200418355 玖、發明說明： [發明所屬之技術領域] 本發明係關於軟性配線電路基板之製造方法。 [先别技術] 以往’將於厚度2 5 // m以下之聚醢亞胺基膜之單面所 積層之厚度35 // m以下的銅箔以減成法來圖案化做出配線 電路而得到之軟性配線電路基板係被廣泛使用。 以輥對親方式來製造前述軟性配線電路基板之方法方 面’已提出將銅面積層板以受光照射時黏著性會降低之黏 著劑來黏著於載膜（carrier film)上之方法（參見專利文獻夏 :特開平7-99379號公報）。 於該製造方法中，係將聚醯亞胺基膜上黏著有 構造的銅面積層板，以其聚醯亞胺基臈側表面來貼合至塗 佈有受光照射時黏著性會降低之黏著劑的載膜上，於銅面 $層板之銅箱形成配線電路之後，自載膜側照射紫外線使 '寻钻著d硬化來降低其黏著力，自黏著劑與聚醯亞胺基膜 之界面將載膜剝離去除’藉以得到軟性配線電路基板。 依據前述製造方法，由於銅面積層板保持於載帶上， 乃可抑制配線電路形成加工時折彎或敞摺的發生，又，由 ^可降低黏著劑之黏著力，所以即使在载膜剝離時也可抑 制捲曲或折彎的發生。 在軟性配線 下’若依據 ，一旦配線 ; .....〜w饵/s 電路基板之薄膜化與高密度化持續進行之 使用載帶之前述專利文獻丨所揭示之製马 電路之圖案間距在40心以下，則 形或凹凸影響所致之圖案化精度 表面受 卞、问題。又，夫六士 著因來自载帶兩端裁斷面之切屑或於裁斷面 劑等而容易發生圖案不良之問題。 出之黏者 又’於貫施專利文獻！所揭示之製造方法之際 ‘必須使用輕之送捲機、捲取機’故難以滿足設備小型化之 要求，附帶設備之運轉成本也高，又，由於進 操作，條件設定時間以及回捲時間等變長，製造前置^ 也會變長，此乃問題所在。 又，當銅猪之圖案化之後視情況對鋼面積層板進行切 除加工的情況下’由於採用金屬模具切除加工法，或在裁 斷面端部出現毛邊、或是軟性配線電路基板本身發生變形 ’這些都是問題。又’針對每個具有不同配線電路之軟性 I線基板都必須製作昂貴的金屬模具’所以無法控制切除 加工成本，此為問題所在。 為了解決此問題，雖考慮採用可藉由程式變更而輕易 製作出各種切除圖案之雷射切割法，⑮雷射加工法會同時 將載帶裁斷，所以無法將軟性配線電路基板保持於載帶上 ，刼作性大幅降低，不良品發生率也高，此為問題所在。 本發明係用以解決上述以往技術的問題所產生者，其 目的在於提供一種軟性配線電路基板之製造方法，即使面 對軟性配線電路基板之圖案間距非常小的情況，圖案化精 度也不會降低，不易發生圖案不良情形，製造設備之小型 化也相對容易，可相對縮短前置時間，且能以雷射切割法 200418355 來實施切除加工。 [發明内容] 本發明為了避免使用輥對輥方式而能以單片式㈦叩“ due)來製造軟性配線電路基板，乃取代載帶改用平面性優 異之玻璃基板或丙烯酸基板等之透明硬質基板，且利用受 I外線…、射打黏著力會降低之黏著劑層，將在絕緣支持膜 上形成有導體層之積層體以絕緣支持膜側黏著於該透明硬 質基板上，於導體層之圖案化後，使得黏著劑層之黏著力 降低而自透明硬質基板將積層體剝離，或是在透明硬質基 板上直接以聚醯亞胺先驅體系黏著劑層來貼合導體層，在 該導體層之圖案化前或後將聚醯亞胺先驅體系黏著劑層醯 亞胺化，藉此做成絕緣性之聚醯亞胺支持膜且使得其黏著 力降低，之後自透明硬質基板將聚醯亞胺支持膜剝離；藉 由此種方式，可達成上述目的，從而完成了本發明。 基於前述見解之第丨發明係一種軟性配線電路基板之 製造方法，係用以製造於絕緣支持膜上形成有配線電路之 軟性配線電路基板，具有下述製程0)〜(d): (a) 利用黏著劑層，將在絕緣支持膜上形成有導體層之 積層體自其絕緣支持膜側貼合於透明硬質基板之製程； (b) 將該積層體之導體層圖案化以形成配線電路基板之 製程； (c) 使得該黏著劑層之黏著力降低之製程；以及 (d) 將形成有配線電路之積層體，以黏著劑層殘存於透 明硬質基板側的方式自透明硬質基板剝離之製程。 200418355 又’第2發明係一種軟性配線電路基板之製造方法， 係用以製造於絕緣性聚醯亞胺支持膜上形成有配線電路之 軟性配線電路基板，具有下述製程（aa)〜(dd) ·· (aa)於透明硬質基板上，透過聚醯亞胺先驅體系黏著 劑層來積層導體層之製程； (bb)將該導體層圖案化以形成配線電路之製程； (cc)將該聚醯亞胺先驅體系黏著劑層醯亞胺化來做成 絕緣性聚醯亞胺支持膜之製程；以及 (dd)將形成有配線電路之聚醯亞胺支持膜自透明硬質 基板剝離之製程。 又於弟1本發明中，當以雷射切割法來實施切除加 工的情況下，以於製程⑻與製程⑷之間或是製程⑷與製 程⑷之間進-步具備製程⑷：對於形成有配線電路之積層 體以雷射切割法來進行切除加工之製程為佳。 同樣地’於第2本發明中’以於製程（bb)與製程（cc)之 間或是製程（ee)與製程_之間進—步具備製程（叫：對於 形成有聚醯亞胺支持膜之積層體以雷射切割法來進行切除 加工之製程為佳。 以下一邊參照圖式一邊對本發明之在絕緣支持膜上 成有配線電路之軟性配線電路基板之製造方法的實施布 做詳細說明。 第1發明之例可參照第丨圖⑷〜⑷對每個製程做說明 200418355 首先，如第1圖（a)所示般，利用黏著劑層4將絕緣支 持膜1上形成有導體層2之積層體3以其絕緣支持膜丨側 貼合於基板G上。此時，具體上係藉由周知的做法、例如 旋塗法將黏著劑塗佈於透明硬質基板G上，進行乾燥來形 成黏著劑層4,使用橡膠輥等自積層體3之絕緣支持膜\ 側將積層體抵壓於黏著劑層4上來進行貼合。 此處，在透明硬質基板G方面，可舉出丙烯酸基板、 玻璃基板等，但以使用平坦性更優異、且耐熱性也優異之 玻璃基板為佳。又，黏著劑層4亦可於透明硬質基板G之 其中一整面上形成。 此製程（a)之重要特徵在於將平坦性優異之透明硬質基 板G以單片式來使用之事’以及所使用之黏著劑層4雖在 圖案化製程等加工中對於絕緣支持膜1與透明硬質基板G 保持良好之密合性，但—旦施行特定處理（例如紫外線照射 處理、加熱處理、冷卻處理、超音波照射處理、電子束照 射處理等），則黏著劑層4相對於絕緣支持膜i之密合性相 較於黏著劑層4相對於透明硬質基板G之密合性會大幅降 低之事。 依據本實施形態，由於以單片式使用平坦性優異之透 明硬質基G’所以即使軟性配線電路基板之圖案間距非 常的小’圖案化精度也不致降低，不易發生圖案不良，製 造：備之小型化也相對容易，能相對地縮短前置時間。又 ’藉由使用-旦被施行紫外線照射處理等之處理則相對於 200418355 、、巴、、象支持膜1之密合性相較於相對於透明硬質基板G之密 合性會降低黏著劑^ 4，則於導體& 2之圖案化之際，可 確’、地將積層豸3保持於透明硬質基板G上，且圖案化後 可輕易地將積層體3自透明硬質基板G做分離。 々本务月中’在絕緣支持膜1方面可使用與以往銅面 積層板之、、、邑、、彖基膜為相同者，例如可適宜地使用聚醯亞胺 膜。1巴緣支持冑1之厚度並無特別限定，通常在50 " m以 下、較佳為20〜25// m。 在導體層2方面可適宜地使用電解銅箔、sus3〇4鲁 々 4、銘箔、鈹箔、鱗青銅箔等。又，亦可適 =使用銅-鎳合金電链層等。導體層2之厚度並無特別限 疋，通常為35#m以下、較佳為8〜12//m。 乡透明硬質基板G之厚度若過薄則容易受外部應力之影 f而變形或破壞，製造時之作業性會降低，若過厚則重量 文重，對於製造設備之負荷會增加，設備安定性會降低， 所以較佳為lOmm〜5.〇mm、更佳為1.5mm〜2.5mm。 若透明硬質基板G之厚度差異（平坦度1:以_ TTV(Total Thickness Valuation)法所測定之結果）過大，則 進订細微圖案曝光之時，對焦變得困難，有發生圖案不良 之可肖b ’所以厚度差異以控制在〇 〇2mm以下為佳。 ^此處，TTV法係對於測定對象物整體表面粗度進行測 疋之方法，係表示將測定對象物吸附固定之際所測定之粗 度的最大值一最小值之差。 又，若透明硬質基板G之板彎（平坦度2 :以 11 200418355 LTV(L〇Cal Thickness Valuati〇n)法所測定之結果）過大則 =後述製程⑻之導體層2之圖案化之際之曝光時，透明硬 貝基板G難以真空夾來固定，有 另」此叙生圖案不良，所以· 控制在0 · 1 mm以下為佳。 此處，LTV法係對測定對象物之表面粗度進行部份測 定之方法’表示將測定對象物吸附固定之際於既定領域（例 如心爪川賴口）所測定之粗度的最大值—最小值之差。 為了使得後述製程（c)中之做為黏著劑層4之紫外 線硬化型接著劑能硬化，在透明硬f基板G之材質方面， 以使用當自透明硬質基板照射紫外線時能使得紫外線 硬化型黏著劑充分硬化之具有紫外線穿透性質者為佳。 此處’透明硬質基板G之紫外線穿透率^過低則欲使 得紫外線硬化型黏著劑4硬化所需照 照射量不得不增高，作業效率會顯著降低，；二= 在30%(於250〜45〇nm之波長區域中使用紫外線分光光度 計時的測定結果）為佳。 在黏著劑層4方面可舉出紫外線硬化型黏著劑層、熱 ?生黏著劑層#’從實現良好之熱安定性之觀點考量，以 紫外線硬化型黏著劑層為特佳。 做為此種紫外線硬化難著㈣，係使 ㈣某種程度之接著強度、而經紫外線照射硬化卜;= :力降低者。此時’相對於積層冑3之絕緣支持膜i的接 著力（剝離強度）必須較相對於透明硬質基板G之接著力（剝 離強度）來得小。 12 200418355 ,在紫外線硬化型黏著劑層方面，以使用由紫外線照射 刚之仞期剝離強度（JIS &6854)為3N/cm以上、經紫外線照 射後之剝離強度成為1N/cm以下之紫外線硬化型黏著劑所 形成之薄膜為佳。此時，在紫外線硬化型黏著劑方面可使 用光自由基聚合類型之丙烯酸系紫外線硬化型黏著劑等。 /、人如第1圖（b)所示般，將積層體3之導體層利用 凊如通常之光微影技術來圖案化而形成配線電路h。此時 二體上可於導體層2上將感光性光阻膜以其本身之黏著 力來進行貼合，透過未圖示之圖案化用光罩進行曝光:顯 像’形成導體^ 2之蝕刻用光阻圖案之後，將導體層2蝕 刻來圖案化，之後去除感光性光阻圖案來形成配線電路“ 〇 發明中，配線電路2a可於積層體3之絕緣支持膜 =形成-個，不過通常係形成複數個。若形成複數個配 線電路2a，則如後述般，利用切除加工來分出數個軟性配 線電路基板。 製程〔C) 其次，使得黏著劑層4之黏荽六p夂加 y <縣者力降低。例如，若黏著 劑層4使用紫外線硬化型黏著 一 $ d嘈的匱况下，如第1圖（c) 所示般，自透明硬質基板G側昭射呰冰綠ττ W α射糸外線UV，使得紫外 線硬化型黏著劑層硬化，以對 ” 6塚克持膑1之密合強彦 較對於透明硬質基板G之密合 強度為低的方式使其黏著力 降低。 13 200418355 於本發明中’做為使得黏著劑層4之黏著力降低之其 他方法，可舉出藉由降低環境溫度以使得黏著劑層4之溫 度較貼合時之溫度為低者。藉此，黏著劑層4會變硬而使 得黏著力降低。 