SG99406A1 - Apparatus and method for bond force control - Google Patents

Apparatus and method for bond force control

Info

Publication number
SG99406A1
SG99406A1 SG200204361A SG200204361A SG99406A1 SG 99406 A1 SG99406 A1 SG 99406A1 SG 200204361 A SG200204361 A SG 200204361A SG 200204361 A SG200204361 A SG 200204361A SG 99406 A1 SG99406 A1 SG 99406A1
Authority
SG
Singapore
Prior art keywords
force control
bond force
bond
control
force
Prior art date
Application number
SG200204361A
Other languages
English (en)
Inventor
Sun Kuen Wong
Ming Yeung Wan
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of SG99406A1 publication Critical patent/SG99406A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Manipulator (AREA)
SG200204361A 2001-07-17 2002-07-17 Apparatus and method for bond force control SG99406A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/905,906 US6616031B2 (en) 2001-07-17 2001-07-17 Apparatus and method for bond force control

Publications (1)

Publication Number Publication Date
SG99406A1 true SG99406A1 (en) 2003-10-27

Family

ID=25421668

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200204361A SG99406A1 (en) 2001-07-17 2002-07-17 Apparatus and method for bond force control

Country Status (4)

Country Link
US (1) US6616031B2 (fr)
EP (1) EP1278232B1 (fr)
CN (1) CN1179405C (fr)
SG (1) SG99406A1 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7441688B2 (en) * 2003-11-04 2008-10-28 Reactive Nanotechnologies Methods and device for controlling pressure in reactive multilayer joining and resulting product
TW510507U (en) * 2002-04-22 2002-11-11 Ind Tech Res Inst Chip accessing device with position, speed and force controls
TW200414992A (en) * 2002-11-29 2004-08-16 Esec Trading Sa Method for picking semiconductor chips from a foil
EP1424884A1 (fr) * 2002-11-29 2004-06-02 Leica Geosystems AG Méthode de montage de composants miniaturisés sur une plaque de support
JP4166620B2 (ja) * 2003-05-13 2008-10-15 オリンパス株式会社 半導体接合装置
CH697279B1 (de) * 2004-12-06 2008-07-31 Oerlikon Assembly Equipment Ag Verfahren für die Montage eines Halbleiterchips auf einem Substrat.
JP4616748B2 (ja) * 2005-10-11 2011-01-19 株式会社新川 ダイピックアップ装置
DE102006020418A1 (de) * 2006-04-26 2007-10-31 Herrmann Ultraschalltechnik Gmbh & Co. Kg Vorrichtung zum Bearbeiten von Werkstücken mittels Ultraschall
DE102006058299A1 (de) 2006-12-11 2008-06-12 Robert Bosch Gmbh Handhabungswerkzeug für Bauelemente, insbesondere elektronische Bauelemente
CH698844B1 (de) * 2007-06-22 2009-11-13 Oerlikon Assembly Equipment Ag Vorrichtung zum Anpressen von auf einem Substrat angeordneten Halbleiterchips.
TWI377902B (en) * 2009-10-19 2012-11-21 Wistron Corp Pressing device for heat sink and pressing tool of the pressing device
JP2013026268A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
US9212099B2 (en) 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
US9090046B2 (en) 2012-04-16 2015-07-28 Applied Materials, Inc. Ceramic coated article and process for applying ceramic coating
US10199350B2 (en) * 2012-05-25 2019-02-05 Asm Technology Singapore Pte Ltd Apparatus for heating a substrate during die bonding
US9604249B2 (en) 2012-07-26 2017-03-28 Applied Materials, Inc. Innovative top-coat approach for advanced device on-wafer particle performance
US9343289B2 (en) 2012-07-27 2016-05-17 Applied Materials, Inc. Chemistry compatible coating material for advanced device on-wafer particle performance
US9916998B2 (en) 2012-12-04 2018-03-13 Applied Materials, Inc. Substrate support assembly having a plasma resistant protective layer
US9685356B2 (en) 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
US8941969B2 (en) 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
US9358702B2 (en) 2013-01-18 2016-06-07 Applied Materials, Inc. Temperature management of aluminium nitride electrostatic chuck
US9669653B2 (en) 2013-03-14 2017-06-06 Applied Materials, Inc. Electrostatic chuck refurbishment
US9887121B2 (en) 2013-04-26 2018-02-06 Applied Materials, Inc. Protective cover for electrostatic chuck
US9666466B2 (en) 2013-05-07 2017-05-30 Applied Materials, Inc. Electrostatic chuck having thermally isolated zones with minimal crosstalk
US9865434B2 (en) 2013-06-05 2018-01-09 Applied Materials, Inc. Rare-earth oxide based erosion resistant coatings for semiconductor application
US9850568B2 (en) 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
CN104517876B (zh) * 2013-09-30 2018-11-27 韩华泰科株式会社 封装件运送器组件
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
US11047035B2 (en) 2018-02-23 2021-06-29 Applied Materials, Inc. Protective yttria coating for semiconductor equipment parts
CN120674328A (zh) * 2025-03-14 2025-09-19 智慧星空(上海)工程技术有限公司 键合头、键合装置、键合方法及存储介质
CN121772695A (zh) * 2026-03-04 2026-03-31 智慧星空(上海)工程技术有限公司 基片贴装头及半导体设备

