200423474 (1) 玖、發明說明 【發明所屬之技術領域】 本發明是關於能在平面黏貼設置由導體所構成的電路 之黏貼式電路。且，本發明是關於具備用來將該黏貼式電 路黏貼設置於平面的黏貼式電路之黏貼式電路薄片與其製 造方法。本發明是適用於對於汽車的窗玻璃、住家·大樓 等的窗玻璃、其他的對象（製品、製品的零件、設備、住 家等的構造物）之安裝面，黏貼設置預定用途的電路。本 發明之作爲對象的電路是被最廣義地解釋者，包含各種用 途的天線、加熱器、揚聲器、其他所有用途的電氣、電子 電路。 【先前技術】 以往，爲了信號接收收音機電波、電視電波等的電波 ，而進行：在汽車的窗玻璃面黏貼具有接著劑層的天線薄 片。在專利文獻1即揭示該天線薄片的一例。 【專利文獻1】日本特開200 1 -119219號公報 說明此天線薄片的結構。如第1 5圖所示，在透明的 基材薄片1 〇〇的表面，以網板印刷機來將以銀等爲主成分 之導電性糊狀物印刷成天線形狀的圖案後形成天線元件 1 〇 1，在其端部形成端子部1 02。其次，如第1 6圖所示， 在天線元件1 〇 1上，以較其線寬更大的寬度，以防水及絕 緣爲目的形成保護層103。進一步以防護薄膜104覆蓋天 線元件101、端子部104，而被覆基材薄片100的表面。 -4 ~ (2) 200423474 然後，在基材薄片之未形成有天線元件1 〇 1的 著劑105設置樹脂薄片106，進一步在樹脂薄 黏著層107設置剝離薄片108。 爲了將具有該結構的天線元件之基材薄片 著體，而剝離剝離薄片108，以黏著層107黏 體即可。若以適當材質的黏著物質來構成此黏 話，即使在將具有天線元件之基材薄片黏著於 ，也能夠容易將其由被黏著體剝離，或在黏著 。因此，形成容易修正已黏著的具有天線元件 的位移、或移動至其他的汽車之窗玻璃。 【發明內容】 〔發明所欲解決之課題〕 但，若根據以往的具有天線元件之基材薄 於即使基材薄片100爲透明，其反射率也與窗 故會有容易確認基材薄片1 〇〇的外形，而黏貼 1 00之區域的視野變差之問題。例如，如第1 當在汽車的窗玻璃110設置具有天線元件之基 況時，也能夠想到受到其設置位置而不易透: 100的部分來觀察窗外，且在外觀上也不理想< 因此，本發明的目的是在於：提供一種容 璃面的設置面，並且設置後的外觀良好，特別 玻璃面的情況時，不會有遮住其視野的黏貼式 設置該黏貼式電路之黏貼式電路薄片及該黏貼 面經由強黏 片106經由 黏貼於被黏 貼於被黏著 著層107的 被黏著體後 至被黏著體 之基材薄片 片的話，由 玻璃不同， 有基材薄片 7圖所示， 材薄片的情 過基材薄片 > 易設置於玻 是在設置於 電路、用來 式電路薄片 -5- (3) 200423474 的製造方法。 〔用以解決課題之手段〕 申請專利範圍第1項之黏貼式電路，其 :由形成預定形狀導體材料所構成的配線部 的單側的面安裝於安裝面之黏著層。 若根據申請專利範圍第1項的黏貼式電 在配線圖案形狀之配線部以外不會有覆蓋隱 件，所以外觀良好，特別是安裝面爲玻璃面 會有妨礙穿過玻璃之視野的情事產生。 申請專利範圍第2項之黏貼式電路薄片 具有：由預定形狀的導體材料所構成的配線 黏著層來設置於該配線部的一面側之基材、 著層來設置於該配線部的另一面之剝離薄片 若根據申請專利範圍第2項之黏貼式電 則因形成以基材與剝離薄片來夾持配線圖案 之結構，所以處理容易。 申請專利範圍第3項之黏貼式電路薄片 利範圍第2項之黏貼式電路薄片，其中對於 安裝面之前述第2黏著層的黏著力是較對於 一面側之前述第1黏著層的黏著力更大。 若根據申請專利範圍第3項之黏貼式電 當使用時，藉由剝離剝離薄片後將配線部側 ，剝離基材僅將配線部殘留於安裝面，使得 特徵爲：具備 、將該配線部 路的話，則因 藏安裝面的構 的情況時，不 ，其特徵爲： 部、經由第1 及經由第2黏 c 路薄片的話， 形狀的配線部 ，是就申請專 前述配線埠的 前述配線部的 路薄片的話， 黏貼於安裝面 能夠容易在安 -6 - (4) 200423474 裝面設置前述黏貼式電路。 申請專利範圍第4項之黏貼式電路薄片，是就申請專 利範圍第3項之黏貼式電路薄片，其中前述配線部爲長體 狀，其前述基材側的面形成凸面。200423474 (1) 发明. Description of the invention [Technical field to which the invention belongs] The present invention relates to a stick-type circuit capable of sticking a circuit made of a conductor on a plane. Further, the present invention relates to an adhesive circuit sheet having an adhesive circuit for adhering the adhesive circuit to a flat surface and a method for manufacturing the same. The present invention is suitable for attaching a circuit for a predetermined application to the mounting surface of a window glass of an automobile, a window glass of a house or a building, or other objects (products, parts of products, equipment, structures of a house, etc.). The circuit targeted by the present invention is explained in the broadest sense, and includes various uses of antennas, heaters, speakers, and all other electrical and electronic circuits. [Prior art] In the past, in order to receive radio waves such as radio waves and television waves, a signal was carried out: an antenna sheet having an adhesive layer was pasted on a window glass surface of a car. An example of the antenna sheet is disclosed in Patent Document 1. [Patent Document 1] Japanese Patent Application Laid-Open No. 200 1-119219 describes the structure of this antenna sheet. As shown in FIG. 15, a screen printing machine is used to print a conductive paste containing silver as a main component on the surface of the transparent substrate sheet 100 to form an antenna-shaped pattern. 〇1, a terminal portion 102 is formed at an end portion thereof. Next, as shown in FIG. 16, a protective layer 103 is formed on the antenna element 101 with a width larger than its line width for the purpose of waterproofing and insulation. The antenna element 101 and the terminal portion 104 are further covered with a protective film 104 to cover the surface of the base material sheet 100. -4 ~ (2) 200423474 Then, a resin sheet 106 is provided on the adhesive agent 105 on which the antenna element 101 is not formed, and a release sheet 108 is further provided on the resin thin adhesive layer 107. In order to adhere the base material sheet of the antenna element having this structure to the body, the release sheet 108 may be peeled off and the adhesive layer 107 may be used to adhere the body. If the adhesive is made of an adhesive material of an appropriate material, even if the substrate sheet having the antenna element is adhered to the substrate, it can be easily peeled off from the adherend or adhered. Therefore, it is easy to correct the displacement of the attached antenna element, or to move it to another automobile window glass. [Summary of the Invention] [Problems to be Solved by the Invention] However, if the substrate with a conventional antenna element is thinner than the substrate sheet 100 even if the substrate sheet 100 is transparent, the reflectance and window will be easily confirmed. 