製程（d) 其次，如第1圖（d)所示般，將形成有配線電路2a之 積層體3,以經過硬化而黏著力已降低之黏著劑層4殘存200418355 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a flexible printed circuit board. [Another technique] In the past, a copper foil with a thickness of 35 // m or less on a single side of a polyimide-based film having a thickness of 2 5 // m or less was patterned to make a wiring circuit by subtractive method. The obtained flexible printed circuit board is widely used. For the method of manufacturing the aforementioned flexible printed circuit board by a roller-to-roller method, a method has been proposed in which a copper-area laminate is adhered to a carrier film with an adhesive that decreases in adhesion when exposed to light (see Patent Literature) Xia: Japanese Unexamined Patent Publication No. 7-99379). In this manufacturing method, a structured copper area laminate is adhered to a polyimide-based film, and the polyimide-based side surface of the polyimide-based film is adhered to a coating that is reduced in adhesion when exposed to light. On the carrier film of the adhesive, after forming a wiring circuit on the copper box of the copper surface layer, the ultraviolet light is irradiated from the side of the carrier film to harden the “drilling hole” to reduce its adhesion. The carrier film is peeled off and removed at the interface to obtain a flexible printed circuit board. According to the aforementioned manufacturing method, since the copper area laminate is held on the carrier tape, it can suppress the occurrence of bending or opening during the formation of the wiring circuit, and the adhesive force of the adhesive can be reduced by ^, so even when the carrier film is peeled off It can also suppress curling or bending. Under the flexible wiring, if the basis, once the wiring; ..... ~ w bait / s film thickness and high density of the circuit substrate continue to use the carrier tape of the aforementioned patent document 丨 disclosed pattern spacing Below 40 cores, the patterning accuracy surface caused by shape or unevenness suffers from problems and problems. In addition, the husband and her husband are prone to problems with defective patterns due to chips from the cutting surfaces at both ends of the carrier tape, or cutting agents. Out of the sticky again ’Yu Guanshi patent documents! In the disclosed manufacturing method, 'light rewinding and rewinding machines must be used', so it is difficult to meet the requirements for miniaturization of equipment, and the operating cost of incidental equipment is also high. In addition, due to the advance operation, condition setting time and rewinding time When it becomes longer, the manufacturing ^ will also become longer, which is the problem. In addition, when the copper pig is patterned and the steel area laminate is removed as appropriate after the patterning, 'the use of a metal mold removal process, or the occurrence of burrs at the end of the cutting surface, or the deformation of the flexible wiring circuit board itself' These are questions. It is also necessary to make expensive metal molds for each flexible I-line substrate with different wiring circuits. Therefore, it is impossible to control the cutting processing cost, which is a problem. In order to solve this problem, although a laser cutting method that can easily make various cut patterns by program change is considered, the laser processing method will cut the carrier tape at the same time, so the flexible wiring circuit board cannot be held on the carrier tape. , The workability is greatly reduced, and the incidence of defective products is also high, which is the problem. The present invention is intended to solve the problems caused by the above-mentioned conventional technologies, and an object thereof is to provide a method for manufacturing a flexible printed circuit board. Even if the pattern pitch of the flexible printed circuit board is very small, the patterning accuracy will not decrease. , It is not easy to have bad patterns, and the miniaturization of manufacturing equipment is relatively easy. The lead time can be relatively shortened. The laser cutting method 200418355 can be used to implement the cutting process. [Summary of the Invention] In order to avoid using the roll-to-roll method, the present invention can manufacture a flexible wiring circuit board in a single piece type "due", and replaces the carrier tape with a transparent and rigid glass substrate or an acrylic substrate, etc. The substrate, and using an adhesive layer that will reduce the adhesion of the cable, the laminated body with the conductor layer formed on the insulating support film will be adhered to the transparent rigid substrate with the insulating support film side, and will be bonded to the conductor layer. After patterning, the adhesive force of the adhesive layer is reduced and the laminated body is peeled off from the transparent hard substrate, or the conductive layer is directly bonded with the polyimide precursor system adhesive layer on the transparent hard substrate. Before or after patterning, the polyimide precursor system adhesive layer is imidized, thereby making an insulating polyimide support film and reducing its adhesion, and then the polyimide is formed from a transparent hard substrate. The amine support film is peeled off; in this way, the above-mentioned object can be achieved, and the present invention has been completed. The first invention based on the foregoing findings is a method for manufacturing a flexible wiring circuit board, It is used to manufacture a flexible printed circuit board having a wiring circuit formed on an insulating support film, and has the following processes 0) to (d): (a) A laminated body having a conductor