TW200417825A - Method for fabricating light exposing apparatus, light unit, light exposing apparatus, light exposing method, and adjusting method - Google Patents

Abstract

The light exposing apparatus, which uses the light source of mercury-vapor lamp adapted in the user's current equipment, can also use the solid light source. A method is used to fabricate a light exposing apparatus, which uses an illuminating optical system with a condensing optical system to illuminate a mask, and transfers a pattern formed on the mask to an optical sensing plate. The method includes a solid light source disposing step (S11) for disposing multiple solid light sources at the front focusing position of the condensing optical system or at the conjugate position with it. Also and in steps S12-S16, with respect to the light source, different from the solid light sources, the properly-set first state of the property for the illuminating optical system is properly set to the second state by disposing the solid light sources.

Description

200417825 V. Description of the invention (1) ~ [Technical field to which the invention belongs] The present invention relates to an exposure device for forming a precise pattern by irradiating light from a light source unit on a desired surface from a semiconductor exposure device or a liquid crystal substrate exposure device. Manufacturing method; light source unit used in exposure device; exposure device having light source unit; exposure method using the exposure device and adjustment method of the exposure device. [Prior art] Traditionally, in a semiconductor exposure device or a liquid crystal substrate exposure device, light from a light source unit is irradiated on a desired surface, and a light source of a projection exposure device that forms a precise pattern on a substrate has an ultraviolet light having a wavelength of about 360 nm. The main use is mercury lamps. Since the life of this mercury lamp is about 500 ~ hours, it is necessary for the exposure device to periodically replace the mercury lamp, which causes a great burden on the user. In addition, high power is required to ensure high illumination, and it is necessary to take measures to cope with heat generation. There are problems of high operating costs and the risk of rupture due to deterioration over time. For light-emitting diodes, its luminous efficiency is higher than that of mercury lamps. Due to the characteristics of power saving and small heat generation, it can significantly reduce operating costs. In addition, since the life is about 3,000 hours, the burden of replacement is small, and there is no danger of rupture due to deterioration over time. More recently, UV-LEDs have been developed with high light output rates of about 100 mw at a wavelength of 365 nm. In the case where solid-state light sources such as light-emitting diodes are used in projection exposure devices, although there are advantages as described above, there are projection exposure devices that use light sources such as traditional mercury lamps. For all users, a new exposure device is introduced.

200417825 V. Description of the invention (3) The manufacturing method of the individual exposure device in item 3 of the application includes the case where the light source different from these solid light sources, such as a light source composed of a mercury lamp, is replaced with a solid light source. According to the adjustment steps, the characteristics of the illumination optical system corresponding to the light sources different from the solid light sources are set to the appropriate first state, and the properties of the second light state are set to the appropriate second state by the arrangement of the solid light sources. . Further, in the method for manufacturing an exposure device according to the fourth item, the adjusting step includes a step of adjusting an uneven illumination by adjusting an uneven illumination on the mask or the photosensitive substrate, and adjusting the sensitivity on the mask or the sensitivity. At least one of the telecentric adjustment steps of the telecentricity of the substrate is performed for adjustment. In the manufacturing method of the exposure device of item 4, the exposure device can be manufactured to adjust the uneven illumination on the mask or the photosensitive substrate and the telecentricity of the photosensitive substrate on the mask. 5 ^ The adjustment of at least the body light source cloth is adjusted to the entire distribution, and the manufacturing method of the exposure device of item 1f 谞 b is characterized in that the whole step includes adjusting the emission from the solid light sources. The step of adjusting the divergence angle of the divergence angle of one of the plurality of light beams is adjusted with at least one of the matching steps of adjusting the light distribution distribution of at least one of the plurality of light beams emitted from the plurality of light beams. By applying the manufacturing method of the exposure device of item 5, it is possible to manufacture an exposure device with a plurality of divergence angles emitted from these solid light sources and light distribution from the solid. First of all, the original method of manufacturing the exposure device in the sixth item of the application, the adjustment: using a photo of adjusting the illumination characteristics of the illumination optical system =; step 'and adjusting the emission from one of the light emitted from the solid light sources

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V. Description of the invention (4) Adjustment steps. In addition, Yu Jia asks for the characteristic adjustment step of item 7 to use a manufacturing method of a light device, in which the illumination unevenness adjustment step of the photomask or the photosensitive substrate is adjusted to adjust the adjustment in the mask or the The photosensitivity G is uneven, and is adjusted with a telecentric adjustment step; and the emitted light adjusts at least one of the telecentricity of the bovine substrate to perform at least ^ reuse adjustment within a plurality of light beams. Step with a divergence angle adjustment step that adjusts the divergence angles from the solids 2 to 你 你 你 先 First reduce at least one of the emitted multiple beams with a knife without one with a yfefc 1 9 At least one of the steps of cutting the cloth to adjust the light.

In the manufacturing method of the exposure device of item 6 or 7, the exposure device can be manufactured by adjusting the divergence angles of the light emitted from the solid light sources and the distribution of light distribution from the solid light sources.

The method of manufacturing an exposure device according to the eighth aspect of the present invention is directed to using a lighting optical system including a t-light optical system to illuminate a mask. The pattern of the mask is transferred to a photosensitive substrate. The manufacturing method includes: a solid-state light source disposing step, arranging a plurality of solid-state light sources at a front focal position of the condensing optical system or a position in common with its optics; and an adjusting step corresponding to the solid-state light sources. Light sources with different light sources are set to the appropriate exposure conditions of the exposure device in the first state, and appropriate solid state light sources are used to set the appropriate exposure conditions in the second state. In addition, the method for manufacturing an exposure device according to item Θ is applied using a photo

12725pif.ptd Page 9 200417825 V. Description of the invention (5) The optical system board, which exposes multiple and one adjustments to an appropriate solid light source, the application step includes the application of a control device, and the application step includes The adjustment step is different from the step of applying the solid light source of the body light source, and the body light source includes the light source, which is located at a light emitting end of an illumination array. The light source array is not the 8th to the 11th. For example, according to the situation, the compensation value is applied to the light-emitting diode of item 12 and the device of item 13 is applied. The light-solid light source array is an array of the same light source. A manufacturing method for transferring a pattern of a mask to a photosensitive base device includes: a solid light source arrangement step; the solid light source is arranged at a predetermined position of the illumination optical system; and a step corresponding to a light source different from the solid light sources is provided. The exposure conditions of the exposure device in the first state are set to the appropriate exposure conditions in the second state by these arrangements. The method of manufacturing an exposure device according to item 10, wherein the adjustment adds a compensation value to the step of controlling the exposure amount included in the exposure conditions. The method of manufacturing an exposure device according to item 11, wherein the adjustment adjusts one of the lighting characteristics of the illumination optical system, and the lighting characteristic adjusts and adjusts one of the emitted light from the solid light sources. Different from a light source composed of multiple solid mercury lamps, the light source is replaced by an adjustment step, and the exposure bar is replaced by an exposure bar to the control device to control the exposure amount. A manufacturing method of an exposure device, wherein the solid arrays. A light source unit, which is detachable and attachable to the source unit, includes: a plurality of solid light sources arranged in a row; and an optical element arranged in the solid light source array, wherein the light source unit is set to an appropriate first state with the solid. illumination

12725pif.ptd Page 10 200417825 V. Description of the invention (6) The characteristics of the device are set to the appropriate second state characteristics by the configuration of these solid light sources, and the lighting device is provided with a divergence angle and light distribution. Out of the light. The application of the light source unit of item 14, wherein the solid-state light source array and the optical element can be arranged in the optical path between an elliptical mirror that collects light from the light source lamp and an optical integrator in the lighting device. in. In the light source unit of the application Nos. 13 and 14, different characteristics of the light source with respect to the solid-state light source array of the lighting device, for example, the characteristics of the lighting device set to an appropriate first state with respect to the light source composed of a mercury lamp By setting the properties of these solid-state light sources and setting the characteristics to an appropriate second state, it is possible to provide emitted light including a divergence angle and a light distribution. The light source unit of the 15th item includes the adjustment device for adjusting the emitted light characteristics of the solid-state light source array. The light source unit in the fifth item of the application uses an adjustment device to adjust the light emission characteristics of the solid-state light source array. The light source unit of the 16th application further includes a plurality of optical fibers, and each incident end of the optical fibers is connected to the solid light sources. In the application of the light source unit of item 16, the freedom of configuration of the solid-state light source is large, and Gu Yirensi forms the arrangement shape of the exit ends of multiple optical fibers 0, and the application of the light source unit of item 17 includes: A plurality of solid-state light sources are arranged in an array-a solid-state light source array, and an adjusting device for adjusting the emitted light characteristics of the solid-state light source array. The adjusting device can adjust the light source unit from the solid-state light source array and apply for item 18, wherein the divergence angle of the light emitted from the solid-state light source array is adjusted.