1 〇 appearance, but the problem of poor visibility in the area pasted 100. For example, as the first example, when an antenna element is installed on the window glass 110 of an automobile, it is also conceivable that it is difficult to see through the part where it is placed: 100 parts to look outside the window, and the appearance is not ideal. Therefore, The object of the present invention is to provide a setting surface of a glass surface, and the appearance after the installation is good, especially in the case of a glass surface, there is no sticky circuit sheet for sticking the sticky circuit to cover the field of vision. When the adhesive surface is adhered to the adherend to be adhered to the adherent layer 107 through the strong adhesive sheet 106 via the adhesive sheet 106, the substrate sheet is different from glass, as shown in FIG. The sheet is made of a base sheet > It is easy to install in a glass. It is a method for making a circuit sheet in a circuit. (3) 200423474. [Means to Solve the Problem] The adhesive circuit of the scope of application for patent No. 1 is an adhesive layer in which one side of a wiring portion made of a conductive material having a predetermined shape is mounted on a mounting surface. According to the patent application No. 1 of the scope of patent application, there will be no hidden cover other than the wiring part of the wiring pattern, so the appearance is good, especially if the mounting surface is a glass surface, which may hinder the view through the glass. The adhesive circuit sheet according to item 2 of the patent application includes a substrate having a wiring adhesive layer made of a conductive material of a predetermined shape provided on one side of the wiring portion, and a layer provided on the other side of the wiring portion. If the peeling sheet is based on the adhesive type electric power according to the second item of the patent application, it is easy to handle because it has a structure in which the wiring pattern is sandwiched between the substrate and the peeling sheet. The adhesive circuit sheet of the patent application scope item 3, the adhesive circuit sheet of the scope item 2, wherein the adhesive force to the aforementioned second adhesive layer on the mounting surface is more than the adhesive force to the aforementioned first adhesive layer on one side. Big. If the adhesive type electric power according to item 3 of the patent application range is used, the wiring part side is peeled off after the release sheet is peeled off, and only the wiring part is left on the mounting surface by peeling off the base material, so that the characteristics are: If it is, the structure of the mounting surface is hidden. No, it is characterized by: the wiring section with the shape of the first and the second adhesive sheet through the second, the wiring section is the aforementioned wiring section that applies for the aforementioned wiring port. If it is a thin sheet, it can be easily attached to the mounting surface, and the aforementioned adhesive circuit can be easily installed on the mounting surface of An-6-(4) 200423474. The adhesive circuit sheet of the patent application No. 4 is the adhesive circuit sheet of the patent application No. 3, wherein the wiring portion is long and the surface on the substrate side is convex.
若根據申請專利範圍第4項的黏貼式電路薄片的話， 因配線部呈凸狀，所以與經由第1黏著層的基材之接觸面 積小，配線部與基材的黏著力小。因此，能夠在剝離剝離 薄片黏貼於安裝面後，能以小的阻抗進行由已黏著於安裝 面的配線部剝離基材之操作。 申請專利範圍第5項之黏貼式電路薄片，是就申請專 利範圍第3項之黏貼式電路薄片，其中前述配線部的前述 基材側之面受到光反射率低的材料所覆蓋。According to the adhesive circuit sheet according to item 4 of the scope of patent application, since the wiring portion is convex, the contact area with the substrate through the first adhesive layer is small, and the adhesion between the wiring portion and the substrate is small. Therefore, after the peeling and peeling sheet is adhered to the mounting surface, the operation of peeling the substrate from the wiring portion already adhered to the mounting surface can be performed with a small resistance. The adhesive circuit sheet of the patent application No. 5 is the adhesive circuit sheet of the patent application No. 3, wherein the surface of the substrate side of the wiring portion is covered with a material having a low light reflectance.
若根據申請專利範圍第5項的黏貼式電路薄片的話， 因基材被除去所以外觀良好，又在由安裝面側觀察配線部 的情況時，因由來自於配線部之無用的反射光少，所以進 一步使外觀變得良好。 申請專利範圍第6項之黏貼式電路薄片，是就申請專 利範圍第3項之黏貼式電路薄片，其中前述基材是以光透 過性的材料來構成。 若根據申請專利範圍第6項之黏貼式電路薄片的話， 在剝離剝離薄片後將基材黏貼於安裝面的情況時，因能夠 透過光透過性的基材來確認配線部，所以能夠正確地進行 對於安裝面之配線部的定位。 申請專利範圍第7項之黏貼式電路薄片，是就申請專 (5) 200423474 利範圍第3項之黏貼式電路薄片，其中前述配線部與前述 剝離材之間經由第3黏著層設置樹脂薄片層。According to the adhesive circuit sheet according to item 5 of the scope of patent application, the appearance is good because the substrate is removed, and when the wiring part is viewed from the mounting surface side, there is less unnecessary reflected light from the wiring part, so The appearance is further improved. The adhesive circuit sheet of the patent application No. 6 is the adhesive circuit sheet of the patent application No. 3, wherein the aforementioned substrate is made of a light-transmitting material. According to the adhesive circuit sheet according to item 6 of the scope of patent application, when the substrate is adhered to the mounting surface after the release sheet is peeled off, the wiring portion can be confirmed through the light-transmissive substrate, so it can be performed correctly. For the positioning of the wiring part on the mounting surface. The patented adhesive circuit sheet for item 7 of the patent scope is the adhesive circuit sheet for patent application (5) 200423474 for the adhesive sheet of item 3, wherein a resin sheet layer is provided between the wiring portion and the release material via a third adhesive layer. .