layer formed on the insulating support film using an adhesive layer A process of bonding a transparent rigid substrate from its insulating support film side; (b) a process of patterning the conductor layer of the laminated body to form a wiring circuit substrate; (c) a process of reducing the adhesion of the adhesive layer; And (d) a process of peeling a laminated body on which a wiring circuit is formed from a transparent hard substrate such that an adhesive layer remains on the transparent hard substrate side. 200418355 The second invention is a method for manufacturing a flexible printed circuit board. It is used to manufacture a flexible printed circuit board with a wiring circuit formed on an insulating polyimide support film, and has the following processes (aa) to (dd) · (aa) on a transparent hard substrate, which passes through the polyimide Process for laminating a conductor layer with a precursor system adhesive layer; (bb) a process for patterning the conductor layer to form a wiring circuit; (cc) an imidization of the polyfluorene imide precursor system adhesive layer for insulation A process for removing polyimide support film; and (dd) a process for peeling a polyimide support film on which a wiring circuit is formed from a transparent rigid substrate. In the present invention, the laser cutting method is used for excision. In the case of processing, a process is provided between the process ⑻ and the process 或是 or between the process ⑷ and the process 具备: The process of cutting the laser cutting method for the laminated body formed with the wiring circuit is as follows: Similarly, in the "second invention", the process (bb) and the process (cc) or between the process (ee) and the process _ are further provided with a process (called: for the formation of polyurea) The laminated body of the amine support film is preferably processed by laser cutting. The following is a description of the method for manufacturing a flexible printed circuit board with a wiring circuit formed on the insulating support film of the present invention while referring to the drawings. Detailed description. The example of the first invention can be described with reference to Figures ⑷ to ⑷ for each process. 200418355 First, as shown in Figure 1 (a), the conductive support layer 2 is formed on the insulating support film 1 with the adhesive layer 4 The laminated body 3 is bonded to the substrate G with its insulating support film 丨 side. At this time, specifically, the adhesive is applied to the transparent hard substrate G by a well-known method, such as a spin coating method, and dried to form an adhesive layer 4, and an insulating support film of a self-laminated body 3 such as a rubber roller is used \ The laminated body is pressed against the adhesive layer 4 to perform bonding. Here, the transparent rigid substrate G includes an acrylic substrate, a glass substrate, and the like, but it is preferable to use a glass substrate which is more excellent in flatness and is also excellent in heat resistance. The adhesive layer 4 may be formed on one of the entire surfaces of the transparent rigid substrate G. The important features of this process (a) are that the transparent rigid substrate G having excellent flatness is used as a single piece, and the adhesive layer 4 used is suitable for the insulating support film 1 and transparent during processing such as a patterning process. The rigid substrate G maintains good adhesion, but once a specific treatment (such as ultraviolet irradiation treatment, heating treatment, cooling treatment, ultrasonic irradiation treatment, electron beam irradiation treatment, etc.) is performed, the adhesive layer 4 is opposed to the insulating support film. The adhesion of i is significantly lower than the adhesion of the adhesive layer 4 to the transparent rigid substrate G. According to this embodiment, since the transparent hard substrate G 'having excellent flatness is used in a single piece type, even if the pattern pitch of the flexible wiring circuit board is very small, the patterning accuracy is not reduced, and pattern defects are unlikely to occur. It is also relatively easy to change and can shorten the lead time relatively. Also, by using UV-irradiation treatment, the adhesiveness to 200418355, 1, 2, 3, and the support film 1 is lower than that of the transparent rigid substrate G. ^ 4. When the conductor & 2 is patterned, the laminated layer 3 can be surely held on the transparent rigid substrate G, and the laminated body 3 can be easily separated from the transparent rigid substrate G after patterning. In this month's month, the insulating support film 1 can be the same as the conventional copper-clad laminates, such as, yttrium, and fluorene-based films. For example, a polyimide film can be suitably used. The thickness of the 1 rim support 胄 1 is not particularly limited, but is usually 50 " m or less, preferably 20 to 25 // m. As the conductor layer 2, an electrolytic copper foil, sus304, an aluminum foil, a beryllium foil, a scale bronze foil, and the like can be suitably used. It is also possible to use a copper-nickel alloy electric chain layer