TH27730B - Adhesives mixtures with increased curing rates - Google Patents

Abstract

DC60 (10/06/51) A mixture of adhesives consisting of aminoplast resins containing free formaldehyde-like compounds, specifically a mixture of adhesives consisting of melamine-urea-formaldehyde resins to which free formaldehyde-like compounds are added so that F/(NH2)2 is equal to 0.8 to 1.6. This adhesive is particularly suitable for the preparation of panel materials by combining cellulose-based materials with the adhesive according to this invention in a press and in production with this press, the panel materials are subjected to higher temperatures and pressures. A mixture of adhesives consisting of aminoplast resins containing free formaldehyde-like compounds, specifically a mixture of adhesives consisting of melamine-urea-formaldehyde resins to which free formaldehyde-like compounds are added so that F/(NH2)2 is equal to 0.8 to 1.6. This adhesive is particularly suitable for the preparation of panel materials by The panel material, which consists of cellulose and a binder, is assembled according to this invention in a press and manufactured using this press. The panel material is subjected to increasing temperatures and pressures.

Claims (14)

1. A mixture of adhesives prepared from formaldehyde-containing aminoplast resins will contain free formaldehyde-like compounds, with the amount of these free formaldehyde-like compounds ranging from 1 to 50% by weight compared to the total amount of formaldehyde added during the preparation of the adhesive. 2. A mixture of adhesives in accordance with Patent 1, which shall use formaldehyde as a free formaldehyde-like compound in an amount between 2 and 15% by weight relative to the total amount of formaldehyde added during the preparation of this adhesive. 3. A mixture of adhesives as per claim 1, which shall contain a free formaldehyde-like compound in such a manner that the F/(NH2)2 of the total adhesive mixture shall be 0.8 to 1.6. 4. Adhesive mixtures in accordance with claim 3, where the F/(NH2)2 ratio of the adhesive mixture is 0.9 to 1.5. 5. A mixture of adhesives in accordance with claim 1, which shall use a mixture of urea and melamine as the amino compounds in this aminoplast resin. 6. A mixture of binders in accordance with claim 5, in which the molar ratio of melamine/urea is 0.01 to 2. 7. Method for preparing aminoplast adhesives with increased curing rates by reacting amino compounds with formaldehyde-like compounds to form resins. These resins are then converted into aminoplast adhesives by adding formaldehyde-like compounds and catalysts until an F/(NH2)2 ratio of 0.8 to 1.6 is achieved. 8. Method for preparing panel materials by combining cellulose and a binder in a press. In this press, these materials are processed into panel materials at high temperatures and pressures. A binder mixture consisting of aminoplast resin as the binder will be used; free formaldehyde-like compounds will be present, and the F/(NH2)2 ratio of this binder mixture will be 0.8 to 1.6. 9. Methods for preparing panel materials include: adding aminoplast adhesive to a resin by reacting aminoplasts with formaldehyde-like compounds using a catalyst and formaldehyde-like compounds to obtain an aminoplast adhesive. The amount of free formaldehyde-like compounds in the adhesive is between 1 and 50% by weight compared to the total amount of formaldehyde added. The aminoplast adhesive is then combined with cellulose-based materials to form a curable mixture, and the curing of the curable mixture under pressure to form the panel material. 10. The method for preparing panel materials involves the addition of amino-forming resins with formaldehyde-like compounds using a catalyst and formaldehyde-like compounds until an F/(NH2)2 ratio of 0.8 to 1.6 is achieved to form an aminoplast adhesive with free formaldehyde-like compounds; the combination of the aminoplast adhesive with cellulose-based materials to form a curable mixture; and the curing of the curable mixture under pressure to form the panel material. 11. The method under claim 9, in which a formaldehyde-like compound is composed of formaldehyde or paraformaldehyde. 12. Method pursuant to claim 9 for the preparation of complex panel materials, which are cured by means of a mixture capable of curing under a pressure of 1 to 2 megapascals at temperatures from 100 to 140 degrees Celsius. 13. The method pursuant to claim 9 for the preparation of compressed particle board material, which is a curing mixture capable of curing under pressures of 1 to 5 MPa and temperatures of 180 to 230 °C. 14. Method pursuant to claim 9 for the preparation of medium-density fiberboard materials, which are cured in a mixture capable of curing under a pressure of 2 to 7 MPa and a temperature of 170 to 230 °C.