TW200423273A - Fixture for die-pull test - Google Patents

Abstract

A fixture is used for the die-pull test of a flip chip package. The fixture for the die-pull test comprises a first platform and a second platform. The substrate of the flip chip package is plane-mount fixed on the first platform. The chip of the flip chip package is plane-mount fixed on the second platform. The second platform is connected to a testing head of an exterior universal test machine.

Description

200423273 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a wafer bump pulling force of a flip-chip package structure, and a fixture for die-pull test. Then the surface-fixed crystal of a flip-chip package structure is only f

^ °% iiL fixture for force test. [Previous technology] Generally, a Flip Chip Package includes a substrate, a wafer mounted on the substrate using flip-chip technology, and a solder or gold bump to electrically connect the chip. To the substrate. An underfill i 1 1) can be additionally filled between the wafer and the substrate 'to encapsulate the far substrate, the wafer and the bump. In order to understand the reliability of chip-on-chip access, a die bump pull test (die pui i " test) is required. ○ Refer to Figure 1, which shows a jig for a wafer bump pull test, one of the prior art. The flip-chip package structure 15 is firmly fixed on it. The flip-chip package structure 15 has a substrate 14 and a wafer 12 arranged on the substrate 14 through bumps 16. The jig 18 for the wafer bump tensile test has two concave insertions 20 'for clamping both sides of the substrate 14. An adhesive layer 2 4 is coated on the wafer 12 of the double-package structure 15, and the wafer 12 is adhered to a universal testing machine (not shown) — test Head (Testing H ead 〇r J ig) 2 2. B. Referring to FIG. 2, during the test, the test head 22 is driven upwards for the whole month b material testing machine to apply an upward force to the wafer 12. As the test head 22 moves upward, the junction between the wafer and the substrate

200423273 V. Description of the invention (2) structure, such as the bump 16 and the metal layer under the bump (Under Bump

Metallurgy (UBM) (not shown) undergoes tensile stress (tensUe stress) to deform and further break, so that the wafer 12 is separated from the substrate 14. However, the aforementioned jig for testing the tensile strength of the wafer bump 8 only fixes the edge of the substrate 14, so when the substrate 4 is a flexible substrate such as FR-4 and BT resin substrate, the test process In this case, the substrate 14 is bent. In this case, the bump 16 will not only bear the tensile stress in the forward direction, but also the shearing stress. Furthermore, the blue curve of the substrate 14 also causes stress to be concentrated on the peripheral bumps in the bumps 16. Therefore, the data obtained during this test are significantly lower than the actual forward force that the substrate 14 and the wafer 12 can withstand. Moreover, in this configuration, the substrate 4 and the wafer 12 after being tested or broken are fixed on the jig 18, and usually through an optical microscope (OM) or an electron microscope (scanning) electron microscope (SEM) observe the failure mode of the bump 16. However, the operable height of the jig 18 is often matched with the optical microscope or the electron microscope, and observation of the cracking mode cannot be performed. In view of this, there is a need for a jig for a wafer bump tensile test to overcome the foregoing problems. r ',,-[Summary of the invention] An object of the present invention is to provide a jig for testing the tensile strength of a wafer bump, which applies a force to a semiconductor package structure in a surface-fixed manner so as to be correct.

Page 7 200423273 V. Description of the invention (3) Measure the tensile strength of the semiconductor flip-chip package structure. To achieve the above object, the present invention provides a jig, which is applied to a wafer bump tensile test of a flip-chip package structure. The jig for pulling the wafer bump includes a first platform and a second platform. The first platform is fixedly supporting the substrate of the flip-chip package structure. The second platform is connected to the semiconductor wafer of the aa sealed structure of the fixed building, and is connected to a test head of an external universal material testing machine (U n i v e r s a 1 t e s t i n g m a c h i n e). According to the jig for testing the tensile strength of the wafer bump according to the present invention, the semiconductor package structure substrate and the semiconductor wafer are fixedly supported by two platforms. The substrate and semiconductor wafer of the flip-chip package structure are fixed on the platform with the entire surface. Therefore, during the test, the substrate will not be bent or deformed, which will affect the test results. In order to make the above and other objects, features, and advantages of the present invention more obvious, the preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, as follows. [Embodiment] Now referring to Fig. 3, it shows a jig 50 'for a wafer bump tensile test according to the present invention, which is used to perform a wafer bump tensile test f on a flip-chip package structure 55. The flip-chip package structure 55 has a substrate 54 and a semiconductor wafer 52, and is connected to the substrate 54 by a flip-chip technology. The d 4 sa jig tensile test fixture 50 includes a bracket 5 8 and a 1 to 6 fixed platform. The jig for testing the tensile strength of the wafer bump 5 includes a testing platform 64 ′ and a testing head for one of the universal material testing machines.