or the like. The thickness of the conductor layer 2 is not particularly limited, but it is usually 35 #m or less, preferably 8 to 12 // m. If the thickness of the rural transparent rigid substrate G is too thin, it will be easily deformed or damaged by the external stress f, and the workability during manufacturing will be reduced. If it is too thick, the weight will be heavy, the load on the manufacturing equipment will increase, and the equipment stability. It is lowered, so it is preferably 10 mm to 5.0 mm, and more preferably 1.5 mm to 2.5 mm. If the thickness difference of the transparent rigid substrate G (flatness 1: measured by _ TTV (Total Thickness Valuation) method) is too large, it becomes difficult to focus when the fine pattern exposure is ordered, and there may be a bad pattern occurrence. b 'Therefore, it is better to control the thickness difference below 0.02 mm. ^ Here, the TTV method is a method for measuring the overall surface roughness of a measurement object, and it means the difference between the maximum value and the minimum value of the thickness measured when the measurement object is adsorbed and fixed. If the plate bend of the transparent rigid substrate G (the flatness 2: the result measured by the 11 200418355 LTV (Local Thickness Valuati) method) is too large, then the pattern of the conductor layer 2 in the process ⑻ described later will be used. At the time of exposure, the transparent rigid shell substrate G is difficult to be fixed by a vacuum clamp. There are other problems with this pattern. Therefore, it is better to control it to 0 · 1 mm or less. Here, the LTV method is a method for partially measuring the surface roughness of a measurement object, and it means the maximum value of the roughness measured in a predetermined area (such as the heart of the claw river) when the measurement object is adsorbed and fixed— The difference between the minimum values. In order to harden the ultraviolet-curable adhesive used as the adhesive layer 4 in the process (c) described later, in terms of the material of the transparent hard f substrate G, the ultraviolet-curable adhesive can be used when the ultraviolet light is irradiated from the transparent hard substrate. It is preferable that the agent is sufficiently hardened and has ultraviolet transmission properties. Here, the UV transmittance of the transparent rigid substrate G is too low, so that the amount of irradiation required to harden the UV-curable adhesive 4 has to be increased, and the work efficiency will be significantly reduced; 2 = at 30% (at 250 ~ A measurement result using an ultraviolet spectrophotometer in a wavelength range of 45 nm is preferred. Examples of the adhesive layer 4 include an ultraviolet-curable adhesive layer and a thermal adhesive layer # '. From the viewpoint of achieving good thermal stability, the ultraviolet-curable adhesive layer is particularly preferable. As this kind of ultraviolet hardening is difficult to cure, it is because of a certain degree of bonding strength, and hardened by ultraviolet irradiation; =: person with reduced strength. At this time, the adhesion force (peel strength) to the insulating support film i of the laminate 胄 3 must be smaller than the adhesion force (peel strength) to the transparent rigid substrate G. 12 200418355, For UV-curable adhesive layer, UV curing with UV peeling strength (JIS & 6854) of 3N / cm or more and UV peeling strength of 1N / cm or less is used. A thin film formed by a pressure-sensitive adhesive is preferred. In this case, as the ultraviolet curing adhesive, a photo radical polymerization type acrylic ultraviolet curing adhesive or the like can be used. / As shown in FIG. 1 (b), the conductor layer of the multilayer body 3 is patterned using a conventional photolithography technique to form a wiring circuit h. At this time, on the two bodies, the photosensitive photoresist film can be bonded on the conductor layer 2 with its own adhesive force, and exposed through a patterned photomask, which is not shown in the figure. After using the photoresist pattern, the conductive layer 2 is etched to be patterned, and then the photosensitive photoresist pattern is removed to form a wiring circuit. In the invention, the wiring circuit 2a can be formed in the insulating support film of the multilayer body 3 to form one, but usually A plurality of wiring circuits are formed. If a plurality of wiring circuits 2a are formed, as will be described later, a plurality of flexible wiring circuit substrates are separated by cutting processing. Process (C) Next, the adhesive layer 4 is made to increase the viscosity of the adhesive layer 4 by p, plus y. < The strength of the prefecture is reduced. For example, if the adhesive layer 4 uses a UV-curable adhesive for a $ d noise, as shown in Fig. 1 (c), the transparent hard substrate G side is projected 呰 ice green ττ W α shoots outside UV, hardens the UV-curable adhesive layer, and reduces the adhesive strength of "6 Tsukazakura 膑 1", which has a lower adhesive strength than the transparent rigid substrate G. . 13 200418355 In the present invention, as another method for reducing the adhesive force of the adhesive layer 4, the temperature of the adhesive layer 4 can be lowered by lowering the ambient temperature than the temperature at the time of bonding. Thereby, the adhesive layer 4 becomes hard and the adhesive force is reduced. Process (d) Secondly, as shown in FIG. 1 (d), the laminated body 3 in which the wiring circuit 2a is formed is left as an adhesive layer 4 having a reduced adhesive force after curing.
