TW200407697A - Heat dissipation method and mechanism thereof - Google Patents

Heat dissipation method and mechanism thereof Download PDF

Info

Publication number: TW200407697A
Authority: TW; Taiwan
Prior art keywords: heat; heat dissipation; air; fan; scope
Prior art date: 2002-11-13

Application number

TW91133245A

Other languages

English (en)

Chinese (zh)

Other versions

TWI305879B (fr

Inventor

Rong-Yao Lee

Original Assignee

Saint Song Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-11-13

Filing date

2002-11-13

Publication date

2004-05-16

2002-11-13 Application filed by Saint Song Corp filed Critical Saint Song Corp

2002-11-13 Priority to TW91133245A priority Critical patent/TW200407697A/zh

2004-05-16 Publication of TW200407697A publication Critical patent/TW200407697A/zh

2009-02-01 Application granted granted Critical

2009-02-01 Publication of TWI305879B publication Critical patent/TWI305879B/zh

Links

230000017525 heat dissipation Effects 0.000 title claims abstract description 98
238000000034 method Methods 0.000 title claims abstract description 10
230000005855 radiation Effects 0.000 claims 1
238000007664 blowing Methods 0.000 abstract 2
238000013022 venting Methods 0.000 abstract 1
238000001816 cooling Methods 0.000 description 8
230000000694 effects Effects 0.000 description 6
238000010586 diagram Methods 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
229910052782 aluminium Inorganic materials 0.000 description 3
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
239000010949 copper Substances 0.000 description 3
230000007547 defect Effects 0.000 description 3
238000004512 die casting Methods 0.000 description 3
239000000463 material Substances 0.000 description 3
210000004556 brain Anatomy 0.000 description 2
230000005611 electricity Effects 0.000 description 2
230000020169 heat generation Effects 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
230000009286 beneficial effect Effects 0.000 description 1
238000005266 casting Methods 0.000 description 1
238000001125 extrusion Methods 0.000 description 1
230000003779 hair growth Effects 0.000 description 1
238000003754 machining Methods 0.000 description 1
239000007769 metal material Substances 0.000 description 1
238000003860 storage Methods 0.000 description 1

Landscapes

Cooling Or The Like Of Electrical Apparatus (AREA)

TW91133245A 2002-11-13 2002-11-13 Heat dissipation method and mechanism thereof TW200407697A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW91133245A TW200407697A (en)	2002-11-13	2002-11-13	Heat dissipation method and mechanism thereof

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW91133245A TW200407697A (en)	2002-11-13	2002-11-13	Heat dissipation method and mechanism thereof

Publications (2)

Publication Number	Publication Date
TW200407697A true TW200407697A (en)	2004-05-16
TWI305879B TWI305879B (fr)	2009-02-01

Family

ID=45071247

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW91133245A TW200407697A (en)	2002-11-13	2002-11-13	Heat dissipation method and mechanism thereof

Country Status (1)

Country	Link
TW (1)	TW200407697A (fr)

2002
- 2002-11-13 TW TW91133245A patent/TW200407697A/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
TWI305879B (fr)	2009-02-01

Similar Documents

Publication	Publication Date	Title
JP2010216482A (ja)	2010-09-30	遠心ファン、該遠心ファンを有する放熱装置及び該放熱装置を使う電子装置
CN104812222B (zh)	2017-08-25	散热结构及具有该散热结构的电子装置
TW201110867A (en)	2011-03-16	Heat dispensing module
US6822862B2 (en)	2004-11-23	Apparatus and method for heat sink
JP5061068B2 (ja)	2012-10-31	電子機器
US20090272514A1 (en)	2009-11-05	Power supply and heat-dissipating method of the power supply
CN2604550Y (zh)	2004-02-25	散热装置
JP2004171501A (ja)	2004-06-17	小型コンピュータおよび放熱方法
WO2003067949A1 (fr)	2003-08-14	Mecanisme de refroidissement et dispositif de traitement d'informations utilisant un mecanisme de refroidissement
US20110198061A1 (en)	2011-08-18	Heat exchange device for closed electrical apparatus
TW200407697A (en)	2004-05-16	Heat dissipation method and mechanism thereof
JP2004039861A (ja)	2004-02-05	電子素子の冷却装置
TW200823642A (en)	2008-06-01	Centrifugal blower, thermal module having the centrifugal blower and electronic assembly incorporating the thermal module
TW201120625A (en)	2011-06-16	A dual fan heat dissipation device
JP3089954U (ja)	2002-11-22	放熱ファン装置
JP3805723B2 (ja)	2006-08-09	電子素子の冷却装置
EP1420622B1 (fr)	2007-10-31	Dispositif et méthode de refroidissement
TWI232368B (en)	2005-05-11	Miniaturized computer and heat dissipation method thereof
CN223515210U (zh)	2025-11-04	一种脱毛仪散热结构及脱毛仪
CN216902908U (zh)	2022-07-05	一种芯片的散热系统及移动终端
CN216979669U (zh)	2022-07-15	笔记型电脑散热系统
TW201037163A (en)	2010-10-16	Heat dissipation device and centrifugal fan thereof, and electronic device using same
TWI711367B (zh)	2020-11-21	散熱系統
JP2005032771A (ja)	2005-02-03	電子素子の冷却装置
CN1202572C (zh)	2005-05-18	散热方法及其机构

Legal Events

Date	Code	Title	Description
2012-11-01	MM4A	Annulment or lapse of patent due to non-payment of fees