042.ptd Page 8

200423273 V. Description of the invention (4) J i g) 6 2 phase connection. The two thin plates 70 and 72 can be fixed to the bracket 5 8 and the fixed platform 60 respectively by a fixing member (not shown) such as a bolt or a fixing device such as a chute. The thin plates 70, 72 are made of a rigid material, such as steel. An adhesive layer 68 is coated on the thin plate 72 to adhere the substrate 5 4 of the flip-chip package structure 5 5 to the thin plate 72, so that the substrate 5 4 can be mounted on the fixed platform 6. 0 on. An adhesive layer 6 6 is coated on the thin plate 70. The semiconductor wafer 5 2 is used to adhere the flip-chip package structure 5 5 to the thin plate 70. In this way, the semiconductor wafer 52 can be mounted on the thin plate 70. The test platform 64.

Referring to FIG. 4, during the test, the test head 62 is driven upwards by the universal material testing machine, so as to apply upward force to the wafer 52. As the test head 62 moves upward, the components between the wafer 52 and the substrate 54 such as a plurality of solder bumps or gold bumps 56 and an under bump metallurgy (UBM) (Not shown in the figure), undergoes tensile stress and deforms, and further breaks, so that the wafer 52 is separated from the substrate 54. During the test, the displacement and force of the test head 62 will be recorded, and the wafer bump tensile test is completed. In addition, in this configuration, the separated wafer 52 and the substrate If are still adhered to the thin plate 70 and the thin plate 72 through the adhesive layer 66 and the adhesive layer 68 respectively. The substrate 54 and the wafer 52 can be placed together with the thin plate 70 and the thin plate 7 2 ′ in an optical microscope (〇 p t i c a 1 microscope; 0M) or an scanning electron microscope (SEM).

'Tooth 42.pt d p. 9 200423273 V. In the description of the invention (5), observe the failure mode (f a i 1 u r e m 〇 d e) of the σ hai complex structure 5 5. 5 and 6 of the tea test are shown, which show a jig 80 for a wafer bump pull test according to another embodiment of the present invention, which is used to perform a wafer bump pull test on a flip-chip package structure 85. The jig 80 of the wafer bump tensile test is similar to the jig 50 of the wafer bump tensile test, and similar elements are marked with similar drawing numbers. The jig 8 of the wafer bump tensile test includes a fixed suction cup 90, having a plurality of channels 98 connected to an external vacuum source (not shown in the figure) for the substrate 84 of the flip-chip package structure 85. The lubricating lugs of the fixed sucker 90 and the lugs of the sun-chips are pulled and connected to a universal material test J ig) 92. The vacuum source (not shown in the figure) & the body wafer 82 is attracted to the substrate and semiconductor disk of the chip-on-chip package structure as described above. Therefore, the deformation that affects the limit test of the test bench, the bonding layer of the flip chip package, and the suction cup 8 also includes a test head (Testing Head or Test Sucker 94 having a plurality of test heads). The channel 96 is connected to the phase for mounting the flip-chip package structure 85 on the test chuck 94. The pull-test of the wafer bump of the present invention is tested on the surface and fixed. "The surface is fixed", in the course of the Pingge process, "the substrate will not produce soil, and the fruit will be able to be understood by the artist. The method of fixing the surface of the chamber is not the one previously described. Equipped with a construction table or suction bend or 'the flat said

Although the foregoing descriptions and illustrations have been disclosed, various additions, modifications, and selections must be understood. Γ-N shows a preferred embodiment of the present invention, and may be used in the present invention.