若根據申請專利範圍第7項之黏貼式電路薄片的話， 若以作爲第3黏著層的強黏著層來接著配線部與樹脂薄片 ’以具有再剝離性及再黏貼性的第2黏著層來黏貼樹脂薄 片與剝離薄片的話，則即使再將黏貼式電路薄片黏著於被 黏著體後，也能夠容易將其由被黏著體剝離，或再黏著至 被黏著體。因此，形成容易修正已黏著的具有天線元件之 基材薄片的位移、或移動至其他的汽車之窗玻璃。 申請專利範圍第8項之黏貼式電路薄片的製造方法， 其特徵爲：藉由沖壓在導體層的一方的面經由黏著層設置 剝離薄片之導電體薄片，來形成配線部，在前述配線部的 導體層側黏貼具備具有其他黏著層的透光性之薄片狀基材 ’除去前述配線部的剝離薄片，並且在前述配線部的一方 的面之黏著層與前述基材的其他的黏著層黏貼其他剝離薄According to the adhesive circuit sheet according to item 7 of the scope of patent application, if a strong adhesive layer is used as the third adhesive layer, then the wiring portion and the resin sheet are adhered with a second adhesive layer having re-peelability and re-adhesion. If the resin sheet and the release sheet are adhered to the adherend, the adhesive circuit sheet can be easily peeled from the adherend or adhered to the adherend. Therefore, it is easy to correct the displacement of the adhered substrate sheet having the antenna element or to move it to another automobile window glass. The method of manufacturing a sticky circuit sheet according to item 8 of the patent application is characterized in that a wiring part is formed by providing a conductive sheet of a release sheet through an adhesive layer on one side of a conductor layer by punching, The conductor layer side is provided with a light-transmitting sheet-like substrate having another adhesive layer. The peeling sheet of the wiring portion is removed, and the adhesive layer on one side of the wiring portion is adhered to the other adhesive layer of the substrate. Peeling thin
若根據申請專利範圍第8項之黏貼式電路薄片的製造 方法的話’能夠有效率地製造申請專利範圍第2項至第7 項之黏貼式電路薄片。 申請專利範圍第9項之黏貼式電路薄片，是就申請專 利範圍第2至5項中任一項之黏貼式電路薄片，其中在導 體層與前述基材的第1黏著層之間經由第3黏著層來介設 較前述導體層外形更大的保護薄片。 若根據申請專利範圍第9項之黏貼式電路薄片的話， (6) (6)200423474 由於藉由在導體層與前述基材的第1黏著層之間經由第3 黏著層來介設較前述導體層外形更大的保護薄片，在黏貼 於玻璃面等的狀態下，電路的表面及側面受到保護薄片所 包圍的狀態下固定，故可保護電路。 申請專利範圍第1 〇項之黏貼式電路薄片的製造方法 ，其特徵爲：藉由沖壓在導體層的一方的面經由第2黏著 層設置剝離薄片之導電體薄片，來在剝離薄片上形成配線 部，在配線部的表面經由第3黏著層來黏貼保護薄片，將 前述保護薄片沖壓成較前述配線部的外形更大的形狀，由 前述剝離紙上剝離除去對於前述保護薄片的前述配線部之 接合面以外的部分，將具有第1黏著層的具備透光性之薄 片狀基材黏貼於前述配線部側的面，，藉由在剝離紙表面 或夾持於此剝離紙表面與基材之間的狀態下加壓固設於剝 離紙上的配線部及保護薄片，來使對於前述保護薄片的配 線部之突出部分密著於剝離紙的面後加以消泡（ d e f〇 am i ng) ° 若根據申請專利範圍第1 〇項之黏貼式電路薄片的製 造方法的話，能夠有效率地製造申請專利範圍第9項之具 有保護薄片的黏貼式電路薄片，以加上加壓製程，則無間 隙地密著於導體層周圍，且也能夠防止氣泡產生等。 申請專利範圍第1 1項之黏貼式電路薄片的製造方法 ，其特徵爲：藉由沖壓在導體層的一方的面經由第2黏著 層設置剝離薄片之導電體薄片，來在剝離薄片上形成配線 部，另一方面，在薄片狀基材的一方的面經由第1黏著層 -9- (7) (7)200423474 來黏著保護薄片的非黏著面，藉由以因應前述配線部的圖 案形狀之形狀衝壓保護薄片來在前述基材上形成保護薄片 層，藉由重疊前述剝離薄片與前述基材，來在配線部的表 面經由第3黏著層來一體地黏著保護薄片，再藉由加壓來 使對於前述保護薄片的配線部之突出部分密著於剝離紙的 面後加以消泡。 若根據申請專利範圍第1 1項之黏貼式電路薄片的製 造方法的話，能夠有效率地進行用來消泡的加壓製程。 〔發明效果〕 若根據申請專利範圍第1項的黏貼式電路的話，則因 在配線圖案形狀之配線部以外不會有覆蓋隱藏安裝面的構 件，所以外觀良好，特別是安裝面爲玻璃面的情況時，不 會有妨礙穿過玻璃之視野的情事產生。 若根據申請專利範圍第2項之黏貼式電路薄片的話， 則因形成以基材與剝離薄片來夾持配線圖案形狀的配線部 之結構，所以處理容易。 若根據申請專利範圍第3項之黏貼式電路薄片的話， 當使用時，藉由剝離剝離薄片後將配線部側黏貼於安裝面 ，剝離基材僅將配線部殘留於安裝面，使得能夠容易在安 裝面設置前述黏貼式電路。 若根據申請專利範圍第4項的黏貼式電路薄片的話， 因配線部呈凸狀，所以與經由第1黏著層的基材之接觸面 積小，配線部與基材的黏著力小。因此，能夠在剝離剝離 -10- (8) (8)200423474 薄片黏貼於安裝面後，能以小的阻抗進行由已黏著於安裝 面的配線部剝離基材之操作。 若根據申請專利範圍第5項的黏貼式電路薄片的話， 因基材被除去所以外觀良好，又在由安裝面側觀察配線部 的情況時，因由來自於配線部之無用的反射光少，所以進 一步使外觀變得良好。 若根據申請專利範圍第6項之黏貼式電路薄片的話， 在剝離剝離薄片後將基材黏貼於安裝面的情況時，因能夠 透過光透過性的基材來確認配線部，所以能夠正確地進行 對於安裝面之配線部的定位。 若根據申請專利範圍第7項之黏貼式電路薄片的話， 若以作爲第3黏著層的強黏著層來接著配線部與樹脂薄片 ’以具有再剝離性及再黏貼性的第2黏著層來黏貼樹脂薄 片與剝離薄片的話，則即使再將黏貼式電路薄片黏著於被 黏著體後，也能夠容易將其由被黏著體剝離，或再黏著至 被黏著體。因此，形成容易修正已黏著的具有天線元件之 基材薄片的位移、或移動至其他的汽車之窗玻璃。 若根據申請專利範圍第8項之黏貼式電路薄片的製造 方法的話，能夠有效率地製造申請專利範圍第2項至第7 項之黏貼式電路薄片。 若根據申請專利範圍第9項之黏貼式電路薄片的話， 由於藉由在導體層與前述基材的第1黏著層之間經由第3 黏著層來介設較前述導體層外形更大的保護薄片，在黏貼 於玻璃面等的狀態下，電路的表面及側面受到保護薄片所 -11 - 200423474According to the method for manufacturing an adhesive circuit sheet according to item 8 of the patent application range, it is possible to efficiently manufacture the adhesive circuit sheet according to items 2 to 7 of the patent application range. The adhesive circuit sheet of the patent application scope item 9 is an adhesive circuit sheet of any of the patent application scope items 2 to 5, wherein the conductor layer and the first adhesive layer of the aforementioned substrate pass through the third The adhesive layer is used for interposing a protective sheet having a larger shape than the aforementioned conductive layer. According to the adhesive circuit sheet according to item 9 of the scope of patent application, (6) (6) 200423474 because the conductor is interposed between the conductor layer and the first adhesive layer of the substrate through the third adhesive layer to interpose the conductor. The protective sheet with a larger outer shape is fixed in a state where the surface and sides of the circuit are surrounded by the protective sheet in a state of being adhered to a glass surface, etc., so that the circuit can be protected. The method for manufacturing an adhesive circuit sheet of the scope of the patent application No. 10 is characterized in that a conductor sheet of a release sheet is provided by punching on one side of the conductor layer through the second adhesive layer to form wiring on the release sheet. The protective sheet is pasted on the surface of the wiring part via a third adhesive layer, the protective sheet is punched into a shape larger than the external shape of the wiring part, and the bonding of the wiring part to the protective sheet is peeled off and removed from the release paper. A portion of the surface other than the surface is adhered with a light-transmitting sheet-like substrate having a first adhesive layer to the surface on the side of the wiring portion, and is sandwiched between the surface of the release paper or the surface of the release paper and the substrate. The wiring part and the protective sheet fixed on the release paper under pressure are pressed to make the protruding part of the wiring part of the protective sheet adhere to the surface of the release paper and then