於透明硬質基板G側的方式自透明硬質基板G剝離。藉此 ’得到軟性配線電路基板1 〇。 其中，當對於一個積層體3形成了複數 的情況下’必須對其進行切除加工做成個別之軟性配線 路基板’此時’可將自透明硬質基板G剝除之形成有複 配線電路2a之積層體3以金屬 至屬杈具切除法來分離成個別 軟性配線電路基板，另外在太 卜在本1明中，以採用不易發生 邊與變形之可輕易形成各種 、 Λ分禋衝裁圖案之雷射切割法之製 (e)為佳。 t 2 2圖所示般，此製程⑷係對於形成有 之積層體3以裁斷用之週知高輸出雷射光 :照射來進行切除加工。所使用之雷射裝置、雷射：= 件可依據所欲裁斷之材料而從週知者中適宜以。、條 本發明中’製程⑷雖可設於前述製程㈨： :或疋製程⑷與製程（d)之間，惟基於防止硬化构著） 成之污染的觀點考量，以設於製程⑷與製程（伙^佳斤造 14 200418355 又，第1圖之態樣中， 硬質基板G與積層體3做積芦二之黏著劑層4將透明 ，明硬質基板G與積層體3隔著圖所示般， 兩面已形成了展現與前述黏著剤層“ &之 5b(例如紫外線硬化型黏著劑9目问特性之黏著劑層 層。此時，藉由進行與上述二面黏著膜5來進行積 在積層體3之絕緣支持膜1與雙面^〜⑷同#製程，最後 之間進行剝離。 又-、者膜5之黏著劑層5b 在塑膠膜&方面，可適宜 之聚酯膜。X，在黏著劑層& 尽度50〜⑵㈣ 展現與前述黏著劑層4相 /斗方面，可適宜使用 ㈣。 4相同特性之物，厚度較佳為i。〜3。 又’第1圖之態樣係以減成法來進行導 化之例，在本發明中，亦可 _㈢2之圖案 時可與第i圖所示例子 /厚法來進行圖案化。此 ⑹來得到軟性配線電路基板:Γ下：^製程⑻〜製程 用製广即使，進:”：二要進-步採 如第4圖（a)所示般，與第 、 以利用週知做法所形成 ：說明之製程⑷同樣， 形成有薄導體層2之積㈣緣支持膜1上 基板G上。或是亦可將絕緣膜、了緣^膜1側貼合於 明硬質基板G之後，以化學以在以黏者劑層貼合於透 鐵法在絕緣支持膜丨矣 / # 金屬薄膜做為薄的導體層2(第4圖⑷)。、表面形成 15 200418355 此處，黏著劑層4以於透明硬質基板G之其中一整面 上形成為佳。藉此，可提升後述阻鍍圖案6對於透明硬質 基板G之密合性。 复Kb，） 士第4圖（b 1)所示般，藉由諸如通常之光微影技術在 積層體3之薄的導體層2上形成阻錢圖案6之後，如第4 圖（b2)所示般，以例如銅電鍍法在薄的導體層2上使得電 鍍金屬2,析出。 再者，如第4圖（b3)所示般，以蝕刻將阻鍍圖案6去 除之後，如第4圖（b4)所示般對薄的導體層2施以軟蝕刻 來形成配線電路圖案2a。 麗程（c，） 如第5圖（c)所示般，與第丨圖所說明之製程（c)同樣， 自透明硬質基板G侧照射紫外線UV來使得黏著劑層4之 黏著力降低。 θ 製程（d’） 如第5圖（d)所示般，與第丨圖所說明之製程（d)同樣， 將形成有配線電路2a之積層體3，以黏著劑層4殘存於透 明硬質基板G側的方式自透明硬質基板G剝離。藉此，可 得到軟性配線電路基板1 〇。 在本例子之情況中同樣地可視情況於製程（b，）與製程 (C’）之間或是製程（C，）與製程（d，）之間（較佳為製程^ 程（d’）之間）與第2圖所說明之製程⑷同樣，採用雷射切割 法進行切除加工（製程（e，））。 16 200418355 其次，針對第2發明之例，一邊參照第6圖一邊說明 各製程。 麗程（aa) 首先，如第6圖（a)所示般，在透明硬質基板G上隔著 聚酸亞胺先驅體系黏著劑層41來積層導體層42。具體上 ’係將聚醯亞胺先驅體系黏著劑塗佈於透明硬質基板G上 ’進行乾燥，形成聚醯亞胺先驅體系黏著劑層41，然後將 銅箔等以加壓輥抵壓其上來做貼合。 此處，在聚醯亞胺先驅體系黏著劑層41方面可使用具 _ 有經過例如250°C〜350°C加熱此種醯亞胺化處理而成為絕 緣性聚醯亞胺膜之性質者。 聚醯亞胺先驅體系黏著劑層41如前述般係聚醯亞胺先 驅體系黏著劑所形成之薄膜。此種聚醯亞胺先驅體系黏著 劑，可使用由酸二酐與二胺所得之芳族聚醯胺酸類（參見特 開昭60-157286號公報、特開昭6〇_24312〇號公報、特開 昭63-239998號公報、特開平丨_245586號公報、特開平弘 123093號公報、特開平5_139〇27號公報），由過量之酸二參 酐人胺所a成之末端為酸二酐之芳族聚醯胺酸預聚物與 二異氰酸酯化合物所得之部份醯亞胺化之芳族聚醯胺類(聚 醯胺樹脂手冊，日刊卫業新聞社發行（536胃，MM年）； 高分子討論集，47(6)，199G參照）等。其中，可適宜使用由 酸二酐與二胺所得之芳族聚醯胺酸類。 此處’做為酸項之較佳例子，可舉出均苯四甲酸二 酐(PMDA)、3,4,3，，4，—聯苯基四缓酸二酐(膽旬、 17 200418355 3,4,3，，4，一二苯曱酮四羧酸二酐（8丁0人）、3,3，，4,4，〜二笨 硼四羧酸二酐（DSDA)。又，做為二胺之較佳例子，可舉出 Μ’一二胺基二苯醚（DPE)、對苯撐二胺（pr)A)、4,4，—二 胺基苯醯替苯胺（DABA)、4,4’一雙（對胺基苯氧基）二苯楓 (BAPS) 〇 又，在透明硬質基板G與導體層42方面係使用關於 第1圖之製程（a)所說明者。 製程（bb) 其次，如第6圖所示般，以與第i圖所說明之製程· 同樣的方法將導體層42圖案化來形成配線電路42a。 製程（cc) 如第6圖（c)所示般，將聚醯亞胺先驅體系黏著劑層41 酉监亞胺化做成絕緣性聚醯亞胺支持膜4 3。 ^此時，醯亞胺化條件可依據所使用之聚醯亞胺先驅體 糸黏著劑層之種類來適宜設定。 此聚醯亞胺支持膜43不僅扮演導體層42之支持體的 功用，且相對於透明硬質基板G之接著力係較相對於導體籲 層42(配線電路42&)之接著力來得低，因而透明硬質基板 G與聚醯亞胺支持膜43之界面處可輕易剝離。 —=，此製程（cc)除了如本例般在製程（bb)與製程（dd)之 間貫施’尚可在製程〇a)與製程（bb)之間實施。 ΚΜΙάάχ ’、 士第6圖（d)所示般，將形成有配線電路42a之 聚醯亞胺支持膜43自透明硬質基板剝離。藉此，得到軟 18 200418355 性配線電路基板40。 在本例之情況中，同樣地可視情況對於所得之軟性配 線電路基板40施以金屬模具切除加工，亦可如第2圖所 呪明之製程（e)同樣，藉由雷射切割法來實施切除加工。 此時，具體上以於製程（bb)與製程（cc)之間或是製程 (cc)與製程（dd)之間設置以下之製程（ee)為佳。 製程（ee) 如第7圖所示般，與第2圖所說明之製程（e)同樣，對 於形成有配線電路42a之聚醯亞胺支持膜43，順沿切除圖籲 案來照射裁斷用之眾知之高輸出雷射光L來進行切除加工 。所使用之雷射裝置、雷射照射條件可因應所欲裁斷之材 料從眾知之物當中適宜決定。 又，基於防止黏著劑飛散所造成之污染的觀點，此製 程（ee)以設置於製程（cc)與製程（dd)之間為較佳。 實施例 以下依據實施例來具體說明本發明。 <實施例1> ⑩ 於紫外線穿透率98%之厚度lmm的玻璃基板單面，以 乾燥厚度成為20〜30 # m的方式來塗佈紫外線硬化型丙烯 酸系黏著劑（固體成分20%)，以60°C與100。(：之2階段進 行乾燥來設置紫外線硬化型黏著劑層。 其次，使用橡膠輥將銅面積層板（銅箔^“瓜厚/聚醯 亞胺25/zm厚）以其聚醯亞胺面抵壓於玻璃基板上之紫外 線硬化型黏著劑層，將該銅面積層板之銅箔以過氧化氯與 19 r200418355 八-文之/tCi σ液進行軟蝕刻，將銅箔表面潔淨化。The transparent rigid substrate G is peeled from the transparent rigid substrate G. Thereby, a flexible printed circuit board 10 is obtained. Among them, when a plurality of multilayer bodies 3 are formed, 'it must be cut and processed to make individual flexible distribution circuit substrates'. At this time, the transparent hard substrate G can be peeled off to form a multilayer wiring circuit 2a. The laminated body 3 is separated into individual flexible wiring circuit substrates by a metal-to-metal cutting method. In addition, in this paper, various types of Λ die-cutting patterns can be easily formed by using edges that are not easy to deform. The laser cutting method (e) is preferred. As shown in the figure t 2 2, this process is performed on the formed multilayer body 3 by cutting with a known high-output laser light for cutting: irradiation. The laser device and laser used: = pieces can be selected from known ones according to the material to be cut. In the present invention, although the "process" can be set in the aforementioned process :: or between the "process" and the process (d), but based on the viewpoint of preventing pollution caused by hardening, the process is set in the process and process (Jiaojinjin 14 200418355) In the state of the first figure, the hard substrate G and the laminated body 3 are used as the adhesive layer 4 of the second layer to be transparent, and the hard substrate G and the laminated body 3 are shown as shown in the figure. In general, an adhesive layer having 5b (for example, UV-curable adhesive 9 features) is formed on both sides of the adhesive layer. At this time, the adhesive layer 5 is laminated with the two-sided adhesive film 5 described above. The insulating support film 1 of the laminated body 3 and the double-sided substrate are produced in the same process, and finally peeled off. In addition, the adhesive layer 5b of the film 5 can be a polyester film suitable for plastic films. X, for the adhesive layer & as much as 50 to ⑵㈣, it is suitable to use ㈣ in terms of exhibiting 4 phases / bucket with the aforementioned adhesive layer. 