1 (en) 2003-07-18

Family

ID=4565364

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200103977A SG97183A1 (en) 2000-07-03 2001-06-26 Pick-up tool

Country Status (8)

Country Link
US (1) US6675465B2 (ko)
KR (1) KR20020004830A (ko)
CN (1) CN1206714C (ko)
AT (1) AT412553B (ko)
CH (1) CH695075A5 (ko)
HK (1) HK1041560A1 (ko)
SG (1) SG97183A1 (ko)
TW (1) TW503456B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE526666C2 (sv) * 2002-12-30 2005-10-25 Nobel Biocare Ab Anordning och arrangemang för fixturinstallation
DE10309879B4 (de) * 2003-03-06 2006-08-31 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen
WO2005061188A1 (ja) * 2003-12-19 2005-07-07 Matsushita Electric Industrial Co., Ltd. 部品装着ヘッド、吸着ノズル、及び吸着ノズルの製造方法
CN101172539B (zh) * 2006-11-03 2011-05-04 鸿富锦精密工业（深圳）有限公司 吸附拾取装置
US7927976B2 (en) * 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
KR101736722B1 (ko) * 2008-11-19 2017-05-17 셈프리어스 아이엔씨. 전단-보조 탄성 스탬프 전사에 의한 프린팅 반도체 소자
US8261660B2 (en) * 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
FR2967292B1 (fr) 2010-11-05 2012-10-26 Legrand France Commutateur electrique de type push-push

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804814A (en) * 1994-05-20 1998-09-08 Musha; Toru Optical pick-up head and integrated type optical unit for use in optical pick-up head
JPS5537283A (en) * 1978-09-08 1980-03-15 Matsushita Electric Industrial Co Ltd Article shifter
US4763941A (en) * 1987-06-11 1988-08-16 Unisys Corporation Automatic vacuum gripper
NL8701603A (nl) 1987-07-08 1989-02-01 Philips & Du Pont Optical Vacuuminrichting voor het vastzuigen van werkstukken.
JPH02246233A (ja) * 1989-03-20 1990-10-02 Fujitsu Ltd ダイボンダ
DE69133413D1 (de) 1990-05-07 2004-10-21 Canon Kk Substratträger des Vakuumtyps
JPH04188840A (ja) * 1990-11-22 1992-07-07 Toshiba Corp ダイボンディング方法
JPH0521584A (ja) * 1991-07-16 1993-01-29 Nikon Corp 保持装置
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
JPH0831910A (ja) * 1994-07-18 1996-02-02 Hitachi Ltd 静電防止機能付き吸着パッドおよびその被吸着物離脱方法、ならびに静電防止機能付き吸着パッドを用いた半導体製造装置
DE19530858C1 (de) * 1995-08-22 1997-01-23 Siemens Ag Ansaugplatte für Wafer
CH695405A5 (de) * 1999-12-14 2006-04-28 Esec Trading Sa Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats.

Also Published As

Publication number Publication date
KR20020004830A (ko) 2002-01-16
US20030029029A1 (en) 2003-02-13
CN1330399A (zh) 2002-01-09
US6675465B2 (en) 2004-01-13
AT412553B (de) 2005-04-25
ATA9992001A (de) 2004-09-15
CH695075A5 (de) 2005-11-30
TW503456B (en) 2002-09-21
CN1206714C (zh) 2005-06-15
HK1041560A1 (zh) 2002-07-12

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