200417825 V. Description of the invention (7) At least one of the light distribution of the light emitted from the heart row, the unevenness of illumination on the illuminated surface and the distance. In the light source unit of item 17 or 18, the adjustment device can adjust the divergence angle of light emitted from the solid-state light source array, the light distribution of the light, the uneven illumination on the illuminated surface, and the telecentricity. In addition, the light source unit of item 19 of the application further includes a plurality of optical fibers, and each incident end of the optical fibers is connected to the solid light sources. In the light source unit of the 19th application, it is possible to increase the degree of freedom in the arrangement of the solid-state light source, and it is easy to arbitrarily form the arrangement shape of the exit ends of a plurality of optical fibers. It also applies for the exposure method of item 20, which is applicable to the exposure device manufactured by applying the manufacturing method of any one of the exposure devices of items 1 to 12, including using the light from the solid light sources to illuminate the mask. One of a lighting step; and one of a transfer step of transferring the pattern of the mask to the photosensitive substrate. It also applies for the exposure method of item 21, wherein the transferring step includes using a projection optical system that projects the pattern image of the mask onto the photosensitive substrate. step. In the application of the exposure methods of items 20 and 21, the characteristics of the lighting device set to an appropriate first state because a light source different from a plurality of solid light sources is used are set by the configuration of the solid light sources. The exposure device having an appropriate second-state characteristic allows the pattern of the mask to be well transferred to the photosensitive substrate. Another application for the exposure device of item 22 includes: applying a light source unit of any one of items 13 to 19; and exposing the pattern of the mask to photosensitivity

12725pif.ptd Page 12 200417825 V. Description of the invention (8) " '---- The substrate is illuminated by the light from the light source unit, and the exposure device of item 23 is applied, which is one of the lighting devices. Projection optical system that projects onto a photosensitive substrate. The dagger was placed in the exposure of items 22 and 23 of Shen Qing,

The V device is a light source different from the solid light source. The i-light source unit is set to be appropriate for the light source composed of the lighting lamp. Because of the characteristics of mercury, the configuration of these solid light sources is 1 state. The characteristics of the state of the lighting device can be provided to include a divergent g which is set to an appropriate second. Therefore, the pattern of the mask can be well transferred to the light emitted by the light distribution. In addition, the application of the 24th exposure method 2nd 22nd Or an exposure device according to item 23, which is used for illuminating the light from the light source unit as described in the Shen Jing patent. The method I includes an illumination step, and the pattern of the mask is transferred to the photosensitive substrate. The transfer step 'will be based on the exposure method of item No. 24 in Shenyan, which is different from the solid light source. For example, the source light source is set to ^' because the light source is composed of a silver light. Due to the characteristics of the water setting, and the characteristics of the lighting device 2 state of the solid first state, it is possible to provide an exposure device that is set to include the device and is set to an appropriate first. Therefore, the 0 of the mask is fortunate. Emitted light from light distribution . The method of adjusting the curtain pattern can be well transferred to the photosensitive device. It is used to adjust the illumination of the system. The mask * includes a solid-state light source configuration step.

200417825 V. Description of the invention (9) A plurality of solid-state light sources replacing the light source device are arranged at the front focal position of the condensing optical system or the optical co-location position therewith, and an adjustment step is made by using the configuration of the solid-state light sources to Adjusting the illumination characteristics of the illumination optical system 0 The adjustment method of the exposure device of the 25th application, although a plurality of solid-state light sources replacing the light source device are arranged at a front focal position of one of the condensing optical systems or are optically conjugated to it The position, using the adjustment step, can be well maintained as the illumination characteristics of the illumination optical system of the exposure device. In addition, the adjustment method of the exposure device of the 26th item is applied to

The pattern of the curtain is transferred to a photosensitive substrate, and the illumination optical system uses the light from the light source device to illuminate the exposure device of the mask. The method for adjusting the exposure device includes a solid light source arrangement step that will replace the light source device. A solid υ light source is arranged at a predetermined position of the illumination optical system; and an adjusting step, using the configuration of the solid light sources, to adjust the illumination light I / lighting characteristics. Wu Yuquan, Zhizhi: Application for the adjustment method of the exposure device of item 26, although a plurality of solid light sources replacing the light source device are arranged at a predetermined position of the illumination optical system as the illumination of the illumination optical system of the exposure device Characteristics or exposure conditions can be well maintained. 'Also, an exposure method for adjusting the exposure device of the exposure device of item 27 or item 25 or item 26 includes an illumination step of transferring the light from the solid light sources to illuminate the pattern of the mask to the photosensitivity Method for adjusting the exposure device using a patent-regulating method such as' using a mask by an illumination optical system; and a transfer step to transfer the substrate.

200417825 V. Description of the invention (ίο) For the exposure method of item 27, the lighting characteristics of the illumination optical system 'because of the proper adjustment of multiple solid light sources instead of the light device configuration, the pattern of the mask can be well transferred to a photosensitivity Substrate. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is described below in detail with the accompanying drawings as follows: [Embodiment] Please refer to the drawings below The embodiments of the present invention will be described. FIG. I is a schematic diagram of a projection exposure apparatus according to a first embodiment of the present invention. The projection exposure apparatus shown in Fig. 1 has a light source 1 representing a light source made of a high-pressure mercury lamp. This light source 1 is composed of a light-emitting diode (solid-state light source) array of light-emitting diodes arranged in an array, and is arranged at a second focal position of an elliptical mirror 2 having a reflecting surface formed by a rotating elliptical surface. The second focal position at the elliptical mirror 2 is an optical conjugate position at a front focal position (light source side focal position) with a focusing optical system 7 described later. Furthermore, the position of the light source 1 may be arranged near the optical conjugate position of the front focal position (light source side focal position) of the focusing optical system 7. In addition, one light-emitting diode composed of the light source 1 has an output rate of about 0 mW or more, and its dry wavelength is preferably 450 nm or less. 〃 w The light beam from the light source} disposed at the second focal position of the elliptical mirror 2 is converted into approximately parallel light by the alignment lens 3, and then is converted from the optical fly ^ The optical axis of a plurality of lens members having a positive refractive index is flat

12725pif.ptd Page 15 200417825 V. Description of the invention (11) It is closely aligned with the reference optical axis AX in the vertical and horizontal directions. Each lens member constituting the fly-eye lens 4 has a rectangular cross-section similar to the irradiation shape (in other words, the shape of an exposure area on a flat plate) that should be formed on the mask. Also, the incident end surface of each lens member constituting the eyelet lens 4 has a convex spherical shape toward the incident end and a convex spherical shape toward the exit end. Therefore, the wavefront of the light beam incident on the fly-eye lens 4 passes through a lens