defoam (defom am ng) ° With the method of manufacturing an adhesive circuit sheet of the scope of patent application No. 10, it is possible to efficiently produce an adhesive with a protection sheet of the scope of patent application No. 9 Circuit sheet to a plus pressing process, the seamless open space around the conductor layer adhesion, bubble generation can be prevented and the like. A method for manufacturing an adhesive circuit sheet according to item 11 of the scope of patent application is characterized in that a conductor sheet of a release sheet is provided by punching on one surface of a conductor layer through a second adhesive layer to form wiring on the release sheet. On the other hand, the non-adhesive surface of the protective sheet is adhered to one side of the sheet-like substrate via the first adhesive layer-9- (7) (7) 200423474, in accordance with the pattern shape of the wiring part. A protective sheet is punched in a shape to form a protective sheet layer on the substrate, and the protective sheet is integrally adhered to the surface of the wiring portion via a third adhesive layer by overlapping the release sheet and the substrate, and then pressed by pressure. The protruding portion of the wiring portion of the protective sheet is brought into close contact with the surface of the release paper and defoamed. According to the method for manufacturing an adhesive circuit sheet according to item 11 of the scope of patent application, a pressurization process for defoaming can be performed efficiently. [Effects of the Invention] According to the sticky circuit according to the first patent application scope, since there is no member covering the mounting surface other than the wiring portion of the wiring pattern shape, the appearance is good, especially the mounting surface is a glass surface. In this case, there will be no situation that hinders the view through the glass. According to the adhesive circuit sheet according to item 2 of the scope of patent application, since a wiring portion having a wiring pattern shape sandwiched between the substrate and the release sheet is formed, handling is easy. According to the adhesive circuit sheet according to item 3 of the scope of patent application, when in use, the wiring part side is adhered to the mounting surface after peeling the release sheet, and the peeling substrate only leaves the wiring part on the mounting surface, making it easy to apply The mounting surface is provided with the aforementioned adhesive circuit. According to the adhesive circuit sheet according to item 4 of the scope of patent application, since the wiring portion is convex, the contact area with the substrate through the first adhesive layer is small, and the adhesion between the wiring portion and the substrate is small. Therefore, after peeling and peeling -10- (8) (8) 200423474, the sheet can be adhered to the mounting surface, and the operation of peeling off the substrate from the wiring portion already adhered to the mounting surface can be performed with a small resistance. According to the adhesive circuit sheet according to item 5 of the scope of patent application, the appearance is good because the substrate is removed, and when the wiring part is viewed from the mounting surface side, there is less unnecessary reflected light from the wiring part, so The appearance is further improved. According to the adhesive circuit sheet according to item 6 of the scope of patent application, when the substrate is adhered to the mounting surface after the release sheet is peeled off, the wiring portion can be confirmed through the light-transmissive substrate, so it can be performed correctly. For the positioning of the wiring part on the mounting surface. According to the adhesive circuit sheet according to item 7 of the scope of patent application, if a strong adhesive layer is used as the third adhesive layer, then the wiring portion and the resin sheet are adhered with a second adhesive layer having re-peelability and re-adhesion. If the resin sheet and the release sheet are adhered to the adherend, the adhesive circuit sheet can be easily peeled from the adherend or adhered to the adherend. Therefore, it is easy to correct the displacement of the adhered substrate sheet having the antenna element or to move it to another automobile window glass. According to the method for manufacturing an adhesive circuit sheet according to item 8 of the patent application scope, it is possible to efficiently manufacture the adhesive circuit sheet according to items 2 to 7 of the patent application scope. According to the adhesive circuit sheet according to item 9 of the scope of patent application, a protective sheet having a larger shape than the conductive layer is interposed between the conductive layer and the first adhesive layer of the substrate through a third adhesive layer. The surface and side of the circuit are protected by a thin sheet in the state of being adhered to a glass surface, etc.-200423474