4 The thing with the same characteristics, the thickness is preferably i. The form of the state is an example of conducting by the subtractive method. In the present invention, it can also be used with the _㈢2 pattern. Figure i shows the example / thickness method for patterning. Here you can get a flexible printed circuit board: Γ Down: ^ Process ⑻ ~ Process for manufacturing, even if: ": Second to go-step as shown in Figure 4 ( a) As shown in the figure, the process is the same as the one described in the well-known method: a thin conductive layer 2 is formed on the substrate G on the edge supporting film 1. Alternatively, an insulating film may be formed. The edge ^ film 1 side is attached to the bright hard substrate G, and then the insulating support film is chemically bonded to the iron through method with an adhesive layer. 矣 / # The metal thin film is used as the thin conductor layer 2 (Figure 4 ⑷). Surface formation 15 200418355 Here, the adhesive layer 4 is preferably formed on one entire surface of the transparent hard substrate G. Thereby, the adhesion of the plating resist pattern 6 to the transparent hard substrate G described later can be improved After Kb, as shown in Fig. 4 (b 1), a money-blocking pattern 6 is formed on the thin conductor layer 2 of the laminated body 3 by a conventional light lithography technique, as shown in Fig. 4 (b2). As shown in FIG. 4A, the plated metal 2 is deposited on the thin conductor layer 2 by, for example, copper plating. Further, as shown in FIG. 4 (b3), After removing the plating resist pattern 6 by etching, the thin conductor layer 2 is subjected to soft etching as shown in FIG. 4 (b4) to form a wiring circuit pattern 2a. Li Cheng (c,) As shown in FIG. 5 (c) As shown, as in the process (c) illustrated in FIG. 丨, ultraviolet light is radiated from the transparent hard substrate G side to reduce the adhesive force of the adhesive layer 4. θ process (d ') is as shown in FIG. 5 (d) As shown, in the same manner as the process (d) illustrated in FIG. 丨, the laminated body 3 on which the wiring circuit 2a is formed is peeled from the transparent rigid substrate G such that the adhesive layer 4 remains on the transparent rigid substrate G side. , A flexible printed circuit board 1 can be obtained. In the case of this example, the process (b,) and the process (C ') or the process (C,) and the process (d,) can be similarly determined (preferably the process ^'). In the same way as the process ⑷ illustrated in FIG. 2, the laser cutting method is used for cutting (process (e,)). 16 200418355 Next, with reference to the example of the second invention, each process will be described with reference to FIG. 6. Li Cheng (aa) First, as shown in FIG. 6 (a), a conductive rigid layer 42 is laminated on a transparent rigid substrate G with a polyimide precursor system adhesive layer 41 interposed therebetween. Specifically, 'the polyimide precursor system adhesive is coated on the transparent hard substrate G' and dried to form the polyimide precursor system adhesive layer 41, and then copper foil or the like is pressed against it by a pressure roller. Make fit. Here, in terms of the polyimide precursor system adhesive layer 41, it is possible to make the device have the property of being an insulating polyimide film after being subjected to such an imidization treatment such as heating at 250 ° C to 350 ° C. The polyimide precursor system adhesive layer 41 is a thin film formed of the polyimide precursor system adhesive as described above. As such a polyimide precursor system adhesive, aromatic polyamidoacids obtained from an acid dianhydride and a diamine can be used (see Japanese Patent Application Laid-Open No. 60-157286, Japanese Patent Application Laid-Open No. 60-243120, JP-A No. 63-239998, JP-A No. 丨 _245586, JP-A No. 123093, and JP-A No. 5-139〇27), the terminal formed by the excess of acid diginseng anhydride and human amine is acid di Partially imidized aromatic polyamidoamines obtained from the aromatic polyamidoprepolymer of anhydride and the diisocyanate compound (Polyamidoamine Resin Handbook, issued by Nikkan Hyoka Shimbun (536 stomach, MM year) Macromolecule Discussion Set, 47 (6), 199G reference) and so on. Among these, aromatic polyamines obtained from an acid dianhydride and a diamine can be suitably used. Here, as a preferable example of the acid term, pyromellitic dianhydride (PMDA), 3,4,3,, 4, -biphenyltetracarboxylic acid dianhydride (Bile, 17 200418355 3 , 4,3,, 4, monobenzophenone tetracarboxylic dianhydride (8 but0 people), 3,3,, 4,4, ~ dibenzyltetracarboxylic dianhydride (DSDA). Also, do