TW200420667A - Heat conductive silicone composition and shaped article - Google Patents

Heat conductive silicone composition and shaped article

Info

Publication number
TW200420667A
TW200420667A TW092133611A TW92133611A TW200420667A TW 200420667 A TW200420667 A TW 200420667A TW 092133611 A TW092133611 A TW 092133611A TW 92133611 A TW92133611 A TW 92133611A TW 200420667 A TW200420667 A TW 200420667A
Authority
TW
Taiwan
Prior art keywords
silicone composition
conductive silicone
heat conductive
shaped article
mole
Prior art date
Application number
TW092133611A
Other languages
English (en)
Inventor
Masaya Asaine
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200420667A publication Critical patent/TW200420667A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW092133611A 2002-11-29 2003-11-28 Heat conductive silicone composition and shaped article TW200420667A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002346964A JP2004176016A (ja) 2002-11-29 2002-11-29 熱伝導性シリコーン組成物及びその成形体

Publications (1)

Publication Number Publication Date
TW200420667A true TW200420667A (en) 2004-10-16

Family

ID=32376078

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092133611A TW200420667A (en) 2002-11-29 2003-11-28 Heat conductive silicone composition and shaped article

Country Status (4)

Country Link
US (1) US7034073B2 (zh)
JP (1) JP2004176016A (zh)
KR (1) KR100592009B1 (zh)
TW (1) TW200420667A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103507353A (zh) * 2012-06-18 2014-01-15 信越化学工业株式会社 导热性片材和电子设备

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064291A (ja) * 2003-08-14 2005-03-10 Nissan Motor Co Ltd 絶縁シートおよびこの絶縁シートを用いた半導体装置組立体
CN101003685A (zh) * 2006-01-18 2007-07-25 富准精密工业(深圳)有限公司 导热聚硅氧烷组合物
EP1983568B1 (en) 2006-01-26 2014-07-16 Momentive Performance Materials Japan LLC Heat dissipating member and semiconductor device using same
US7407666B2 (en) * 2006-02-23 2008-08-05 Siltech Llc Linear silicone resins in personal care applications
JP5283346B2 (ja) * 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP4656340B2 (ja) * 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
WO2019098290A1 (ja) * 2017-11-17 2019-05-23 富士高分子工業株式会社 二段階硬化型熱伝導性シリコーン組成物及びその製造方法
US11781052B2 (en) 2018-01-31 2023-10-10 Sekisui Polymatech Co., Ltd. Thermally conductive composition and thermally conductive molded body
US12605314B2 (en) 2018-03-23 2026-04-21 LCS Advanced Solutions, LLC Broad-spectrum, mineral, photoprotective compositions
US12083199B2 (en) 2019-09-10 2024-09-10 LCS Advanced Solutions, LLC Mineral, anhydrous, broad-spectrum sunscreen

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL278039A (zh) * 1961-05-05
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3159662A (en) 1962-07-02 1964-12-01 Gen Electric Addition reaction
US3775452A (en) 1971-04-28 1973-11-27 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US6069201A (en) * 1997-09-12 2000-05-30 Shin-Etsu Chemical Co., Ltd. Zinc oxide-filled addition-curable silicone rubber compositions
JP3537384B2 (ja) 2000-07-13 2004-06-14 富士高分子工業株式会社 低硬度放熱シート
JP4435952B2 (ja) * 2000-08-30 2010-03-24 東レ・ダウコーニング株式会社 定着ロール用熱伝導性液状シリコーンゴム組成物およびフッ素樹脂被覆定着ロール
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103507353A (zh) * 2012-06-18 2014-01-15 信越化学工业株式会社 导热性片材和电子设备

Also Published As

Publication number Publication date
KR100592009B1 (ko) 2006-06-21
US20040106717A1 (en) 2004-06-03
JP2004176016A (ja) 2004-06-24
US7034073B2 (en) 2006-04-25
KR20040047715A (ko) 2004-06-05

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