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727822A (en) 1970-10-05 1973-04-17 Gen Electric Electromagnetic force system for integrated circuit fabrication
US3940047A (en) * 1974-01-16 1976-02-24 Unitek Corporation Bonding apparatus utilizing pivotally mounted bonding arm
US4266710A (en) * 1978-11-22 1981-05-12 Kulicke And Soffa Industries Inc. Wire bonding apparatus
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device
US4603802A (en) 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
JPH04162730A (ja) 1990-10-26 1992-06-08 Nec Kyushu Ltd ダイボンディング装置の押圧力制御機構
US5138127A (en) * 1991-07-31 1992-08-11 Hughes Aircraft Company Pressure welding with closed loop force control
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5230458A (en) * 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JP2635889B2 (ja) * 1992-06-24 1997-07-30 株式会社東芝 ダイボンディング装置
US5240165A (en) * 1992-07-06 1993-08-31 Motorola, Inc. Method and apparatus for controlled deformation bonding
US5368217A (en) * 1993-08-25 1994-11-29 Microelectronics And Computer Technology Corporation High force compression flip chip bonding method and system
US5586713A (en) * 1993-08-31 1996-12-24 Matsushita Electric Industrial Co., Ltd. Method for wire bonding
US5608172A (en) 1995-03-16 1997-03-04 Texas Instruments Incorporated Die bond touch down detector
US5673844A (en) * 1995-12-29 1997-10-07 Gte Laboratories Incorporated Gas pressure adjustable diebonding apparatus and method
US5985064A (en) * 1996-11-28 1999-11-16 Matsushita Electric Industrial Co., Ltd. Chip compression-bonding apparatus and method
EP0864392B1 (fr) 1997-03-13 2001-08-16 F & K Delvotec Bondtechnik GmbH Tête de jonction
JP3370551B2 (ja) * 1997-04-02 2003-01-27 株式会社新川 ワイヤボンディング装置及びそのボンディング荷重補正方法
EP1187180A1 (fr) * 2000-09-12 2002-03-13 Esec Trading S.A. Méthode et dispositif pour le montage de puces semiconductrices
KR100773170B1 (ko) * 2000-09-12 2007-11-02 언액시스 인터내셔널 트레이딩 엘티디 반도체 칩을 장착하는 방법 및 장치
JP4538942B2 (ja) * 2000-10-30 2010-09-08 日本電気株式会社 ワイヤボンディング装置
JP4544755B2 (ja) * 2001-01-17 2010-09-15 パナソニック株式会社 ボンディングヘッド及び部品装着装置

Also Published As

Publication number Publication date
US6616031B2 (en) 2003-09-09
US20030015569A1 (en) 2003-01-23
CN1399320A (zh) 2003-02-26
EP1278232A3 (fr) 2003-05-02
CN1179405C (zh) 2004-12-08
EP1278232A2 (fr) 2003-01-22
EP1278232B1 (fr) 2004-11-10

Similar Documents

Publication Publication Date Title
SG99406A1 (en) Apparatus and method for bond force control
SG109990A1 (en) Train control method and apparatus
AUPR430301A0 (en) Soil-cultivation implement control apparatus and method
GB0216876D0 (en) Bonding apparatus, and bonding method
EP1407114A4 (fr) Appareil et procede de pose de boulons d'ancrage
GB0111413D0 (en) Apparatus and method
AU2002346863A1 (en) Method and apparatus for modular embedded control system
GB0129669D0 (en) Apparatus and method
GB0101259D0 (en) Apparatus and method
AU2002365833A1 (en) Method and apparatus for providing parental control
EP1364937B8 (fr) Procédé de contrôle de réaction et appareil de contrôle
AU2002360593A1 (en) Method and apparatus for nano-sensing
GB0404652D0 (en) Traffic control method and apparatus
GB0110732D0 (en) Apparatus and method
GB2371355B (en) Defrost control method and apparatus
AU2001280714A1 (en) Method and apparatus for vibration control
AU2002306892A1 (en) Method and device for vibration control
GB0130891D0 (en) Apparatus and method
GB0102328D0 (en) Method and apparatus for brake disc control
AU2002258658A1 (en) Method and apparatus for improved scheduling technique
GB0115143D0 (en) Method and apparatus for sound control
GB0118620D0 (en) Apparatus and method
GB0206229D0 (en) Method and apparatus for directional actuation
GB0112921D0 (en) Control apparatus and method
GB0111411D0 (en) Apparatus and method