The V-member is divided 'to form a light source image on each of the focal planes behind the lens members. That is, it is a substantially planar light source formed by a plurality of light source images on the rear focal plane of the 'fly-eye lens 4, which is a secondary light source formed. The light beam from the secondary light source formed on the side of the fly's eye, 4 rear side focal plane, is incident from (7 aperture 5 incident. Σ aperture 5 is placed incident on the projection optical system pL described later, the surface is approximately optically conjugated The position is used to limit the variable openings required for the illumination of the secondary light source. The σ aperture 5 determines the value of the lighting conditions by changing the opening diameter of the openings (the opening diameter on the pupil surface of the projection optical system is relative to The aperture ratio of the secondary light source image on its pupil plane) is set to a desired value. The light beam from the secondary light source through the σ diaphragm 5 is condensed by the reflection mirror 6 and through a plurality of lenses 7a to 7c. After the light-condensing effect of the optical-optical system 7, the uniform illumination is overlapped with the predetermined pattern '=:'. The projection optical system PL is produced on the ρ of the mask μ on the flat plate of the photosensitive substrate! A light source for light sources composed of Λ? Light emitting diodes (solid light sources) is used to obtain an illuminance of 50 or more. In addition, the "&"; in the plate p (irradiated surface) can be suppressed relative to the illuminance is not 12725pif.ptd page 16 200417825 V. Description of the invention (12) The average value of the average (reference value) of the positive and negative 丨 〇 Within%. Here, the illuminance unevenness 1 (%) relative to the reference value of the flat illuminance, the maximum value of the average value of the illuminance scan on the plate p $ direction (X-axis direction) Imax (W / cm2), said on the plate P The minimum value of the average value of the illuminance scanning direction (X-axis direction) Imiη ^ cm2) is expressed by the following mathematical formula: min)} x 100 (%) {(Imax -Imin) / (Imax The projection exposure device, light source 1, emits illumination light at an output rate lower than the rated output rate. Therefore, the fate of a solid-state light source can be prolonged. Then, in a plane orthogonal to the optical axis of the projection optical system PL; 'Controlled by motion' The secondary light source of the plate P is subjected to full exposure or scanning exposure, and the pattern of the mask M is sequentially exposed in each exposed area of the plate P. Furthermore, the plate P is placed on the plate table PS and is placed on the plate table ps On the top, an illuminance sensor 8 is arranged. In the optical path between the fly-eye lens 4 and the reflecting mirror 6, a spectroscope 9 is arranged, and the light reflected by the spectroscope 9 enters the integration sensor 10. The detection signal from the sensor 10 is output to the control unit n. The 'illumination sensor 8' The detection signal is output to the control unit 11. Here, the relationship between the detection signal of the integration sensor 10 and the exposure illuminance on the flat plate ρ is calculated with high accuracy in advance and stored in the memory in the control unit 丨. The control unit 11 is constituted by a component that can indirectly monitor the exposure illuminance (average value) of the plate P and its integral value (average value of the different exposure amounts) from the detection signal of the integration sensor 〇. This control unit 丨 丨 calculates the exposure to the flat plate ρ from the light of the light source 1 through the integration sensor 丨 0 during the exposure.

200417825 V. Description of the invention (13) Integrated value of illumination. The control unit 11 successively calculates the integrated value of the illuminance, and obtains an appropriate exposure amount on the tablet P according to the result, and controls the output rate of the light source 1. Furthermore, the detection result of the illuminance sensor 8 and the detection result of the integral sensor 10 are displayed on the display section. Next, the manufacturing method of the projection exposure apparatus of FIG. 1 is explained. Fig. 2 shows a flowchart of a method for manufacturing a projection exposure apparatus according to a first embodiment of the present invention. First, the mercury lamp of the projection exposure device having a light source made of a high-pressure mercury lamp is removed (S10). Next, the source 1 composed of the light-emitting diodes (solid-state light sources) arranged in an array is arranged at the second focal position of the elliptical mirror 2 (S11). Here, the second focal point of the elliptical mirror 2 is an optical conjugate position at the focal position on the front side of the focusing optical system 7. Furthermore, the position where the light source 1 is arranged may be near the optical conjugate position of the focal position on the side in front of the condenser optical system 7. Next, the light source 1 composed of a light-emitting diode array representing a light source made of a high-pressure mercury lamp is arranged, and the value for compensating for the poor exposure conditions is not shown in the figure, and is input to the control section through the input section丨 2). That is, the exposure conditions of the exposure device set to an appropriate first state corresponding to the light source formed by the high-pressure mercury lamp, for example, exposure time, exposure amount, etc., are appropriately set to the second state of exposure conditions corresponding to the light source 1. . Next, the adjustment of the divergence angle of the light emitted from the light source 1 is performed (S13). Here, the adjustment of the divergence angle of the light emitted from the light source 1 can be performed by adjusting the light emitted from the light source i and incident on the alignment lens 3. For example, the alignment lens 3 is composed of a plurality of lenses, and a part of the lenses is used on the optical axis Ax

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Directional movement, etc., can be adjusted by adjusting the divergence angle of light emitted from the light source. Further, even if one minute of the light-emitting diodes constituting the light source 1 is inclined, the divergence angle of the light emitted from the light source 丨 can be adjusted. Furthermore, as a plurality of light-emitting diodes constituting the light source 1, even if the most appropriate divergence angle is selected in advance, the divergence angle of the light emitted from the light source 丨 can be adjusted. In addition, a lens ^ row 'may be arranged at the end of the light exit surface of the light source 丨, and the divergence angle of the light may be adjusted by the lens array.

Next, the light distribution of the light emitted from the light source 1 is adjusted (S14). This by the light source! The light distribution of the emitted light can be adjusted by placing a fly-eye array at the end of the light-emitting surface of the light source 1 with the iE, which can be adjusted by the aberration of the fly-eye array. Moreover, it is also possible to adjust by arranging an angular filter at the ends of the individual light emitting surfaces of the plurality of light emitting diodes constituting the light source 1. Furthermore, even if a part of the light-emitting diodes among the plurality of light-emitting diodes constituting the light source 1 is tilted ', the light distribution characteristics of the light emitted from the light source 1 can be adjusted.

Next, the illumination unevenness adjustment on the mask or the plate p is performed (S15). The illumination unevenness is adjusted based on the result detected by the illuminance sensor 8 arranged on the flat plate p. The adjustment of the uneven illumination includes the adjustment of the unevenness of the tilt and the unevenness of the center of symmetry. The adjustment of the unevenness of the tilt to form a part of the lens of the condensing optical system 7 can be performed, for example, by shifting the lens 7b from the optical axis αx 'or tilting it. This can be performed by shifting the alignment lens 3 from the optical axis Ax or tilting it. In addition, “the unevenness is adjusted at the center of symmetry to form a part of the lens of the condensing optical system 7”, for example, the lens 7b can be shifted from the direction of the optical axis ^

12725pif.ptd Page 19 200417825 V. Description of Invention (15).

Next, the telecentricity on the mask M or the tablet p is adjusted (S16). Furthermore, for the adjustment of the telecentricity, a position sensor (not shown in the figure) provided at the lower part of the plate p is moved in the direction of the optical axis of the projection optical system based on the detection result of the imaging position. Here, the adjustment of the telecentricity on the mask μ 戍 plate P includes the adjustment of the tilt telecentricity and the adjustment of the telecentricity of the magnification. Adjusting the fly-eye unit obliquely and telecentrically, that is, the fly-eye array 4 and the diaphragm 5 as a whole, can be performed by moving relative to the optical axis ^, or only occupying the movement of the diaphragm 5 relative to the optical axis AX. In addition, it can be performed by controlling the light amount distribution of the plurality of light emitting diodes constituting the light source 1. In addition, for the adjustment of the telecentricity, the fly-eye unit, that is, the fly-eye array 4 and the 5 aperture 5 as a whole, is performed by moving on the optical axis, or only occupying the movement of the aperture 5 relative to the optical axis AX. By performing the above adjustments, the projection exposure device having the light source 1 is manufactured. '' In this embodiment, regarding the manufacturing method of the projection exposure device, the existing light source of the projection exposure device can be replaced with a lamp with a long life and low operating cost because it uses a metal gas or a rare gas and a lamp. Light-emitting diodes or laser diodes are so-called solid-state light sources.