包圍的狀態下固定，故可更確實地保護電路。 若根據申請專利範圍第1 〇項之黏貼式電路薄片的製 造方法的話，能夠有效率地製造申請專利範圍第9項之具 有保護薄片的黏貼式電路薄片，以加上加壓製程，則無間 隙地密著於導體層周圍，且也能夠防止氣泡產生等。 若根據申請專利範圍第1 1項之黏貼式電路薄片的製 造方法的話，能夠有效率地進行用來消泡的加壓製程。 【實施方式】 參照第1〜7圖說明本發明的實施形態之第1例。 第1圖是爲了在被黏著體的安裝面設置黏貼式電路所 使用的黏貼式電路薄片的平面圖，第2圖是第1圖的A-A 切斷線之擴大斷面圖，第3(a) 、 （b)圖是用來說明黏 貼式電路薄片的製造製程之材料的斷面圖，第4(a)、 (b)圖是用來說明黏貼式電路薄片的製造製成的圖，第 5 (a)圖是用來說明黏貼式電路薄片的製造製成的圖、第 5 ( b )圖是第1圖的B部分的擴大斜視圖，第6 ( a )、 (b)圖是顯示使用黏貼式電路薄片來在安裝面設置黏貼 式電路的製程之製程圖，第7圖是顯示本例的黏貼式電路 設置於汽車的車窗玻璃的狀態之斜視圖。 參照第1及2圖說明本例的黏貼式電路薄片1之構造 如第1圖所示的本例之黏貼式電路薄片1，是藉由具 有透光性的矩形薄片之基材3和與該基材3相同外形的剝 -12- (10) (10) 200423474 離薄片4來分別經由黏著層夾持由導體材料所構成之預定 形狀·圖案的配線部2的構造之薄片狀物。在剝離薄片4 的中央，形成與短邊方向平行之2條平行的細縫，構成帶 狀的細縫部1 5與帶狀的剝離部1 5a。 此構造是爲了作成容易進行將配線部安裝於汽車的車 窗玻璃等之際的處理，在安裝後，僅配線部2黏貼殘留於 安裝面，基材3與剝離薄片4被剝離除去。 第2圖是第1圖的A-A切斷線之擴大斷面圖。在基 材3的下面形成第1黏著層5。此第1黏著層5爲透光性 。在此第1黏著層5，能夠剝離地接著有將導電材料形成 預定配線圖案的配線部2之一面側。在本例，在配線部2 的一面側呈層狀地設置光反射率低的材料。具體而言，塗 佈黑色塗料而形成黑色層6，此黑色層6是接著於基材3 的第1黏著層5。又，在配線部2的另一面側，經由第2 黏者層7設置剝離薄片4。第2黏著層7是光反射性低的 黑色。黏貼於第2黏著層7的剝離薄片4之外形是與基材 3大致相同。如第1圖所示，在剝離薄片4的中央構成與 短邊方向平行的帶狀細縫部15與帶狀剝離部15a，在剝 離薄片4之中能夠僅先將剝離部〗5 a剝離。在第2圖雖未 圖示，但在遠離配線部2的位置，剝離薄片4亦可剝離地 接著於基材3的第1黏著層5。 其次’參照第3〜5圖，說明關於本例的黏貼式電路 薄片1之製造方法與使用材料。 第3 ( a )圖是顯示用來構成配線部2的薄片狀導體 -13- (11) 200423474 層8的斷面圖。在導體層8的一方的面（同圖中之上 面）設有黑色層6。 本例的導電層爲軟銅，其厚度爲0 · 3 5 mm。沖壓 配線部2的細線狀的部分的寬度是根據用途而有所不 但作爲天線來使用的本例之情況時，例如爲〇 .45 mm 長度爲在圖示的最長部分大約300 mm左右。黏著層7 丙烯酸系黏著劑所構成，作成不易反射光的色彩之黑 厚度爲 0.02 〜0.0025 mm。 再者，作爲成爲天線的導電性材質·材料，除了 之外，亦可爲鋁箔、不銹鋼、以鎳•錫•金等加以電 導電材料等。 第3(b)圖是顯示具有透光性的矩形薄片之基 的剖面。再基材3的一面側（同圖中之下側的面）經 著層5設有剝離薄片1 0。 本例的基材3是透明之聚酯系薄膜’厚度爲〇· 〇.1〇腿。黏著層5是由丙烯酸系黏著劑所構成，透明 度爲0.02〜0.025 mm。剝離薄片1〇是單面聚層疊膠 實施剝離處理者，但亦可爲在樹脂薄片實施剝離處理 藉由使用壓力機以預定形狀的模具沖壓第3 ( a )圖 的薄片狀導體層8，來製作如第4(a)圖所示的預定 之配線部2。本例的配線部2是由細線狀的配線2 a、 接於其一端之端子2b所構成，配線2 a項互接近配置 來構成一組的配線部2。It is fixed in the enclosed state, so the circuit can be protected more reliably. According to the manufacturing method of the adhesive circuit sheet of the scope of patent application No. 10, the adhesive circuit sheet with the protection sheet of the scope of patent application No. 9 can be efficiently manufactured, and there is no gap when the pressure process is added. The ground is in close contact with the conductor layer, and air bubbles can be prevented. According to the method for manufacturing an adhesive circuit sheet according to item 11 of the scope of patent application, a pressurization process for defoaming can be performed efficiently. [Embodiment] A first example of an embodiment of the present invention will be described with reference to Figs. 1 to 7. Fig. 1 is a plan view of an adhesive circuit sheet used to install an adhesive circuit on a mounting surface of an adherend, and Fig. 2 is an enlarged cross-sectional view of the AA cutting line in Fig. 1; 3 (a), Figure (b) is a cross-sectional view of the material used to explain the manufacturing process of the adhesive circuit sheet. Figures 4 (a) and (b) are diagrams used to explain the manufacturing of the adhesive circuit sheet. a) The figure is used to explain the manufacturing of the adhesive circuit sheet. The fifth (b) diagram is an enlarged perspective view of the B part of the first diagram, and the sixth (a) and (b) diagrams show the use of the paste. FIG. 7 is a perspective view showing a state in which a sticky circuit is provided on a mounting surface of an automobile by installing a sticky circuit on a mounting surface. The structure of the adhesive circuit sheet 1 of this example will be described with reference to FIGS. 1 and 2. The adhesive circuit sheet 1 of this example shown in FIG. Peeling the same shape of the base material -12- (10) (10) 200423474 Separate the sheet 4 to sandwich the structure of the wiring part 2 of a predetermined shape and pattern made of a conductive material through an adhesive layer, respectively. In the center of the release sheet 4, two parallel slits parallel to the short-side direction are formed to constitute a strip-shaped slit portion 15 and a strip-shaped release portion 15a. This structure is to make it easy to handle the wiring portion when it is mounted on the window glass or the like of an automobile. After the mounting, only the wiring portion 2 is stuck on the mounting surface, and the base material 3 and the release sheet 4 are peeled and removed. Fig. 2 is an enlarged sectional view taken along the line A-A in Fig. 1. A first adhesive layer 5 is formed under the substrate 3. The first adhesive layer 5 is transparent. Here, the first adhesive layer 5 is releasably adhered to one surface side of the wiring portion 2 in which a conductive material is formed into a predetermined wiring pattern. In this example, a material having a low light reflectance is provided in a layered manner on one side of the wiring portion 2. Specifically, the black layer 6 is formed by applying a black paint, and the black layer 6 is a first adhesive layer 5 adhering to the base material 3. A release sheet 4 is provided on the other surface side of the wiring portion 2 via the second adhesive layer 7. The second adhesive layer 7 is black with low light reflectivity. The outer shape of the release sheet 4 adhered to the second adhesive layer 7 is substantially the same as that of the base material 3. As shown in Fig. 1, a strip-shaped slit portion 15 and a strip-shaped stripped portion 15a are formed in the center of the release sheet 4 parallel to the short-side direction, and only the stripped portion 5a can be peeled off first in the stripped sheet 4. Although not shown in FIG. 2, the release sheet 4 may be peeled away from the wiring portion 2 and then adhered to the first adhesive layer 5 of the substrate 3. Next, with reference to Figs. 3 to 5, the manufacturing method and materials used for the adhesive circuit sheet 1 of this example will be described. Fig. 3 (a) is