TR23460A - Fevkalade kesif entegre devre seklinde mikro elektronik,cipler arasi ve cipten cipe ara baglantilari saglamak icin cihaz - Google Patents

Fevkalade kesif entegre devre seklinde mikro elektronik,cipler arasi ve cipten cipe ara baglantilari saglamak icin cihaz

Info

Publication number
TR23460A
TR23460A TR182/87A TR18287A TR23460A TR 23460 A TR23460 A TR 23460A TR 182/87 A TR182/87 A TR 182/87A TR 18287 A TR18287 A TR 18287A TR 23460 A TR23460 A TR 23460A
Authority
TR
Turkey
Prior art keywords
chip
carrier
integrated circuit
connectors
jipt
Prior art date
Application number
TR182/87A
Other languages
English (en)
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of TR23460A publication Critical patent/TR23460A/tr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
TR182/87A 1986-03-27 1987-03-04 Fevkalade kesif entegre devre seklinde mikro elektronik,cipler arasi ve cipten cipe ara baglantilari saglamak icin cihaz TR23460A (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/811,207 US4695870A (en) 1986-03-27 1986-03-27 Inverted chip carrier

Publications (1)

Publication Number Publication Date
TR23460A true TR23460A (tr) 1989-12-29

Family

ID=25205882

Family Applications (1)

Application Number Title Priority Date Filing Date
TR182/87A TR23460A (tr) 1986-03-27 1987-03-04 Fevkalade kesif entegre devre seklinde mikro elektronik,cipler arasi ve cipten cipe ara baglantilari saglamak icin cihaz

Country Status (8)

Country Link
US (1) US4695870A (tr)
EP (1) EP0261138A1 (tr)
JP (1) JPS63503346A (tr)
KR (1) KR910004506B1 (tr)
ES (1) ES2002457A6 (tr)
IL (1) IL80875A (tr)
TR (1) TR23460A (tr)
WO (1) WO1987006062A1 (tr)

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US5008213A (en) * 1988-12-09 1991-04-16 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
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US6687842B1 (en) 1997-04-02 2004-02-03 Tessera, Inc. Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element
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US6294407B1 (en) 1998-05-06 2001-09-25 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
WO2003100829A2 (en) * 2002-05-20 2003-12-04 Imagerlabs Forming a multi segment integrated circuit with isolated substrates
US20040222518A1 (en) * 2003-02-25 2004-11-11 Tessera, Inc. Ball grid array with bumps
US7495179B2 (en) * 2003-10-06 2009-02-24 Tessera, Inc. Components with posts and pads
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US7462936B2 (en) * 2003-10-06 2008-12-09 Tessera, Inc. Formation of circuitry with modification of feature height
US8207604B2 (en) * 2003-12-30 2012-06-26 Tessera, Inc. Microelectronic package comprising offset conductive posts on compliant layer
US7709968B2 (en) * 2003-12-30 2010-05-04 Tessera, Inc. Micro pin grid array with pin motion isolation
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Also Published As

Publication number Publication date
IL80875A0 (en) 1987-03-31
WO1987006062A1 (en) 1987-10-08
ES2002457A6 (es) 1988-08-01
EP0261138A1 (en) 1988-03-30
KR910004506B1 (ko) 1991-07-05
JPS63503346A (ja) 1988-12-02
US4695870A (en) 1987-09-22
IL80875A (en) 1991-04-15
KR880701462A (ko) 1988-07-27
JPH0311106B2 (tr) 1991-02-15

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