Therefore, it is possible to provide a projection exposure apparatus having a long life and no cracking light source at a low operating cost. & Next, refer to FIG. 3, which is a schematic diagram of a projection exposure apparatus according to a second example of the present invention. In the description of the second embodiment, the same components of the projection exposure apparatus throughout the embodiment are described using the same symbols as in the first. Only ^ example

200417825 V. Description of the invention (16) The third embodiment is a schematic diagram of the structure of a projection exposure device according to the second embodiment. The projection exposure apparatus shown in FIG. 3 is represented by a light source 1 having a light source made of a high-pressure mercury lamp. This light source 1 is configured by arranging light-emitting diodes (solid light sources) in an array to form a light-emitting diode array, and is placed at a position determined by the front focal position of the condenser optical system 7. The position where the light source 1 is arranged may be near the focal position on the front side of the condensing optical system 7. The light beam emitted from the light source 1 arranged at the front focal position of the condenser optical system 7 is condensed by the reflector 6 by the condenser optical system 7 composed of a plurality of lenses 7a to 7c, and The mask M formed with a predetermined pattern is overlapped and uniformly illuminated. The light beam passing through the pattern of the mask M is used to form an image of the pattern of the mask M on a flat plate P having a photosensitive substrate by the projection optical system PL. In this way, in a plane orthogonal to the optical axis of the projection optical system PL, the flat plate P is controlled by two-dimensional driving to perform full exposure or scanning exposure. Each exposure area of the flat plate P is sequentially exposed in a pattern of the mask M. In addition, the tablet P is placed on a tablet table PS, and an illuminance sensor 8 is arranged on the tablet table PS. In the optical path between the light source 1 and the mirror 6, a beam splitter 9 is arranged. The light reflected by the spectroscope 9 is made incident on the integrating sensor 10. The detection signal from the integration sensor 10 is output to the control unit 11. In accordance with the stored exposure conditions, an output control signal is output in response to the light source 1. The detection result of the illuminance sensor 8 and the detection result of the integral sensor 10 are displayed on the display unit 12. Next, a method for manufacturing the projection exposure apparatus according to the second embodiment will be described. FIG. 4 is a flow chart of the manufacturing method of the projection exposure device according to the first embodiment.

I

12725pif.ptd Page 21 200417825 V. Description of the invention (17) Figure. First, "from a projection exposure device having a light source made of a high-pressure mercury lamp", the light source, the alignment lens, the eye-eye array, and the aperture of the high-pressure mercury lamp are removed (S20), and then the light-emitting diodes are arranged into an array. The light source constituted by a light emitting diode array is arranged at a focal position in front of the condensing optical system 7 (S2 1). Also, configure the light source! The position can also be near the side focus position in front of the system 7.

Next, the adjustment of the divergence angle of the light emitted from the light source 丨 is performed (S23). The adjustment of the divergence angle of the light emitted from the light source 1 can be performed such that the light emitted from the light source 1 is incident on the condenser optical system 7. That is, the plurality of lenses 7a to 7c constituting the condensing optical system 7 are adjusted to move from the light source to the light source and emit the light, and the light divergence angle is adjusted. Of the light emitted from source 1: 丄 as a plurality of light emission constituting the light, the most appropriate divergence angle can be selected. Two = columns can be performed, and the lens divergence angle is adjusted by the lens array;

Next, the light emitted from the light source 1 is performed (S24). For Conggu, shop! The light distribution of the light is adjusted by cloth. The light distribution of the light emitted by the source 1 is determined by arranging a lens with nine blades and adjusting the 4 aberrations. X, in order to construct the second two ^ using the lens array to have a # 出面 诚 —for each of the first light-emitting diodes that constitute the first source 1 to emit first ... the fine adjustment is made by the angled device

200417825 V. Description of the invention (18) Even if the light emitting diodes which are part of the plurality of light emitting diodes constituting the light source 1 are tilted, the light distribution characteristics of the light emitted from the light source 1 can be adjusted. 0 Next, the illumination unevenness of the mask M or the flat panel P is adjusted (S25). Further, the adjustment of the illumination unevenness is performed based on the detection result of the illumination sensor 8 arranged on the tablet ^. This adjustment of illumination unevenness includes adjustment of tilt unevenness and adjustment of center symmetric unevenness. The adjustment of the tilt unevenness can be performed by arranging a filter having a tilted concentration near the end of the light exit surface of the light source. In addition, as a part of the lens constituting the light condensing optical system 7, the lens 7b can be tilted with respect to the optical axis ^ direction :, for example. In addition, it is possible to change the direction of the light-emitting diodes by changing a plurality of light-emitting diodes or poles constituting the light source i. $ Can be performed by tilting all the light sources 1. The second and second ends of the surface: ί The adjustment of the unevenness can be performed by the light emission of the light source 1 and the presence of a concentration distribution (center symmetry) filter near the surface. In addition, a part of the lens constituting the condensing optical system 7 can be performed by shifting a phase, for example. [Can be corrected

: The light on the side of the mask M and the optical oscillating position or its vicinity: The middle is masked into the curtain M. Then, the telecentric adjustment of the mask M or the flat plate p is performed, and the light is set at D τ). Move in the axial direction to perform the telecentric adjustment of the heart 2 fruit tomb 2 on the projection optical system, the mask μ or the flat plate 12725pif.ptd Page 23 200417825 V. Description of the invention (19) Adjustment, including tilt telecentric adjustment and magnification Telecentric adjustment. The adjustment can be performed by moving the light source 1 in the optical axis AX direction. The partial lens of the condenser optical system 7 can be performed by, for example, shifting the lens 7b with respect to the optical axis Ax. Furthermore, a telecentric correction plate or a telecentric lens for correcting the telecentricity may be inserted into an optical path such as a car-sharing position or the vicinity thereof. In addition, the adjustment of the tilt telecentricity can be performed by moving the light source ^ direction. The light emission of the light source is performed by changing its light intensity distribution. Moreover, you can use a telecentric correction plate or a telecentric correction lens. This is the optical path I / Zhuo Mi M π 敕 shared with or near the optical vehicle. Shake your eyes into the 1-inch magic road. With the above adjustment, the projection exposure device of the second embodiment and the projection exposure device provided with the light source 1 can be converted into the light source of the projection exposure device ^ ^ ^ because the metal gas is used to make two, the existing; light can be With a long life and low operation == This can provide a solid-state light source at low operation. The condensing optical system L can be used as a projection exposure device. In order to support a more compact projection exposure device, In the first and second embodiments described above, although the lighting optical characteristics are adjusted, although the value is adjusted, the Λ of the divergence angle of the light emitted from the light source 1 is controlled in advance to apply compensation. The adjustment is based on the adjustment of the light distribution from the first shoulder to the first, and the cover of the river 4 is equal to ρ μ ^ _ Youyouyuan 1 is the first distribution soap M: ¾ The adjustment of the illumination unevenness on the ten plates P, and 12725pif.ptd Page 24 200417825 V. Description of the invention (20) The telecentric adjustment on the mask M or P on the flat plate, but at least one of them can also be used to adjust the lighting characteristics of the illumination optical system. Fig. 5 shows the projection of the third embodiment of the present invention Description of the light device. Regarding the description of the third embodiment, the same components as those of the projection exposure device of the first embodiment will be described with the same symbols as those used in the first embodiment. FIG. 5 shows a third embodiment according to the present invention. Schematic diagram of the projection exposure device of the third embodiment. The projection exposure device shown in FIG. 5 is provided with a light source unit 20, which is composed of a high-pressure mercury lamp. This means that the position of the light source unit 20 is determined by a reflection formed by a rotating elliptical surface. The second focal position of the elliptical mirror 2 on the surface. The second focal position of the elliptical mirror 2 is the same position as the focal position on the front side of the condensing optical system 7 described later. The position of the light source unit 20 may be arranged. It is near the position of the common vehicle in front of the focusing optical system 7. The other points are the same as the projection exposure apparatus of the first embodiment. Second, referring to FIG. 6, the projection of the fourth embodiment of the present invention is performed. Explanation of the exposure device. Regarding the description of the fourth embodiment, the same components as those of the projection exposure device of the first embodiment will be described with the same symbols as those used in the first embodiment. A schematic diagram of a projection exposure apparatus according to a fourth embodiment of the present invention is shown. The projection exposure apparatus shown in FIG. 6 is provided with a light source unit 20 represented by a high-pressure mercury lamp. This means that the position of the light source unit 20 depends on the The focus position on the front side of the light optical system 7. The arrangement position 'of the light source unit 20 may be near the focus position on the front side of the condensing optical system 7. The other points are the same as those of the projection exposure apparatus of the second embodiment.

