TW200420180A - Structure and manufacturing method for reducing the lid thickness of OLED package - Google Patents

Structure and manufacturing method for reducing the lid thickness of OLED package

Info

Publication number
TW200420180A
TW200420180A TW92106434A TW92106434A TW200420180A TW 200420180 A TW200420180 A TW 200420180A TW 92106434 A TW92106434 A TW 92106434A TW 92106434 A TW92106434 A TW 92106434A TW 200420180 A TW200420180 A TW 200420180A
Authority
TW
Taiwan
Prior art keywords
oled
reducing
manufacturing
package
lid
Prior art date
Application number
TW92106434A
Other languages
Chinese (zh)
Other versions
TW582183B (en
Inventor
Shu-Wen Jang
Wen-Jiun Wang
Yi-Jin Wang
Original Assignee
Windell Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Windell Corp filed Critical Windell Corp
Priority to TW92106434A priority Critical patent/TW582183B/en
Application granted granted Critical
Publication of TW582183B publication Critical patent/TW582183B/en
Publication of TW200420180A publication Critical patent/TW200420180A/en

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Landscapes

  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a structure and manufacturing method for reducing the lid thickness of OLED package. When the OLED is being packaged, thin film technique is employed to form moisture-absorbing material on the inner rim of package lid, so that the thickness of the wet-absorbing material is reduced to 10nm to 10000nm; then placing the OLED on the substrate; spreading molding compound on the edge of the package lid; and drying and solidifying the molding compound by thermal energy or UV-curing, so as to encapsulate the OLED in the package lid and substrate.
TW92106434A 2003-03-24 2003-03-24 Structure and manufacturing method for reducing the lid thickness of OLED package TW582183B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92106434A TW582183B (en) 2003-03-24 2003-03-24 Structure and manufacturing method for reducing the lid thickness of OLED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92106434A TW582183B (en) 2003-03-24 2003-03-24 Structure and manufacturing method for reducing the lid thickness of OLED package

Publications (2)

Publication Number Publication Date
TW582183B TW582183B (en) 2004-04-01
TW200420180A true TW200420180A (en) 2004-10-01

Family

ID=32960741

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92106434A TW582183B (en) 2003-03-24 2003-03-24 Structure and manufacturing method for reducing the lid thickness of OLED package

Country Status (1)

Country Link
TW (1) TW582183B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115802798A (en) * 2022-12-15 2023-03-14 固安翌光科技有限公司 Light emitting device

Also Published As

Publication number Publication date
TW582183B (en) 2004-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees