TH57111B - Solder alloys, cream solder, and electronic circuit boards. - Google Patents

Abstract

New Request Revised 8/07/2016 The solder alloys are tin-silver-copper solder alloys, and contain tin, silver, copper, bismuth, nickel, and cobalt as compared to the total content of the solder alloy, Silver content is 2% by mass or more and 4% by mass or less, nickel content is 0.01% by mass or more and 0.15% by mass or less, and cobalt content is 0.001% by mass or more. and 0.008 % by mass or less.

Claims (9)

Disclaimer (all) which will not appear on the advertisement page: Edit 1/9/16 1. Tin-silver-copper solder alloy containing tin, silver, copper, bismuth, nickel. L, and cobalt, where silver content is 2% by mass or more and 4% by mass or less in the total volume of solder alloys, the copper content is 0.1% by mass or more and 1% by mass or less. Than in part The total content of solder alloys, the busmouth content is 0.5% by mass or more and 408% by mass or less in section. The total content of the solder alloy, the nickel content is 0.01% by mass or more and 0.15% by mass or less in section. The total content of the solder alloy, the cobalt content is 0.001% by mass or more and 0.008% by mass or less in part. The total quantity of the solder alloy, the tin content, is the residual quantity 2. Soldering alloy according to claim 1, where the mass ratio of the nickel content to the cobalt content (Ni / Co) is 8 or more and 12 or less. Over 3. Soldering alloy according to claim 1 or 2, where the bismuth content is 108% by mass or more and 4.2% by mass or less in the total volume of the solder alloy. Rights 1 or 2, which also include anthymony, where anthymony content is 0.4% by mass or greater and 4.0% by mass or less in respect of the total volume of the solder alloy, and by volume. Bismuth is 0.8% by mass or more and 3.0% by mass or less in fraction. Total quantity of solder alloy 5. Solder alloy according to any of Clause 1 to 4, which also includes Indium, where Indium content is 2.2% by mass or more and 6.2% by mass or less. 6. Soldering alloy according to claim 5, where indium content is 2.8% by mass or more and 5.7% by mass or less in total volume of solder alloy. 7. Solder alloy according Clause 5 or 6, where the mass ratio of indium to bismuth content (In / Bi) is 0.5 or more and 4.2 or less. 8. Solder alloys according to claim 7, where the ratio The mass of the indium content per bismuth content (In / Bi) is 1.3 or more and 1.8 or less 9. Solder alloys according to Clause 1 to 8, where the copper content is 0.3% where Mass or more and 0.7% by mass or less in the total volume of allies solder 1 0. Cream solder containing solder powder made of solder alloy in accordance with Clause 1 to 9, Clause 1 to 9. One and flux 1 1. An electronic circuit board consisting of shortcuts formed using solder. Cream form according to claim 10 ------------------------------------------ ----------------------------------------- New Request Update 8/07/2016 1 Solder alloys of tin-silver-copper solder alloys include: tin, silver, copper, bismuth, nickel, and cobalt, where compared to the total content of solder alloys, silver content. Is 2% by mass or more and 4% by mass or less, 0.01% by mass or greater and 0.15% by mass or less, and cobalt content is 0.001% by mass or more and 0.008%. By mass or less 2. Solder alloys according to claim 1, where the mass ratio (Ni / Co) of the nickel content when Compared with the cobalt content is 8 or more and 12 or less. 3. Soldering alloy according to claim 1, where, when compared to the total content of the solder alloy, the bismuth content is 1.8% by mass or more and 4.2% by mass or less. 4. Soldering alloy according to claim 1, which also contains anthymony, where compared to the total content of the solder alloy, the anthymony content is 0.1% by mass or more and 5.0% by mass. Mass or less, and bismuth content 0.8% by mass or more and 3.0% by mass or less. 5. Soldering alloys according to claim 1, which also includes indium, where, in comparison with the total content of the solder alloys, the indium content is 2.2% by mass or more and 6.2% by mass or less. 6. Soldering alloy according to claim 5, where the mass ratio (In / Bi) of the indium quantity Compared with the bismuth content, it was 0.5 or more and 4.2 or less. 7. Solder alloy according to claim 1, where, when compared to the total content of the solder alloy, the copper content is 0.3% by mass or more and 0.7% by mass or less. 8. A cream solder containing flux, and a solder powder containing a solder alloy, where the solder alloy is a tin-silver-copper solder alloy, and consists of tin, silver, copper, bismuth. , Nickel, and cobalt, and when compared with the total content of solder alloys, the silver content is 2% by mass or more and 4% by mass or less, the nickel content is 0.01% by mass or greater and 0.15% by mass or less, and the cobalt content is 0.001% by mass or more and 0.008% by mass or less. 9. Electronic circuit board consisting of a solder part soldered by a cream solder, where the cream solder contains flux, and a solder powder containing the solder alloy, the solder alloy is the solder alloy. Tin-silver-copper type, and consists of tin, silver, copper, bismuth, nickel, and cobalt, where relative to the total content of solder alloys, the silver content is 2% by mass or Greater than and 4% by mass or less, the nickel content is 0.01% by mass or more and 0.15% by mass or less, and the cobalt content is 0.001% by mass or more and 0.008% by mass or less.