12725pif.ptd Page 25 200417825 V. Description of the invention The light source unit 20 provided in the projection exposure apparatus of the third embodiment and the fourth embodiment, as shown in FIG. 7A, arrays of light emission are arranged on the substrate 20a ' A light emitting diode array (solid light source array) of a diode 2 Ob and a microlens 20c having a positive magnification are arranged in an array of microlens arrays, and the microlens array is arranged in the light emitting of the light emitting diode array Near by. Regarding the light source unit 20, the direction of the image beam can be adjusted by controlling the number of openings of the light emitting diode array by using a microlens array having a positive magnification, and the divergence angle of light emitted from the light emitting diode 20b. The light source early element 20 can also have a structure as shown in FIG. 7B. The light source unit 20 ′ shown in FIG. 7B is arranged on the substrate 20a, and the light emitting diode array (solid light source array) and the microlens 2Od having negative magnification are arranged in an array on the substrate 20a. The micro-lens array is arranged near the light-emitting surface of the light-emitting diode array. Regarding this light source unit 20, by controlling the number of openings of the light emitting diode array by using a microlens array having a negative magnification, the divergence angle of the light emitted from the light emitting diode 2Ob can be adjusted. The light source unit 20 may have a structure as shown in FIG. 8. The light source unit 20 shown in FIG. 8 includes a light emitting diode array (solid light source array) and an unevenness correction plate (concentration distribution center) on the substrate 20a. The filter and the concentration tilt filter) 20e and the telecentricity correction plate 20f are configured, and the unevenness correction plate 20e and the telecentricity correction plate 20f are arranged near the light emitting surface of the light emitting diode array. The unevenness correction plate and the telecentricity correction plate may be replaced by the unevenness correction lens and the telecentricity correction lens, respectively. The light source unit 20 shown in FIG. 8 is provided with a light passage in the light path.

12725pif.ptd Page 26 200417825

V. Description of the invention (22) The mechanism that passes the unevenness correction plate 20e and the telecentricity correction plate 20f, and uses the unevenness correction plate 20e and the telecentricity correction plate 20f to pass through the optical path to adjust the uneven tilt. , Center symmetry is uneven, inclined telecentric, and magnification telecentric. The adjustment of the tilt unevenness of the illumination optical system can be performed by the tilt of the light source unit 20 as shown in Fig. 9A. In addition, as shown in FIG. 9β, the magnification telecentricity of the illumination optical system can be adjusted by moving the light source unit ^ 20 in the direction of the optical axis. In addition, as shown in Fig. 9C, the phase inclination unevenness of the illumination optical system can be adjusted by moving the light source unit 20 in the optical axis vertical direction. The tilt adjustment of the light source unit 20 and the movement to the optical axis direction or the vertical direction of the optical axis can be performed by using a light source unit position adjustment mechanism (not shown in the figure). Furthermore, the tilting and telecentric adjustment of the illumination optical system can be performed by controlling the light amounts of the plurality of light emitting diodes constituting the solid-state light source array. In the exposure apparatus of each of the above embodiments, the illumination device is used to illuminate the mask (illumination step), and the projection optical system is used to expose the pattern formed on the mask to the photosensitive substrate (exposure step). Manufacture of micro-elements (semiconductor elements), imaging elements, liquid crystal display elements, thin-film electromagnetic heads, etc. In the following, using the exposure device of the embodiment, a semiconductor element manufacturing method for forming a predetermined circuit pattern using a wafer (flat plate) or the like as a photosensitive substrate to obtain a semiconductor element as a micro element is described with reference to the flow chart in FIG. Click on the figure and explain. First, in step S301 in FIG. 10, a metal film is evaporated on a batch of wafers. Next, in step S302, a photoresist is coated on the metal film on one batch of wafers. After that, in step S303, the exposure of this embodiment is used.

12725pif.ptd Page 27 200417825 V. Description of the invention (23) The pattern image of the light device 'on the mask is sequentially exposed and transferred by the projection optical system for each shooting area on the batch of wafers. That is, the mask is illuminated by the illumination optical device (illumination step), and the pattern of the mask is transferred to the wafer (exposure step). After that, in step S304, the photoresist on one batch of wafers is developed, and in step S305, on a batch of wafers, the last name is engraved with the photoresist pattern as a mask. The circuit pattern of the pattern is formed in each imaging region on each wafer. Thereafter, elements such as a semiconductor are manufactured by forming a circuit pattern of a higher-level layout and the like. In the semiconductor device manufacturing method described above, a semiconductor device having an extremely fine circuit pattern can obtain good productivity. Furthermore, in the exposure apparatus shown in Figs. 1, 3, 5, and 6, a predetermined pattern (circuit pattern, electrode pattern, etc.) is formed on a flat plate (glass plate), and a liquid crystal display element can be obtained as a micro element. Hereinafter, a method for manufacturing a liquid crystal display device as a micro device will be described with reference to FIG. In FIG. 11 'in the pattern forming step S40.1, the pattern of the mask is transferred to a photosensitive substrate (a glass substrate coated with a photoresist, etc.) by using the exposure device of the embodiment to perform so-called light micro Film production process. In this photolithography step, a predetermined pattern including a plurality of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to a predetermined pattern formed on the substrate by processes such as a development process, an etching step, and removal of a photoresist, followed by a step S402 of forming a color filter. Next, at the step s 4 0 2 of forming the hair color light sheet, corresponding to the three points of red (R), green (G), and blue (B) as a group, a plurality of matrix-like arrays, or

200417825 V. Description of Invention (24)

Three red, green, and blue stripe filter groups are arranged in a plurality of horizontal scanning directions to form a color filter. Next, after the formation of the color phosphor film S402, the cell combination step S403 is performed. In the cell combination step s403, a liquid crystal plate (liquid crystal cell) such as a substrate having a predetermined pattern obtained in the pattern forming step S401 and a color filter obtained in the color filter forming step S402 is used. combination. In the cell combination step S403, for example, a substrate having a predetermined pattern obtained in the step S401 and the color filter obtained in the step S402 of the Z-sheet formation are injected to manufacture a liquid crystal panel (liquid crystal cell). Sa meat, in the above embodiments, as a solid light source wafer with multiple solid light sources and light emitting points, the wafers are arranged in a plurality of arrays to form a bulk light source wafer array, and it can also be used to integrate multiple light emitting points. Do the type of a substrate. The solid-state light source element may be organic or inorganic. In addition, in the above-mentioned embodiments, as the light source, a solid-state light source and a plurality of light sources (optical fibers) provided corresponding to each solid-state light source may be combined as an optical fiber light source. In this case, the first source 1 of the second and second embodiments may be changed to a fiber light source. 3rd Xiao 4th embodiment: 2. The solid-state light source array (20a, 20b) can be changed to an early source. Fig. 12 shows a solid-state light source 71 and a fiber 72 arranged corresponding to the solid-state light source 71, and an optical fiber light source 69 composed of a plurality of beams. In Figure 12, a light source 69 is shown. The light emitted from the solid-state light source 71 is incident on the fiber end 2 and exits from the exit end of the optical fiber 72. That is, each incident end of the optical fiber 72 is optically coupled to the solid-state light source 71. Also, as shown in Figure U, the solid:

12725pif.ptd Page 29 200417825 V. Description of the invention (25) The source 71, a lens (condensing optical system) 73 and an optical fiber 72 provided for each solid-state light source 71, are combined into a fiber light source 70 by a plurality of beams. In the optical fiber light source 70 in FIG. 13, the light emitted from the solid light source 71 is incident on the lens 7 3, and the light collected by the lens 7 3 is incident on the incident end of the optical fiber 7 2, and is emitted from the exit end of the optical fiber 72. . That is, each incident end of the optical fiber 72 is optically coupled to the solid-state light source 71. As shown in FIG. 12 and FIG. 13, the optical fiber light source 69 and the optical fiber light source 70 shown in FIG. 13 use an optical fiber 72 with an appropriate number of openings, and a beam shape 75 of a generally elliptical solid light source 71 (see FIG. 14A). It may be formed by a circular shape 76 (refer to FIGS. 14B and 14C). In addition, by arbitrarily forming a combination of the exit ends of a plurality of optical fibers, the shape of the exit end of the light source (the exit end arrangement shape) can be formed into the most appropriate shape. For example, Fig. 15A shows that the shape of the exit end from the optical fiber light source may be rectangular, or it may be formed as shown in Fig. 15B. In addition, as shown in FIG. 16, the output ends of the optical fibers of the optical fiber light sources 69 and 70 have a beam shape similar to the shape of the component 81 of one of the fly-eye integrators 80, and it is necessary to form multiple optical output ends. The shape of the part is extremely easy. Next, Fig. 17 shows that a solid light source 71 corresponding to one of the optical fiber light sources 70 of Fig. 13 is provided with a lens (condensing optical system) 73 and an optical fiber 72. In the optical fiber light source 70 in FIG. 13, the number of openings of the light having the largest _ exit angle (the sine of the maximum exit angle (half angle), hereinafter referred to as the number of openings) within the divergence angle of the solid light source 71 is NA1, and the solid The maximum value of the size (diameter) of the light emitting part of the light source 71 is 0, and the sine sinusoid (sin) of the angular range (half angle) that the optical fiber 72 can enter and exit, that is, the number of openings of the optical fiber 72 is NA2, and the optical fiber 72