a cross-sectional view showing the sheet-shaped conductor used to form the wiring section 2 -13- (11) 200423474 layer 8. A black layer 6 is provided on one surface of the conductor layer 8 (upper surface in the same figure). The conductive layer in this example is soft copper, and its thickness is 0.35 mm. The width of the thin wire-shaped portion of the punched wiring portion 2 varies depending on the application. In the case of using this as an antenna, for example, it is 0.45 mm in length, which is about 300 mm in the longest portion shown in the figure. Adhesive layer 7 is made of acrylic adhesive. The thickness of black which is not easy to reflect light is 0.02 ~ 0.0025 mm. In addition to the conductive materials and materials used as antennas, in addition to aluminum foil, stainless steel, and electrically conductive materials such as nickel, tin, and gold, etc. may be used. Fig. 3 (b) is a cross section showing the base of a rectangular sheet having translucency. A release sheet 10 is provided on one surface side of the base material 3 (the same as the lower surface in the figure) through the layer 5. The substrate 3 of this example is a transparent polyester film 'having a thickness of 0.10 legs. The adhesive layer 5 is made of an acrylic adhesive and has a transparency of 0.02 to 0.025 mm. The release sheet 10 is a one-sided poly lamination adhesive and is subjected to a release treatment. However, for the resin sheet to be subjected to a release treatment, the sheet-like conductive layer 8 shown in FIG. 3 (a) can be punched out using a press with a mold having a predetermined shape. A predetermined wiring section 2 is produced as shown in FIG. 4 (a). The wiring section 2 of this example is composed of a thin wire-shaped wiring 2 a and a terminal 2 b connected to one end thereof. The items of the wiring 2 a are arranged close to each other to form a group of wiring sections 2.
由如第3 ( b )圖所示的基材3剝離剝離薄片1 C 側的 後的 同， ，其 是由 色， 軟銅 鍍之 材3 由黏 05〜 且厚 合紙 者。 所示 圖案 與連 2條 丨，在 -14- (12) (12)200423474 如第4 ( a )圖所示的已沖壓之配線部2的黑色層6側重 疊接著該基材3的黏著層5。其次，剝離配線部2的剝離 紙9，在配線部2的內側之黏著層7與基材3的黏著層5 ，以與基材3相同的外形（在本例爲矩形），重疊接著具 有前述細縫部1 5及剝離部1 5a之剝離薄片4。在本例， 將已經重疊的基材3與剝離薄片4通過未圖示的一對滾輪 。藉此，獲得在基材3與剝離薄片4之間夾持了配線部2 的薄片狀黏貼式電路薄片1，形成如第4 ( b )圖所示的狀 態。 在本例，根據對於配線部2的安裝面（例如玻璃面） 的黏著層7之黏著力是較根據對於基材3的配線部2的黏 著層5之黏著力大。因此，當剝離剝離薄片4，在玻璃面 等黏貼配線部2後，在將配線部2黏貼殘留於玻璃面的狀 態下，可由玻璃面上的配線部2剝離除去基材3。 在本例，如第5 ( a )圖所示，因藉由一對沖壓模具 12a、12b，來由黑色層6側將薄片狀導體層8沖壓成寬度 窄的細線狀，所以在沖壓時，導體層8變形，直行於其長 方向的剖面之如第5 ( b )圖所示的黑色層6側形成凸狀 之魚糕形狀。因此，黑色層6與前述基材3的接觸形成線 接觸或接近線接觸者，因黏著層5所引起的黏著力是形成 較期望的値小。在於這一點，對於基材3的配線部2之接 著力是形成較對於配線部2的安裝面之接著力小。 其次，參照第6圖說明關於本例的黏貼式電路薄片1 之使用方法。 - 15- (13) (13)200423474 在本例，將天線之黏貼式電路作成作爲黏貼在安裝面 的氣體之前方玻璃（擋風玻璃）的裏面（室內側）者。 首先如第6 ( a )或（b )圖所示’僅剝離剝離薄片4的細 縫部1 5之帶狀剝離部1 5 a。由於基材3爲透明’故如第6 (a )圖所示，能夠由基材3的一面側通過基材3來可見 位於基材3的另一面側之配線部2的黑色層6。如此，一 邊確認配線部2的位置，一邊以手握持基材3，將剝離薄 片4的細縫部1 5朝向玻璃1 1，將配線部2定位於該表面 的期望位置，黏貼對應於細縫部1 5之第1及第2黏著層 5、7 ° 其次，由鄰接於細縫部1 5的部分朝向外側剝離剝離 薄片4的細縫部1 5之一方的單側部分，將第1及第2黏 著層5、7黏貼於前方玻璃1 1。其次，由鄰接於細縫部1 5 的部分朝向外側剝離剝離薄片4的細·縫部1 5之另一方的 單側部分，將第1及第2黏著層5、7黏貼於前方玻璃！] 。藉此，剝離薄片4均被剝離·除去，殘餘的部分黏著殘 留於前方玻璃1 1，而形成如第7 ( a )圖所示的狀態。 如此，在本例，因預先在剝離薄片4的中央部設置細 縫部15與帶狀剝離部15a，首先僅將此帶狀剝離部i5a 剝離後以該部分黏貼於前方玻璃 U，接著，一片片地剝 離細縫部1 5的左右之剝離薄片4的殘留部分，將殘留的 部分逐次黏著於前方玻璃1 1 ’所以黏著性的薄片物之處 理便利，不會有黏貼失敗產生。 其次’如第7 ( b )圖所示，當將基材3剝離時，則 -16- (14) (14)200423474 僅配線部2等殘留於前方玻璃1 1的表面。這是由於根據 對於配線部2的前方玻璃1 1的黏著層7之黏著力較根據 對於基材3的配線部2的黏著層5之黏著力大之故。黏貼 後，在2個端子部2b、2b連接由汽車內所拉繞之未圖示 的配線。 以如上的簡單之程序，能夠如第8圖所示，僅將沒有 薄片的配線部2之天線黏貼設置於前方玻璃1 1的裏面。 因設在前方玻璃1 1者僅有線線狀的配線部2，所以覆蓋 隱藏前方玻璃11的表面之構件的面積較以往的天線薄片 更小，如圖所示，即使在前方玻璃1 1的上方左右兩角設 置2組的天線，即使由室內朝外側透過玻璃觀看的情況， 也不會造成視野的妨礙。因連接於端子2b的配線夾入於 柱內所以不明顯。又，因由室內側可看見配線部2的黑色 層6，所以不易反射光而不明顯。因由室外側可看見黑色 的黏著層7，所以不易反射光而不明顯。如此，本例的黏 貼式電路之配線部2是與本來應透明的玻璃面以大面積黏 貼反射光顯著之薄片般的外觀差之以往的薄片式天線不同 ，整齊且外觀良好。 參照第9圖說明本發明的實施形態的第2例。 在％ 1例，於配線部2設置+ 6，但在本例，沒有黑色 層6。除了由室內側觀看的情況時較黑色的情況稍許明顯 以外’藉由本例也能夠獲得與第1例大致相同的效果。再 者’因配線部2由銅所構成，所以在安裝對象爲近似銅的 的色彩之情況時，不設置黑色層6較能在安裝對象上不使 -17- (15) (15)200423474 配線部2顯眼。 參照第1 〇圖說明本發明實施形態的第3例。 第1 0 ( a )圖是顯示在本例爲了形成配線部2所使用 的薄片狀導體層8之斷面圖。在導體層8的一方的面（同 圖中之下側的面）經由第3黏著層之黑色強黏著層1 2來 設置樹脂薄片層1 3。此樹脂薄片層1 3是由透明的PET所 構成，厚度爲〇.〇5顏。黑色強黏著層12之厚度爲0.02〜 0.02 5 mm。在樹脂薄片層1 3經由另外的黑色黏著層7來設 置剝離薄片4。在此導體層8的另一方的面（同圖中之上 側的面）設有黑色層6。 本例的薄片狀導體層8是除了經由黑色強黏著層1 2 來設置樹脂薄片層13的這一點以外，其餘均與第3 ( a) 圖所示的第1例相同，在對應的部分賦予與第3 ( a )圖 相同的圖號而省略其說明。 第10(b)圖是與第3(b)圖所示者相同之具有透光 性的矩形薄片狀之基材3。 第10(c)圖所示的黏貼式電路薄片la之製造製程 是實質土與第1例相同。即，沖壓第10(a)圖所示的薄 片狀導體層8來製作包含細線狀部分與端子部之配線部2 ，在此配線部的黑色層6側黏貼剝離了剝離薄片1 〇之基 材3，剝離配線部2的剝離薄片9，以與基材3相同的外 形黏貼形成有細縫部的其他剝離薄片4。在除去剝離薄片 4的細縫部後加以黏貼，然後剝離黏貼剝離薄片4之其他 的部分，最後，剝離基材3而僅將配線部2殘留黏貼於前 -18- (16) (16)200423474 方玻璃1 1的方法亦與第1例相同。 若根據本例的話，因經由強黏著層i 2來將樹脂薄片 層1 3黏貼於配線部2，樹脂薄片層1 3反復設置可黏貼· 剝離之弱黏著層7，所以不僅可獲得與第！例相同的效果 ’並且具有配線部2受到樹脂薄片層1 3所補強使得在黏 貼時或基材3的剝離時不易破損之效果。 第1 1 ( a )、（ b )圖是顯示本發明的實施形態之第4 例。 首先’第11 (a)圖是顯示完成了薄片狀之黏貼式電 路薄片1的部分斷面圖。在圖中，配線部2(導體層8) 的構造是經由黏著層7配置於剝離薄片4，並且以保護薄 片20經由第3黏著層1 8覆蓋配線部2的上部及其周圍， 進一步在其上部藉由薄片狀基材3經由第1黏著層5來覆 蓋。 第3黏著層18是具備有與第2黏著層7同等的強黏 著性，在已經剝離基材3的狀態下，前述保護薄片20是 殘留於配線部2的表面。 此保護薄片20是由透明樹脂薄片所構成者，如第1 1 (b )圖所示，沿著配線部2的圖案形狀，較欲覆蓋於此 上面的導體層8之寬度更廣，於在剝離了基材3的狀態而 黏貼於玻璃面等的狀態下，覆蓋配線部2的露出面側的周 圍全體，在此狀態下，保護薄片20的周圍也被黏貼於玻 璃面，進行配線部2的保護’使得耐久性提昇。 使用第]2 ( a)〜（f)圖說明上述具有保護薄片20 - 19- (17) (17)200423474 之黏貼式電路薄片的製造方法之第1例。首先，如第12 (a) 、（b)圖所示，在剝離薄片4經由第2黏著層7來 將導體層8附著於一面’藉由裁剪來以預定圖案形成配線 部2之情事是與前述各實施形態相同。 然後，在配線部2及剝離薄片4的表面全體，如第 12(c)圖所示，經由第3黏著層18來將保護薄片20黏 著於全面，接著如第1 3 ( d )圖所示，在覆蓋配線部2的 圖案之狀態下裁剪成較其寬度更寬廣。 再者，在（d)，圖號22爲沖壓模具的裁剪刀，設置 成：裁剪深度不會到達剝離薄片4的切斷深度，且可完全 切斷保護薄片20。 