200423273 V. Description of the invention (6) Examples without departing from the spirit and scope of the principle of the invention as defined by the scope of the attached patent application. Those skilled in the art will appreciate that the present invention may be modified for many forms, structures, arrangements, proportions, materials, elements and components. Therefore, the embodiments disclosed herein should, in all respects, be considered to illustrate the present invention, rather than to limit the present invention. The scope of the present invention should be defined by the scope of the appended patents and the legal equivalents thereof, and is not limited to the previous description.

®2.ptd Page 11 200423273 Brief description of the drawings [Simplified description of the drawings] Figure 1: The side view of the jig for the wafer bump tensile test of the prior art. Figure 2: This is a side view of the jig for the wafer bump tensile test of the prior art during the test. FIG. 3 is a schematic side view of a jig for a wafer bump tensile test according to an embodiment of the present invention. Fig. 4 is a schematic side view of the jig for the wafer bump tensile test in Fig. 3 during the test. Tuli pull block lug crystal one example of implementation 1 Another Mingfa root is based on the schematic side of the schematic diagram 丨 test the first test is based on the test of the pull pull tab crystal That. In the figure, the middle side of the test piece is shown through the concave groove of the test piece 2 Ba ο 11 0 / W The tensile force of the test piece with convex force is used to build a convex seal: the plate crystal plate is clear and the crystal base is convex ^ 8 5 4 6 port 3 1X 11 1X 11 Figure

0tf642.ptd Page 12 200423273

^ 2.ptd Page 13 Brief description of drawings 24 Adhesive layer 22 Test head 50 Jig for wafer bump tensile test 52 Semiconductor wafer 54 Substrate 55 Flip-chip package structure 56 Bump 58 Bracket 60 Fixed platform 62 Test head 64 Test platform 66 Adhesive layer 68 Adhesive layer 70 Thin plate 72 Thin plate 80 Jig for wafer bump tensile test 82 Semiconductor wafer 84 Substrate 85 Chip-on-chip package structure 86 Bump 88 Bracket 90 Fixed suction cup 92 Test head 94 Test suction cup 96 Channel 98 aisle

Claims (1)