12725pif.ptd Page 30 200417825 V. Description of the invention The core diameter D of the incident end of (26) satisfies the condition of na2 ^ 0 / D X NA1. By satisfying this condition, the light emitted from the solid-state light source 7 丨 can enter the optical fiber 72 without unnecessary light 'to maintain the light amount of the light emitted from the solid-state light source 71 so that it can be emitted from the exit end of the optical fiber 72. ^ In the case of using a quartz fiber as an optical fiber, the maximum number of openings N A1 of the solid-state light source 71 'is the maximum value of the size (diameter) of the light-emitting portion 0, and the core diameter D of the incident end of the quartz fiber 72 is satisfied. 3-0 / DX, N A1 conditions. By satisfying this condition, the light emitted from the solid-state light source can enter the quartz optical fiber 72 without useless light 'to maintain the amount of light emitted from the solid-state light source so that it can be emitted from the exit end of the optical fiber 72. Fig. 18 is a structural diagram of a fly-eye integrator_80 at the emitting ends of the optical fiber light sources 69 and 70. Fig. 19 shows the shape of the entrance end face of one of the members 81 of the fly eye integrator 80. Fig. 20 is a schematic diagram showing the shapes of the exit ends 83 of the optical fiber light sources 69 and 70. Here, one side of the incident end face of the component 81 of the fly eye integrator 80 is a, and the other side is b. The shape of the exit end 83 of the bundle composed of a plurality of optical fibers 72 is "one side is A and the other side is b", the position between the optical fiber 72 and the fly-eye integrator 80, and the focal distance of the alignment lens 82 is f丨 If the focal distance of the fly-eye integrator 80 is f'2, then the relationship between Αχ f2 / fl and Bx f2 / fl is established. In the case where the optical fiber light source is an optical fiber light source 69, 70 of m group (m is a natural number), the total light output of the light emitted from the optical fiber 72 of the m group is W, and the core diameter of the exit end of the optical fiber 72 Is d, which hopes to satisfy the condition of [mx {d (f2 / fl) p τγ / (4χ ax b)] x w-30 (mW). By satisfying this condition, the light source image of the component 81 corresponding to one of the fly eye integrator 80 is filled.

12725pif.ptd Page 31 200417825 V. Description of the invention (27), it can be in the most appropriate state, and can be used as an exposure device to get a practical photo it ^ 8 η ^ μ ^ «1, the exit end, the shape of the beam and the fly It is desirable that the shape of the component 81 of the ophthalmic device 80 be similar. Light two: the optical fiber light source 69 shown in tTi two and the optical fiber shown in FIG. 13, the minimum value is Pmin, and the maximum light amount of == is ^ A5 ad: the average amount of light at the exit end of the fiber 72 f move; second use then) / (Pmax + Pmin) to calculate S: w / fluctuation of light quantity required at the entrance end of fly eye integrator 80: condition. The number n of the first source 71 is n 'and it is desired to satisfy n ^ (AP / AW) 2 _ light. This condition, the non-uniformity of the light emitted from the exit ends of the optical fiber light sources 69, 70' uses the number η ratio of the solid light source 71 (△ " The averaged effect can provide a stable light output of the second optical fiber light source 69 as shown in FIG. 12 and the optical fiber shown in FIG. 13 / "solid light paste wavelength, light output and other output characteristics Ϊ; Μ 光 ^^ Only a plurality of solid light sources 71 with different output characteristics are used as the light output to uniformly output the light emitting ends of the optical fiber light sources 69 and 70. The optical fiber light sources 69 and 70 are evenly averaged. The exit end of the light is averaged by the "average fly integrator 80" of the averaging source 71. Fig. 21 is a graph showing each solid light ^ special feature unevenness is averaged. The solid-state light source 71 is averaged, and its outline is illustrated. So :, Putian] Rod > A combination of multiple solid-state light sources 71 with different characteristics to form optical fiber light sources 69, 70 can be obtained by the averaging effect. Lighting with stable output

12725pif.ptd Page 32 200417825

In the case where the exposure device is a scanning type exposure device, it is preferable to have a synchronous shutter. The 22nd drawing shows the structure of a scanning exposure apparatus according to the present invention. This exposure device has a synchronous shutter (movable shutter mechanism) 90, which is a scanning exposure device that transfers the pattern of the mask to the plate p while moving the mask stage and the substrate stage relative to the optical projection system. Otherwise, it has the same structure as the exposure apparatus of the first embodiment.

As shown in FIG. 22, a fixed shutter BL0 and a movable shutter mechanism 90 are arranged near the mask M. As shown in FIG. 23, this movable shutter mechanism is made up of four movable shutters BL1, BL2, BL3, and BL4. The width of the opening Ap in the scanning exposure direction is determined by the edges of the movable shutters BL1 and BL2. The length of the opening Ap in the scanning exposure direction is determined by the edges of the movable shutters BL3 and BL4. Also, "the shape of the opening AP is defined by the edges of the four movable shutters BL1 to BL4" may be included in the circular image field F of the projection lens pl.

Illumination light passing through the opening Ap of the fixed shutter BL0 and the opening Ap of the movable shutter mechanism 90 irradiates the mask M. Finally, the opening M formed by each of the movable shutters BL1 to the bucket is overlapped with the opening of the fixed shutter to illuminate the curtain M. In the normally exposed state, the image of the opening of the fixed shutter is imaged on the pattern surface of the mask M. In the case where the periphery of a specific scanning exposure area of the mask M is exposed in the vicinity of the light-shielding portion, four images are used. The movable shutters BU to BL4 prevent the illumination light from entering the outside of the light shielding portion. That is, when scanning the mask stage, the relationship between the relative position of the light beam emitted from the illumination optical system and the mask M is monitored. Based on this monitoring information,

12725pif.ptd Page 33 200417825 V. Description of the invention (29) When the exposure of the special scanning exposure area on the mask M starts or ends, move the movable shutter when it is judged that the exposure starts in the area near the light-shielding part. The edge positions of BL1 and BL2 are to control the width of the opening AP in the scanning exposure direction. In this way, it is possible to prevent unnecessary patterns and the like from being transferred to the flat plate. Also, in this exposure device, a movable shutter mechanism may be provided at a position other than the position conjugated to the mask M or in the vicinity thereof. The exposure device may be provided with an antistatic device. FIG. 24 is a schematic structural diagram of an exposure device having a charging prevention device. Otherwise, it is the same as the exposure apparatus of the first embodiment. With respect to this exposure device, a frame body 92 accommodating a light source is separately provided, and a frame body 93 accommodating an illumination optical system and a projection optical system. The frame body 92 is electrically connected to the frame body 93 and can be grounded. That is, the frame body 9 'and the frame body 93 are held at the same potential. Further, a power source section 94 for supplying light source power and a power source section 95 for supplying power to the exposure apparatus main body are respectively provided, and one ends thereof are grounded. Therefore, it is possible to prevent the light source of the exposure device and the body of the exposure device from being electrostatically charged, and to prevent the solid light source from being damaged by static electricity. In addition, in the alternative masks of the above embodiments, a variable pattern generating device may be used to generate a pattern to be projected. Such a variable pattern generating device can be generally classified into a self-emission type image display device and a non-emission type image display device. Self-luminous image display elements are, for example, cathode ray tubes (CRT), inorganic light emitting displays, organic light emitting displays (OLEDs), LED displays, LD (laser diode, LD) displays, and% emission displays (field emission display (FED), plasma diplay panel (PDP), etc. Non-light emitting type

