SU577706A1 - Устройство дл лужени печатных плат - Google Patents
Устройство дл лужени печатных платInfo
- Publication number
- SU577706A1 SU577706A1 SU7502185422A SU2185422A SU577706A1 SU 577706 A1 SU577706 A1 SU 577706A1 SU 7502185422 A SU7502185422 A SU 7502185422A SU 2185422 A SU2185422 A SU 2185422A SU 577706 A1 SU577706 A1 SU 577706A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- printed circuit
- circuit boards
- tinning
- tinning printed
- boards
- Prior art date
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU7502185422A SU577706A1 (ru) | 1975-11-03 | 1975-11-03 | Устройство дл лужени печатных плат |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU7502185422A SU577706A1 (ru) | 1975-11-03 | 1975-11-03 | Устройство дл лужени печатных плат |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU577706A1 true SU577706A1 (ru) | 1977-10-25 |
Family
ID=20635978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU7502185422A SU577706A1 (ru) | 1975-11-03 | 1975-11-03 | Устройство дл лужени печатных плат |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU577706A1 (ru) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5169446A (en) * | 1989-08-02 | 1992-12-08 | Mhb Joint Venture | Method and apparatus for coating alkali or alkaline earth metals |
| DE4136804A1 (de) * | 1991-11-08 | 1993-05-13 | Ernst Hohnerlein | Vorrichtung zum loeten |
| US8651356B2 (en) * | 2011-11-29 | 2014-02-18 | Samsung Electro-Mechanics Co., Ltd. | Solder bump forming apparatus and soldering facility including the same |
-
1975
- 1975-11-03 SU SU7502185422A patent/SU577706A1/ru active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5169446A (en) * | 1989-08-02 | 1992-12-08 | Mhb Joint Venture | Method and apparatus for coating alkali or alkaline earth metals |
| WO1992022382A1 (en) * | 1991-06-18 | 1992-12-23 | Valence Technology, Inc. | Method and apparatus for coating alkali or alkaline earth metals |
| DE4136804A1 (de) * | 1991-11-08 | 1993-05-13 | Ernst Hohnerlein | Vorrichtung zum loeten |
| DE4136804C2 (de) * | 1991-11-08 | 2001-01-25 | Seho Systemtechnik Gmbh | Vorrichtung zum Löten |
| US8651356B2 (en) * | 2011-11-29 | 2014-02-18 | Samsung Electro-Mechanics Co., Ltd. | Solder bump forming apparatus and soldering facility including the same |
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