Preferred examples of diamines include M'-diaminodiphenyl ether (DPE), p-phenylenediamine (pr) A), 4,4, -diaminobenzidine aniline (DABA) 4,4′-bis (p-aminophenoxy) diphenyl maple (BAPS) 〇 In addition, the transparent rigid substrate G and the conductor layer 42 are described using the process (a) of FIG. 1. Process (bb) Next, as shown in FIG. 6, the conductor layer 42 is patterned in the same manner as the process and process described in FIG. I to form a wiring circuit 42 a. Process (cc) As shown in FIG. 6 (c), the polyimide precursor system adhesive layer 41 is imidized to form an insulating polyimide support film 43. ^ At this time, the fluorinated imidization conditions can be appropriately set according to the type of the fluorinated imine precursor fluorinated adhesive layer used. This polyimide supporting film 43 not only functions as a support for the conductor layer 42, but also has a lower adhesive force with respect to the transparent rigid substrate G than the adhesive force with respect to the conductive layer 42 (wiring circuit 42 &), and therefore, The interface between the transparent rigid substrate G and the polyimide support film 43 can be easily peeled off. — =, This process (cc) can be implemented between process (a) and process (bb) in addition to applying ′ between process (bb) and process (dd) as in this example. As shown in FIG. 6 (d), the polyimide support film 43 on which the wiring circuit 42a is formed is peeled from the transparent hard substrate. As a result, a flexible printed circuit board 40 is obtained. In the case of this example, the obtained flexible wiring circuit board 40 may be similarly subjected to a metal mold cutting process, and the cutting process may be performed by the laser cutting method as in the process (e) illustrated in FIG. 2. machining. At this time, specifically, it is preferable to set the following process (ee) between the process (bb) and the process (cc) or between the process (cc) and the process (dd). Process (ee) is the same as process (e) described in FIG. 2 as shown in FIG. 7. The polyimide support film 43 having the wiring circuit 42 a formed is cut out along the plan to illuminate the cutting process. The well-known high-output laser light L is used for resection processing. The laser device and laser irradiation conditions to be used can be appropriately determined from known materials according to the materials to be cut. In addition, from the viewpoint of preventing contamination caused by scattering of the adhesive, it is preferable that the process (ee) is set between the process (cc) and the process (dd). Examples The present invention will be specifically described below based on examples. < Example 1 > 紫外线 A UV-curable acrylic adhesive was applied on one side of a glass substrate having a thickness of 1 mm with a UV transmittance of 98% and a dry thickness of 20 to 30 # m (solid content 20%). To 60 ° C and 100 ° C. (: Drying in 2 steps to set the UV-curable adhesive layer. Next, the copper area laminate (copper foil ^ "melon thickness / polyimide 25 / zm thickness) with a polyimide surface is formed using a rubber roller. The copper foil of the copper area laminate was soft-etched with chlorine peroxide and 19 r200418355 octa-text / tCi σ solution against the ultraviolet-curable adhesive layer on the glass substrate to clean the surface of the copper foil.
、尺以旋塗法對銅箔表面塗佈液體狀光阻（PMER-P ，東不應化工業公司製造），乾燥形成厚度7#m之阻敍層 ’對該阻㈣透過光罩進行曝光，以使㈣之液體狀光阻 之專用顯像液（東京應化工業公司製造）進行顯像，進而以 氯化鐵水溶液將銅猪触刻，於銅箱上形成配線電路圖案， 將阻钮層去除之後，設置阻焊層，對圖案端子部施行 料。 其次，自玻璃基板側對紫外線硬化型黏著劑層昭射 4〇〇n^能量之紫外線，使得紫外線硬化型黏著劑層硬化。 最後’將在玻璃基板上硬化之紫外線硬化型黏著劑層 與銅面積層板之聚醯亞胺面之間做剝離得到軟性配線電路 基板。此時之剝離力為〇.2N/cm，製品並無彎曲，黏著劑 並未轉印於聚醯亞胺面，可輕易地自玻璃基板做剝離。 〈實施例2〉 準備一於厚度50//m之聚對苯二甲酸乙二醇酯膜之兩 面分別設置有厚度15# m之紫外線硬化型丙烯酸系黏著劑 層（D-203DF，林鐵克公司製造）所成之雙面黏著膜，將此 雙面黏著膜以溫度80°C之條件利用橡膠輥抵壓黏合於紫外 線穿透率95%、厚度2mm之玻璃基板的單面上。 利用橡膠輥將於厚度25 // m之聚醯亞胺膜的單面設置 有厚度〇.25//m之種晶層（鎳一銅合金層）之積層體以其聚 酉监亞胺膜側層塵於在玻璃基板上所貼合之雙面黏著膜上。 其次，自玻璃基板側對雙面黏著膜照射4〇〇叫·能量之 200418355 黏著劑層硬化。其次 佈液體狀光阻（PMER-成厚度8 // m之阻# 以使用過之液體狀光 紫外線’使得紫外線硬化型丙烯酸系 ’以旋塗法對積層體之種晶層表面塗 p ’東京應化工業公司製造），乾燥形 層’對該阻蝕層透過光罩進行曝光， 阻之專用顯像液（東京應化X業公司製造）進行顯像形成阻 鍍圖案，然後以銅電鍍處理於種晶層上堆積厚度7" m之 其次’將阻鍍圖案去除之後’以過氧化氫與硫酸之混 合液進行軟蝕刻，將露出之種晶層去除。接著設置阻焊層籲 於圖案端子部施以鍍焊料。 最後，將在玻璃基板上之雙面黏著膜與積層體之聚醯 亞胺膜之間做剝離，得到軟性配線電路基板。此時之剝離 力為0.4N/cm，製品並無彎曲，黏著劑並未轉印於聚醯亞 胺面。 產業上可利用柯 如上所述’依據本發明之軟性配線電路基板之製造方 法，由於可在平坦性優異之透明硬質基板上實施製程操作⑩ ，所以可在整個製程中保持平坦性，即使配線電路微細化 ’品質變動仍少，良率也可獲得大幅提昇。特別是，即使 以減成法形成圖案仍可穩定微細化，製品之阻抗控制變得 容易。又，由於不使用載膜，所以可避免使用載膜造成之 雜質4異物附著所導致之圖案不良。又，由於可在透明硬 質基板上以單片式來製造，所以能以簡潔的設備來進行製 造。其結果’可減少製造空間與附加設備之空間，可謀求 21 200418355 電力、藥劑、水等之省資泝彳卜 、席、化亦可謀求前置時間之縮短 。再者，由於能以雷射加工法决 &不進行切除加工，所以可避 免伴隨金屬模具切除加工所產生之各種問題。 【圖式簡單說明】 (一）圖式部分 第1圖⑷〜⑷係本發明之實施形態之製造過程圖。 第2圖係本發明之附加製程圖。 第3圖係本發明之附加製程圖。 第4圖（a)〜(μ)係本發明之其他實施形態之製造過程圖籲 第5圖（c)〜（d)係本發明之其他實施形態之製造過程圖 第6圖（a)〜（d)係本發明之製造方法之其他實施形態之 製造過程圖。 第7圖係本發明之附加製程圖。 