200417825 V. Description of the invention (30) The image display element is, for example, a spatial light modulator (hereinafter referred to as SLM), an element that spatially modulates the light amplitude phase or the state of polarized light, and a transmissive spatial light modulator , And reflective spatial light modulator. For transmissive spatial light modulators such as deformable micro-mirror device DMD, or digital micro-mirror device, mirror array, reflective liquid crystal display element, electrophoretic display (Electr〇Ph〇retic

Display), electronic paper (or electronic ink), grating valve (Grating 1 ight valve), etc. Regarding the manufacturing method of the exposure device of the present invention, when a light source different from a plurality of solid light sources, for example, a light source composed of a mercury lamp is replaced with a solid light source, the adjustment steps correspond to those different from the solid light sources. The characteristics of the illumination optical system in which the light source is set to an appropriate first state are set to the characteristics in an appropriate second state by the arrangement of the solid light sources. The method can manufacture an exposure device including an illumination optical system having appropriate characteristics of a plurality of solid-state light sources. Furthermore, regarding the light source unit of the present invention, for a light source having a lighting device different from the solid light source array, for example, a light source constituted by a mercury lamp is set to an appropriate characteristic of the lighting device in the first state. It is arranged and set to the appropriate second state characteristics, which can provide the emitted light with a divergence angle or a light distribution. Regarding the exposure method of the present invention, the special feature of the illumination optical system in which a light source different from a plurality of solid-state light sources is set to an appropriate first state is set because it uses an arrangement of some solid-state light sources. of

12725pif.ptd

Page 35 200417825 V. Description of the invention (31) The exposure device with the second characteristic, the pattern of the mask can be well transferred to the photosensitive substrate. In the "exposure device of the present invention", the light source unit is different from a plurality of solid-state light source arrays in the lighting device. For example, for a light source composed of a mercury lamp, the characteristics of the lighting device set to an appropriate first state are determined by The arrangement of these solid-state light sources is set to an exposure device with appropriate characteristics in the second state, and the pattern of the mask is transferred to the photosensitive substrate in a good manner. Regarding the adjustment method of the exposure device of the present invention, in the case where a plurality of solid-state light sources instead of the light source device are arranged at predetermined positions of the illumination optical system, the illumination characteristics of the illumination optical system can be adjusted by the adjustment step.

12725pif.ptd Page 36 200417825 Brief Description of Drawings Figure 1 is a schematic diagram of a projection exposure apparatus according to a first embodiment of the present invention. Fig. 2 shows a flowchart of a method for manufacturing a projection exposure apparatus according to a first embodiment of the present invention. FIG. 3 is a schematic diagram of a projection exposure apparatus according to a second embodiment of the present invention. FIG. 4 is a flowchart of a manufacturing method of a projection exposure apparatus according to a second embodiment of the present invention. _ Figure 5 is a schematic diagram of a projection exposure apparatus according to a third embodiment of the present invention. FIG. 6 is a schematic diagram of a projection exposure apparatus according to a fourth embodiment of the present invention. 7A to 7B are explanatory diagrams of a light source unit according to the present invention. FIG. 8 is an explanatory diagram of a light source unit according to the present invention. 9A to 9C are explanatory diagrams of a light source unit according to the present invention. FIG. 10 shows a flowchart of a micro-device manufacturing method according to the present invention. FIG. 11 is a flowchart of a micro-device manufacturing method according to the present invention. FIG. 12 is a schematic structural diagram of an optical fiber light source according to the present invention. FIG. 13 is a schematic structural diagram of another optical fiber light source according to the present invention. Figures 14A to 14C are schematic diagrams illustrating the shape of the outer edge of a light beam emitted from a light source according to the present invention. Figures 15A to 15B are schematic diagrams showing the shape of the exit end from the optical fiber light source according to the present invention. The 16th edge shows the shape and fly of the exit end from the optical fiber light source according to the present invention.

12725pif.ptd p. 37 200417825

The schematic diagram of the shape of the components of the eye integrator is similar. The seventeenth is a schematic diagram for explaining the conditions for introducing optical fibers to the optical fiber light source from the solid light source according to the present invention. Eight tears f = shows a schematic structural diagram of the exit end of the '⑼ fiber optic light source to the fly eye integrator according to the present invention. s section shows the shape of a component of one of the rope eye integrators according to the present invention. Fig. 20 is a schematic diagram showing the shape of the exit end of the optical fiber light source according to the present invention. Fig. 21 is a schematic diagram showing the state of the wheel homogenization of each solid light source according to the present invention. Statistical contention

Schematic diagram of the structure. Set, the design has 4 available

Fig. 22 shows a scanning type exposure device according to the present invention. Fig. 23 shows a schematic structure view of a scanning type exposure shutter according to the present invention. An exposure device for preventing charging from being placed is shown in Figure 24 according to the present invention. [Schematic mark description] 1: Light source

Elliptical mirror Alignment lens Aperture Condensing optical system Lens Illumination sensor

200417825 Brief description of the drawing 10: Integral sensor 11: Control section 12: Display section 20: Light source unit 2 0a: Substrate 20b: Light emitting diode 20c, 20d: Micro lens 2 0e: Unevenness correction plate 20f: Telecentric Correction plate 69 > 70: Optical fiber light source 71: Solid-state light source 72: Optical fiber 73: Lens 80: Fly-eye integrator 82: Alignment lens 92 > 93: Frame 94, 95 · Power supply section M: Cover, P : Flat PL: Projection Optics

12725pif.ptd Page 39

Claims (1)