在切斷後，剝離除去對於保護薄片20的配線部2之 附著處所以外的處所也就是對於剝離薄片4之黏貼處所， 之後，如第12(e)圖的箭號所示，藉由反復進行根據滾 輪等壓實作業等，來消除配線部2的側面與保護薄片20 之間的間隙，一邊密著一邊加以消泡。 當在配線部2的側面與保護薄片20之間殘留有氣泡 時，則不僅透明度降低，使用時外觀變差，並且在黏貼於 汽車的前方玻璃的情況時等亦會妨礙視野，進一步形成剝 離的原因。但，在本例，若由配線部2的側面與保護薄片 20之間充分消除氣泡的話，則不會產生如此之缺點。 然後，如第12 ( f)圖所示，經由第1黏著層5黏貼 薄片狀基材3的話，則完成黏貼式電路薄片1。 再者，根據滾輪之拉伸作業，亦可在形成保護薄片 -20- (18) (18)200423474 2 0的圖案後進行，亦可接著此，在基材3的黏貼作業後 進行。不論在上述何種作業之下，均是以沿著長方向藉由 滾輪等進行壓實作業，來消除配線部2的側面與保護薄片 2 0間之間隙，一邊密著一邊加以消泡。 其次，使用第13、14圖說明具有保護薄片20之黏貼 式電路薄片的製造方法。再者，關於配線部2的形成方法 ，因與第1 2 ( a ) 、（ b )圖相同，所以省略其說明。 一方面，在保護薄片20的第3黏著層18,如第13( a )圖所示，預先附著剝離紙24，以此剝離紙24作爲接 著面側，經由第1黏著層5黏貼於基材3。 然後，藉由如第13(b)圖所示的裁剪製程，以在基 材3上覆蓋前述配線部2的周圍之型式的圖案加以剪裁。 此情況的圖案是形成與前述配線部2的形成圖案呈鏡子對 稱。即，由於接著成使基材3側與剝離薄片4相對面的狀 態，所以形成圖案呈鏡子對稱。 配線部2以外的殘餘處所是如第1 3 ( c )圖所示，由 與基材3的黏著面整個除去剝離紙24 ’並且也除去附著 於配線部2的位置之剝離紙24，藉由與經過前述第1 2 ( a )、（b )圖所示的製程而被加工的配線部2對向定位後 加以黏著，來如第1 3 ( d )圖所示，保護薄片2 0經由第3 黏著層1 8被黏貼於配線部2的表面。 第14(a)圖是顯示其對向狀態’而第14(b)圖是 顯示黏貼狀態，剝離紙4與基材3爲相同的外形尺寸’藉 由精度良好地使配線部2及保護薄片20的圖案形成位置 -21 - (19) (19)200423474 一致，來使得配線部2被黏著於保護薄片2〇的中央位置 〇 再者，在本實施形態，使用日本紙等的柔軟之半透明 薄片作爲基材3，由於在將2個合在一起後，藉由滾輪壓 實作業能夠簡單地使保護薄片20密著於配線部2的側部 ，故作業變得更簡單。 在以上所說明過的各例，舉例說明設在汽車的前方玻 璃作爲黏貼式電路，但安裝對象不僅是汽車的前方ί皮璃亦 可爲其他的玻璃窗，又亦可不是玻璃面。例如，作爲安裝 對象，亦可爲汽車以外的工業製品或其零件、移動式或設 置型的設備、構造物、住家·大樓等的建造物或其一部分 。作爲這些安裝對象的安裝面，若爲能夠進行根據黏著層 之安裝的面的話，金屬面、木質面、或玻璃以外的無機質 面均可，不論其爲平面或曲面。又，作爲黏貼式電路的功 能，不限於天線，若爲能夠發揮預定功能地由作爲預定圖 案之導電線所構成的電路的話即可。在此，所謂該電路是 指除了各種用途的天線以外，尙包含加熱器、揚聲器、以 及其他用途的電氣•電子電路。 【圖式簡單說明】 第1圖是爲了在被黏著體的安裝面設置黏貼式電路所 使用的黏貼式電路薄片的平面圖。 第2圖是第1圖的Α-Α切斷線之擴大斷面圖。 第3(a) 、 （ b )圖是用來說明黏貼式電路薄片的製 -22- (20) (20)200423474 造製程之材料的斷面圖。 第4(a) 、 （b)圖是用來說明黏貼式電路薄片的製 造製成的圖。 第5(a)圖是用來說明黏貼式電路薄片的製造製成 的圖、第5 ( b )圖是第1圖的B部分的擴大斜視圖。 第6(a)圖是顯示使用黏貼式電路薄片來在安裝面 設置黏貼式電路的製程之製程圖，第 6(b)圖是顯示剝 離細縫部的途中之斜視圖。 第7圖是顯示本例的黏貼式電路設置於汽車的車窗玻 璃的狀態之斜視圖。 第8圖是顯示在汽車的前方玻璃設置本例的黏貼式電 路之,;狀態的斜視圖。 第9圖是顯示第2例的圖，相當於第1例之第2圖的 擴大斷面圖。 第1 0 ( a )圖是第3例的薄片狀導體層的斷面圖，第 10(b)圖是3例的矩形薄片之基材的斷面圖，第l〇(c )圖是顯示第3例的圖，相當於第1例的第2圖之擴大斷 面圖。 第11(a)圖是第4例之薄片狀導體層的部分擴大斷 面圖，第1 1 ( b )圖是同斜視圖。 第1 2 ( a )〜（f)圖是顯示第4例之製法的第1例之 製造程序之斷面說明圖。 第〗3 ( a )〜（f)圖是顯示第4例之製法的第2例之 製造程序之斷面說明圖。 -23- (21) (21)200423474 第14(a) 、 （b)圖是用來說明同製造程序之黏合 製成的斜視圖。 第1 5圖是以往的天線薄片之平面圖。 第1 6圖是以往的天線薄片之斷面圖。 第1 7圖是顯示在汽車的前方玻璃設置了以往的天線 薄片的狀態之斜視圖。 〔圖號說明〕 la…黏貼式電路薄片 2…配線部 3…基材 4、9、10…剝離薄片（剝離紙） 5…第1黏著層 6…黑色層 7…第2黏著層 8…導體層 1 1…作爲安裝對象的玻璃（前方玻璃） 1 2…作爲第3黏著層的強黏著層 13…樹脂薄片層 18…第3黏著層 20…保護薄片 -24-As shown in FIG. 3 (b), the substrate 3 is peeled off from the side 1C of the release sheet, which is made of a color, a soft copper plated material 3, and a thick layer of paper. The pattern shown is connected with two pieces 丨 at -14- (12) (12) 200423474 The black layer 6 side of the stamped wiring part 2 as shown in Fig. 4 (a) overlaps the adhesive layer of the substrate 3 5. Next, the release paper 9 of the wiring part 2 is peeled, and the adhesive layer 7 on the inner side of the wiring part 2 and the adhesive layer 5 of the base material 3 have the same outer shape as the base material 3 (a rectangle in this example), and then overlap with The release sheet 4 of the slit portion 15 and the release portion 15a. In this example, the substrate 3 and the release sheet 4 that have been overlapped are passed through a pair of rollers (not shown). Thereby, a sheet-shaped adhesive circuit sheet 1 in which the wiring portion 2 is sandwiched between the base material 3 and the release sheet 4 is obtained, and is formed in a state as shown in FIG. 4 (b). In this example, the adhesive force by the adhesive layer 7 on the mounting surface (for example, the glass surface) of the wiring portion 2 is greater than the adhesive force by the adhesive layer 5 on the wiring portion 2 of the base material 3. Therefore, when the release sheet 4 is peeled off and the wiring portion 2 is adhered to the glass surface, the substrate 3 can be peeled off and removed from the wiring portion 2 on the glass surface while the wiring portion 2 is adhered to the glass surface. In this example, as shown in FIG. 5 (a), the sheet-like conductive layer 8 is punched into a thin, narrow line from the black layer 6 side by a pair of punching dies 12 a and 12 b. The conductor layer 8 is deformed, and the black layer 6 side shown in FIG. 5 (b) of a cross section running straight in its longitudinal direction forms a convex fish cake shape. Therefore, the contact between the black layer 6 and the aforementioned substrate 3 is brought into line contact or is close to the line contact, and the adhesive force caused by the adhesive layer 5 is formed to be smaller than desired. In this regard, the adhesion force to the wiring portion 2 of the base material 3 is smaller than the adhesion force to the mounting surface of the wiring portion 2. Next, a method of using the adhesive circuit sheet 1 of this example will be described with reference to FIG. 6. -15- (13) (13) 200423474 In this example, the antenna-type adhesive circuit is made as the inside (indoor side) of the front glass (windshield) that is attached to the gas on the mounting surface. First, as shown in Fig. 6 (a) or (b), 'only the strip-shaped peeling portion 15a of the slit portion 15 of the peeling sheet 4 is peeled. Since the base material 3 is transparent, as shown in FIG. 6 (a), the black layer 6 of the wiring portion 2 on the other side of the base material 3 can be seen through the base material 3 from one side of the base material 3. In this way, while confirming the position of the wiring portion 2, while holding the substrate 3 with a hand, the slit portion 15 of the