200423273 VI. Application Patent Scope 1. A chip bump tensile test, manufactured by Λ. The flip-chip package structure has one, 'Applied to a flip-chip package structuring technology configured on the substrate, and today t H semiconductor wafers' borrow The cover includes: a jig for testing the tensile strength of the bumps, a first platform; a first thin plate, which can be removably arranged on a fixed 5-supporting chip-on-chip packaging structure, and the substrate to a thousand brothers' 1,000 And toting machine with one outside) < — if this material testing machine (Universal-the second sheet, the head is connected; and the fixed support for the cover is enclosed on the second platform for m days The semiconductor wafer structured by the Japanese seal. 2. According to the first sheet and the second sheet extension in the first patent application scope: a jig for the door block wide-band tensile test, the sheet is made of a rigid material. 3. According to the first sheet of the scope of the patent application, the jig for the tensile test of the first thin plate and the second thin human bump is made of steel (stee 1). 4. The chip according to item 1 of the scope of patent application The bump contains one brother and one stick , Tian, j 〇 type jigs, also on the first-sheet. The substrate of the flip-chip package structure is adhered to the chip bump pulling force column of the first claim / patent scope of the first, or The semiconductor wafer Wm.ptd of the flip-chip package structure. Page 14 200423273 6. The patent application scope sheet is adhered to the second sheet. 6. A method for testing the tensile force of a wafer bump, including the following steps: providing a flip-chip package Structure, having a substrate and a semiconductor wafer, which are arranged on the substrate by flip-chip technology; providing a first platform: providing a first thin plate detachably arranged on the first platform for fixedly supporting the building The substrate of the flip-chip package structure provides a second platform; a second thin plate is provided detachably on the second platform for surface-fixingly supporting the semiconductor wafer of the flip-chip package structure; and One of the first platform and the second platform applies a force to make it move relative to the other. 7. According to the method for testing the tensile strength of the wafer bumps according to item 6 of the patent application scope, the other package Steps: Record the acting force and the relative displacement between the first platform and the second platform ° 8. According to the method for testing the tensile strength of a wafer bump according to item 6 of the patent application, wherein the first sheet has a first adhesion A layer for adhering the substrate of the flip-chip package structure to the first platform. 9. According to the method for testing the tensile force of a wafer bump according to item 6 of the patent application scope, which 00 ^ 42.ptd Page 15 200423273 6. In the scope of the patent application, the second sheet further has a second adhesive layer for adhering the semiconductor wafer constructed by the flip-chip package to the second platform. 10. The method for testing the tensile strength of a wafer bump according to item 6 of the patent application scope, further comprising the steps of: providing an optical microscope (opt i cal microscope; 0M) for observing the first thin plate and the substrate and the first thin plate; The two thin plates are parallel to the semiconductor wafer. 11. The method for testing the tensile strength of a wafer bump according to item 6 of the patent application scope, further comprising the steps of: providing an scanning electron microscope (SEM) for observing the first thin plate, the same as the substrate and the second The thin plate is the same as the semiconductor wafer. 1 2. A jig for testing the tensile strength of a wafer bump, which is applied to a flip-chip package structure having a substrate and a semiconductor wafer, which are arranged on the substrate by a flip-chip technology, and the wafer bump The jig for the tensile test includes: "a" first substrate 'for planarly supporting the flip-chip package structure " ^ substrate; and a second platform'for planarly supporting the flip-chip package structure. The semiconductor wafer is connected to a test head of an external universal testing machine. 00642.ptd Page 16 200423273 VI. Patent application scope 1 3. Fixture for wafer bump tensile test according to item 12 of the patent application scope. It also includes a first adhesive layer for the chip-on-package structure. The substrate is adhered to the first platform. 14. The jig for testing the tensile strength of a bump of a wafer according to item 12 of the patent application scope further includes a second adhesive layer for adhering the semiconductor wafer of the flip-chip package structure to the second platform. 15. The jig for testing the tensile strength of a bump of a wafer according to item 12 of the patent application scope, wherein the first platform has a suction cup for supporting the substrate of the flip-chip package structure. 16. The jig for testing the tensile strength of a bump of a wafer according to item 12 of the scope of patent application, wherein the second platform has a suction cup for supporting the semiconductor wafer of the flip-chip package structure. 17. A method for testing the tensile strength of a wafer bump, comprising the following steps: providing a flip-chip package structure with a substrate and a semiconductor wafer, which are arranged on the substrate by flip-chip technology; providing a first platform with a surface fixed support The substrate of the flip-chip package structure; providing a second platform for surface-supporting the semiconductor wafer of the flip-chip package structure; and 00842.ptd Page 17 200423273 VI. Scope of patent application Apply a force to one of the first platform and the second platform to make it move relative to the other. 18. According to the method for testing the bump bump tensile force according to item 17 of the patent application scope, the method further includes the steps of: recording the force and the relative displacement between the first platform and the second platform. 19. The method for testing the tensile strength of a bump of a wafer according to item 17 of the scope of patent application, wherein the first platform further has a first adhesive layer for adhering the substrate of the flip-chip package structure to the first platform. on. 20. The method for testing the tensile strength of a bump of a wafer according to item 17 of the scope of patent application, wherein the second platform further has a second adhesive layer for adhering the semiconductor wafer of the flip-chip package structure to the second on the platform. 2 1. The method for testing the tensile strength of a bump of a wafer according to item 17 of the patent application scope, wherein the first platform further has a suction cup for supporting the substrate of the flip-chip package structure. 2 2. According to the method for testing the bump bump tensile force according to item 17 of the patent application scope, wherein the second platform further has a suction cup for supporting the semiconductor wafer of the flip-chip package structure. Fc.ptd Page 18