200417825 VI. Scope of patent application --- Light and 1 is a manufacturing method of an exposure device 'For the use of an illumination optical system with a light-concentrating system ^ f system to illuminate a mask, Figure 8 of the mask Division P—a photosensitive substrate. The manufacturing method of the exposure device includes: ^ a solid light source disposing step, arranging a plurality of solid light sources at a front focal position of the condensing light drying system or a position of an optical conjugate with the solid light source; And ^, an adjustment step, corresponding to the characteristics of the illumination optical system in which a light source different from the solid light sources is set to an appropriate first state, and is set to an appropriate second by the configuration of the solid light sources State characteristics. 2. The manufacturing method of the exposure device according to item 1 of the patent application, wherein the salty illumination optical system includes an optical integrator in an optical path between the solid light sources and the condensing optical system. 3. A manufacturing method of an exposure device, which uses an illumination optical system to illuminate a mask, and transfers a pattern of the mask to a photosensitive substrate. The manufacturing method of the exposure device includes: a solid light source arrangement step, Arranging a plurality of solid-state light sources at positions determined by the illumination optical system; and An adjustment step corresponds to the characteristics of the illumination optical system corresponding to a light source different from the solid light sources being set to an appropriate first state, and the properties of the second light state are set to be appropriate by the arrangement of the solid light sources. 4. The method for manufacturing an exposure device according to item 3 of the scope of the patent application, wherein the adjusting step includes: using an uneven illumination adjustment step to adjust the uneven illumination on the mask or the photosensitive substrate, and A telecentric adjustment step to adjust at least one of the telecentricity of the mask or the photosensitive substrate 12725pif.ptd Page 40 200417825 Six, apply for patents to adjust. 5. The manufacturing method of the exposure device according to item 3 of the scope of patent application, wherein the adjusting step includes: using a divergence angle of adjusting a divergence angle of at least one of the plurality of light beams emitted from the solid light sources. The adjusting step is a step of adjusting at least one of a light distribution distribution adjusting step of at least one of the light distribution distributions of the plurality of light beams emitted from the solid light sources. 6. The manufacturing method of the exposure device according to item 3 of the scope of patent application, wherein the adjustment step includes: using an illumination characteristic adjustment step for adjusting the illumination characteristics of the illumination optical system, and adjusting the distance from the solid light sources. One of the emitted light is an emitted light adjustment step. 7. The manufacturing method of the exposure device according to item 6 of the patent application scope, wherein: the illumination characteristic adjustment step utilizes an illumination unevenness adjustment step to adjust the unevenness of illumination on the mask or the photosensitive substrate, and a telecentricity An adjusting step for adjusting at least one of the telecentricity of the mask or the photosensitive substrate; and an outgoing light adjusting step for adjusting a divergence angle of at least one of a plurality of light beams emitted from the solid light sources A step of adjusting a divergence angle, and a step of adjusting at least one of a light distribution distribution adjustment step of at least one of a plurality of light beams emitted from the solid light sources. 8. A method of manufacturing an exposure device, which uses an illumination optical system including a light-concentrating optical system to illuminate a mask, and maps the mask 12725pif.ptd Page 41 200417825 6. The scope of the patent application is transferred to a photosensitive substrate. The manufacturing method of the exposure device includes a solid light source arrangement step. A plurality of solid light sources are arranged on the front side of one of the condensing optical systems. The focal position or one of the optical vehicles and the adjustment step correspond to the exposure conditions of the exposure device in which the light source different from the solid light sources is set to an appropriate first state, and the configuration of the solid light sources An exposure device set to an appropriate second state is provided. A method of manufacturing an exposure device that uses an illumination optical system to illuminate a mask and transfers the pattern of the mask to a photosensitive substrate. The manufacturing method of the device includes: a solid-state light source arrangement step of arranging a plurality of solid-state light sources at predetermined positions of the illumination optical system; and an adjustment step in which light sources different from the solid-state light sources are set to an appropriate first light source. The exposure conditions of the exposure device in the 1 state are set to an appropriate exposure bar in the second state by the arrangement of the solid light sources. . 10. The method of manufacturing an exposure device as claimed in claim 8 or 9, wherein the adjusting step includes a step of applying a compensation value to a control device that controls an exposure amount included in the exposure condition. 11. The manufacturing method of the exposure device according to item 8 or 9 of the scope of the patent application, wherein the adjusting step includes adjusting one of the lighting characteristics of the lighting optical system, and adjusting the light output from the solid light sources. At least one of the emitted light adjustment steps. 12. The method for manufacturing an exposure device according to any one of claims 1 to 3, 8 to 9, in which the solid-state light sources include light-emitting diode arrays. 200417825 VI. The scope of the patent application includes that the light * unit can be disassembled and installed ... Multi-photograph: a solid light arrayed by a solid light source and the light emitting end of the academic element ^ ㈣n body light source array is an array of light The light source is different from the solid light source array, and is set to the characteristics of the lighting device. By using the solid light sources, the characteristics of the light source are set to an appropriate second state, corresponding to the lighting device k. Emitted light with divergence angle and light distribution. 14. The light source unit according to item 13 of the patent application range, wherein the solid light source array and the optical element can be arranged in an elliptical mirror that collects light from the light source lamp and an optical integrator in the lighting device. In the light path. 15. The light source unit according to item 13 or 14 of the scope of patent application, including the adjusting device for adjusting the light emission characteristics of the solid-state light source array. 16. The light source unit according to item 13 or 14 of the scope of patent application, further comprising a plurality of optical fibers, and each incident end of the optical fibers is connected to the solid light sources. 17. A light source unit, comprising: a solid light source array in which a plurality of solid light sources are arranged in an array; and an adjusting device for adjusting a light emitting characteristic of the solid light source array. 18. The light source unit according to item 17 of the scope of patent application, wherein the adjusting device can adjust the divergence angle of the light emitted from the solid-state light source array, the light distribution of the light emitted from the solid-state light source array, and the area to be illuminated. At least one of uneven illumination and telecentricity. 12725pif.ptd Page 43 200417825 6. Scope of patent application 19. For example, the light source unit of the patent application scope item or 18 includes a plurality of optical fibers, and each incident end of the optical fibers is connected to the solid light sources. 20. An exposure method suitable for an exposure device manufactured by the method of manufacturing an exposure device according to any one of claims 3, 8 to 9 of the scope of patent application, comprising: using light from the solid light sources to illuminate the A step of lighting the mask; and a step of transferring the pattern of the mask to the photosensitive substrate. 21. The exposure method as claimed in claim 20, wherein the transferring step includes using a projection optical system that projects a pattern image of the mask onto the photosensitive substrate, and transfers the pattern of the mask to the photosensitive Step of a flexible substrate. 22. An exposure device comprising: a light source unit such as any one of claims 13 to 14, 17 to 18 of the declared patent scope; and μ illuminating the light from the light in order to expose the pattern of the mask to the photosensitive substrate unit One of the lighting devices of the curtain. No. 29. The exposure device according to item 22 of the patent scope further includes a projection optical system that projects the image f of the mask onto a photosensitive substrate.腺 # 2 梦 4 · 司 一 ί The light exposure method is used in the exposure device such as the 22nd patent application scope, and the exposure method includes: and ', month V, using the light from the light source unit to illuminate the mask In step P, the pattern of the mask is transferred to the sensitive substrate. 200417825 VI. Application for Patent Scope 25. A method for adjusting an exposure device is used to transfer a pattern of a curtain to a photosensitive substrate. By using an illumination optical system including a condenser optical system, The method for adjusting an exposure device for illuminating the mask includes: a solid light source disposing step of disposing a plurality of solid light sources replacing the light source device at a focal position in front of the focusing optical system or an optical conjugate position thereof; And an adjusting step, using the configuration of the solid light sources to adjust the illumination characteristics of the illumination optical system. 26 · —An adjusting method of an exposure device, in order to transfer a pattern of a mask to a photosensitive substrate, by an illumination optical system, using the light from a light source device to illuminate the exposure device of the mask, the method includes: : A solid-state light source configuration step, in which a plurality of solid-state light sources replacing the light source device are arranged at predetermined positions of the illumination optical system; and an adjustment step, using the configuration of the solid-state light sources, to adjust the lighting characteristics of the Zhaoming optical system. ",, B1 · A method of adjusting the exposure device of 26 exposure methods, including: 'Exposure system for the exposure device using the exposure device adjusted as described in Patent Application No. 25 or Method 嗍 Optical System» ...-,, 8% of the source of light to illuminate the mask; and 28 turns 2 Π: transfer the pattern of the mask to the photosensitive substrate.. + Adjustment method of the light device for the illumination optical system including the system; ：： The law first learns ..., the curtain is exposed, and the pattern of the curtain is transferred to Page 45 200417825 VI. Patent application scope A method for adjusting an exposure device of a photosensitive substrate, comprising: a solid light source disposing step of disposing a plurality of solid light sources at a focal position or an optical conjugate position of a front side of the condensing optical system; and An adjusting step, corresponding to the exposure conditions of the exposure device in which a light source different from the solid light sources is set to an appropriate first state, and the arrangement of the solid light sources is set to an appropriate second state of exposure conditions . 2 9 · An adjustment method of an exposure device for an illumination optical system to illuminate a mask 'an adjustment method of an exposure device that transfers the pattern of the mask to a photosensitive substrate, comprising: a solid-state light source configuration step' Solid-state light sources are arranged at positions determined by the illumination_optical system; and an adjustment step corresponding to the exposure conditions of the exposure device in which a light source different from the solid-state light sources is set to an appropriate first state, by the solid-state The arrangement of the light sources is set to an appropriate exposure condition in the second state. 30. The adjusting method of the exposure device according to the 28th or 29th of the scope of patent application ', wherein the adjusting step includes a step of applying a compensation value to a control device that controls the exposure amount. 31. The method for adjusting an exposure device according to item 28 or 29 of the scope of patent application, wherein the adjusting step includes one of adjusting an illumination characteristic of the illumination optical system, and one of adjusting light emitted from the solid light sources. At least one of the emitted light adjustment steps. 32 · —An exposure device comprising: an exposure device manufactured in accordance with a method for manufacturing an exposure device according to any one of the scope of application for patents Nos. 3 to 8 to 9. One 12725pif.ptd Page 46 200417825 VI. Patent Application Range 33. An exposure device, including: Manufactured in accordance with the adjustment method of any one of the exposure devices in the patent application scope No. 25, 26, 28, 29 Exposure device. _ Φ 12725pif.ptd Page 47