SU1158621A1 - "элektpoлиt циhkobahия" - Google Patents
"элektpoлиt циhkobahия"Info
- Publication number
- SU1158621A1 SU1158621A1 SU813373925A SU3373925A SU1158621A1 SU 1158621 A1 SU1158621 A1 SU 1158621A1 SU 813373925 A SU813373925 A SU 813373925A SU 3373925 A SU3373925 A SU 3373925A SU 1158621 A1 SU1158621 A1 SU 1158621A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- zinc
- plating electrolyte
- electrolyte
- plating
- Prior art date
Links
- 239000003792 electrolyte Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU813373925A SU1158621A1 (ru) | 1981-12-30 | 1981-12-30 | "элektpoлиt циhkobahия" |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU813373925A SU1158621A1 (ru) | 1981-12-30 | 1981-12-30 | "элektpoлиt циhkobahия" |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1158621A1 true SU1158621A1 (ru) | 1985-05-30 |
Family
ID=20989519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU813373925A SU1158621A1 (ru) | 1981-12-30 | 1981-12-30 | "элektpoлиt циhkobahия" |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU1158621A1 (ru) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2337996A (en) * | 1998-06-04 | 1999-12-08 | Kemet Electronics Corp | Method and electrolyte for anodizing valve metals |
| WO2002033153A3 (en) * | 2000-10-19 | 2003-06-19 | Atotech Deutschland Gmbh | Copper bath and method of depositing a matt copper coating |
-
1981
- 1981-12-30 SU SU813373925A patent/SU1158621A1/ru active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2337996A (en) * | 1998-06-04 | 1999-12-08 | Kemet Electronics Corp | Method and electrolyte for anodizing valve metals |
| WO2002033153A3 (en) * | 2000-10-19 | 2003-06-19 | Atotech Deutschland Gmbh | Copper bath and method of depositing a matt copper coating |
| US7074315B2 (en) | 2000-10-19 | 2006-07-11 | Atotech Deutschland Gmbh | Copper bath and methods of depositing a matt copper coating |
| CN1314839C (zh) * | 2000-10-19 | 2007-05-09 | 埃托特克德国有限公司 | 沉积无光泽铜镀层的铜浴及方法 |
| KR100801908B1 (ko) * | 2000-10-19 | 2008-02-12 | 아토테크 도이칠란드 게엠베하 | 구리 조 및 매트한 구리 코팅의 침착 방법 |
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