1 絕緣支持膜 2,42 導體層 2a，42a 配線電路 3 積層體 4 黏者劑層 5 雙面黏著臈 5a 塑膠膜 5b 黏著劑層 (二）元件代表符號1. Apply a liquid photoresist (PMER-P, manufactured by Toyo Chemical Co., Ltd.) to the surface of the copper foil by spin coating, and dry to form a resist layer with a thickness of 7 # m. To develop a special developing solution (produced by Tokyo Yingka Kogyo Co., Ltd.), which is a liquid photoresist, and then engraving a copper pig with an aqueous solution of ferric chloride to form a wiring circuit pattern on a copper box. After the layer is removed, a solder resist layer is provided to apply material to the pattern terminal portion. Next, the ultraviolet-curable adhesive layer is irradiated with ultraviolet energy of 400 n ^ from the glass substrate side, so that the ultraviolet-curable adhesive layer is cured. Finally, a flexible wiring circuit board is obtained by peeling the ultraviolet-curable adhesive layer hardened on the glass substrate from the polyimide surface of the copper area laminate. The peeling force at this time was 0.2 N / cm, the product was not bent, and the adhesive was not transferred to the polyimide surface, and it could be easily peeled from the glass substrate. <Example 2> A 50 // m-thick polyethylene terephthalate film was prepared with UV-curable acrylic adhesive layers (D-203DF, Lin Tieke, each with a thickness of 15 # m) on both sides. The double-sided adhesive film made by the company) was bonded to a single side of a glass substrate with a thickness of 2 mm and a UV transmittance of 95% with a rubber roller at a temperature of 80 ° C. Using a rubber roller, a laminated body having a seed layer (nickel-copper alloy layer) with a thickness of 0.25 // m is provided on one side of a polyimide film with a thickness of 25 // m with a polyimide film. The side layer dust is on the double-sided adhesive film attached on the glass substrate. Next, the double-sided adhesive film was irradiated with 400 Å · energy of 200418355 from the glass substrate side to harden the adhesive layer. Secondly, a liquid photoresist (PMER-to a thickness of 8 // m of the resistance # using the used liquid light ultraviolet 'make UV-curable acrylic' by spin coating method to the surface of the seed layer of the laminated body p 'Tokyo (Industry Chemical Industry Co., Ltd.), the dry-shaped layer is used to expose the resist layer through a photomask, and a special developer solution (manufactured by Tokyo Yinghua X Industry Co., Ltd.) is developed to form a plating resist pattern, followed by copper plating. A thickness of 7 " m was deposited on the seed layer, followed by 'after removal of the plating resist pattern', followed by soft etching with a mixed solution of hydrogen peroxide and sulfuric acid to remove the exposed seed layer. Next, a solder resist layer is provided to apply solder plating to the pattern terminal portion. Finally, the double-sided adhesive film on the glass substrate and the polyimide film of the laminate are peeled off to obtain a flexible printed circuit board. The peel force at this time was 0.4 N / cm, the product was not bent, and the adhesive was not transferred to the polyimide surface. Industrially, the method for manufacturing a flexible printed circuit board according to the present invention can be used as described above. Since the process operation can be performed on a transparent hard substrate with excellent flatness, the flatness can be maintained throughout the entire process, even if the wiring circuit Miniaturization's quality change is still small, and the yield can be greatly improved. In particular, even if a pattern is formed by a subtractive method, the fineness can be stably miniaturized, and the impedance control of a product becomes easy. In addition, since a carrier film is not used, it is possible to avoid pattern defects caused by the adhesion of foreign matter 4 caused by the use of the carrier film. In addition, since it can be manufactured as a single piece on a transparent rigid substrate, it can be manufactured with simple equipment. As a result, it can reduce the manufacturing space and the space of additional equipment, and can seek 21 200418355 provincial capital traceability, electricity, chemicals, water, etc. can also reduce the lead time. Furthermore, since laser processing can be used to eliminate the need for cutting, various problems associated with cutting of the mold can be avoided. [Brief description of the drawings] (I) Schematic drawings The first figure ⑷ ~ ⑷ is a manufacturing process diagram of the embodiment of the present invention. Figure 2 is an additional process diagram of the present invention. Figure 3 is an additional process diagram of the present invention. Figure 4 (a) ~ (μ) are manufacturing process diagrams of other embodiments of the present invention. Figure 5 (c) ~ (d) are manufacturing process diagrams of other embodiments of the present invention. Figure 6 (a) ~ (D) is a manufacturing process drawing of another embodiment of the manufacturing method of this invention. FIG. 7 is an additional process diagram of the present invention. 1 Insulating support film 2,42 Conductor layer 2a, 42a Wiring circuit 3 Laminated body 4 Adhesive layer 5 Double-sided adhesivea 5a Plastic film 5b Adhesive layer
C 22 「200418355 6 阻鍍圖案 10,40 軟性配線電路基板 41 聚醯亞胺先驅體系黏著劑層 43 聚醯亞胺支持膜 G 透明硬質基板 UV 紫外線 L 雷射光C 22 「200418355 6 Plating resist pattern 10,40 Flexible wiring circuit board 41 Polyimide precursor system adhesive layer 43 Polyimide support film G Transparent rigid substrate UV UV L Laser light
C 23C 23