release sheet 4 is directed toward the glass 11 and the wiring portion 2 is positioned at a desired position on the surface, and the paste corresponds to the slit portion 1st and 2nd adhesive layers 5 and 7 of 15 ° Next, one side of one of the slit portions 15 of the release sheet 4 is peeled from the portion adjacent to the slit portion 15 toward the outside, and the first and second adhesive layers are adhered. The layers 5 and 7 are adhered to the front glass 1 1. Next, the first and second adhesive layers 5 and 7 are adhered to the front glass by peeling the other one-side portion of the fine slit portion 15 of the release sheet 4 from the portion adjacent to the slit portion 15 toward the outside! ]. Thereby, all the release sheets 4 are peeled and removed, and the remaining portions adhere to the front glass 11 to form a state as shown in Fig. 7 (a). As described above, in this example, since the slit portion 15 and the strip-shaped peeling portion 15a are provided in the central portion of the release sheet 4 in advance, only this strip-shaped peeling portion i5a is peeled off and then adhered to the front glass U with this portion. The remaining portions of the release sheet 4 on the left and right of the slit portion 15 are peeled off, and the remaining portions are sequentially adhered to the front glass 1 1 ′. Therefore, the processing of the adhesive sheet is convenient, and no adhesion failure occurs. Secondly, as shown in FIG. 7 (b), when the base material 3 is peeled off, only -16 and (14) (14) 200423474 remain on the surface of the front glass 11 only. This is because the adhesive force of the adhesive layer 7 to the front glass 11 of the wiring portion 2 is greater than the adhesive force of the adhesive layer 5 to the wiring portion 2 of the base material 3. After the sticking, the two terminal portions 2b and 2b are connected to a wiring (not shown) drawn in the car. With the simple procedure described above, as shown in Fig. 8, only the antenna of the wiring portion 2 without a sheet can be attached to the inside of the front glass 1 1. Because the front glass 11 has only the linear wiring portion 2, the area covering the surface of the front glass 11 is smaller than that of the conventional antenna sheet, as shown in the figure, even above the front glass 11 Two groups of antennas are installed at the left and right corners, and even if the glass is viewed from the room to the outside, it will not cause obstruction to the field of vision. It is not obvious because the wiring connected to the terminal 2b is sandwiched in the post. In addition, since the black layer 6 of the wiring portion 2 is visible from the indoor side, it is difficult to reflect light and is not obvious. Since the black adhesive layer 7 is visible from the outdoor side, it is difficult to reflect light and is not obvious. As described above, the wiring portion 2 of the adhesive circuit of this example is different from the conventional sheet antenna that has a poor appearance like a sheet that has a large area pasting a significant reflection of light on a glass surface that should be transparent, and has a neat and good appearance. A second example of an embodiment of the present invention will be described with reference to Fig. 9. In the% 1 example, +6 is provided in the wiring portion 2, but in this example, the black layer 6 is not provided. Except for the case where it is seen from the indoor side, it is slightly more noticeable than the case where it is black. 'In this example, the same effect as that of the first example can be obtained. Furthermore, since the wiring portion 2 is made of copper, when the installation object is a copper-like color, the absence of the black layer 6 is more suitable for the installation object without wiring -17- (15) (15) 200423474 Department 2 is conspicuous. A third example of the embodiment of the present invention will be described with reference to FIG. 10. Fig. 10 (a) is a cross-sectional view showing the sheet-like conductor layer 8 used in this example to form the wiring portion 2. A resin sheet layer 13 is provided on one surface of the conductor layer 8 (the lower surface in the same figure) through the black strong adhesive layer 12 of the third adhesive layer. This resin sheet layer 13 is made of transparent PET and has a thickness of 0.05 μm. The thickness of the black strong adhesive layer 12 is 0.02 to 0.02 5 mm. A release sheet 4 is provided on the resin sheet layer 13 through another black adhesive layer 7. A black layer 6 is provided on the other surface of the conductor layer 8 (the upper surface in the same figure). The sheet-like conductive layer 8 of this example is the same as the first example shown in Fig. 3 (a) except that the resin sheet layer 13 is provided through the black strong adhesive layer 12, and is provided in the corresponding portion. The same reference numerals as in Fig. 3 (a) are omitted, and the description is omitted. Fig. 10 (b) is a rectangular sheet-like base material 3 having the same light transmittance as that shown in Fig. 3 (b). The manufacturing process of the adhesive circuit sheet la shown in Fig. 10 (c) is substantially the same as that of the first example. That is, the sheet-shaped conductor layer 8 shown in FIG. 10 (a) is punched to produce a wiring portion 2 including a thin line portion and a terminal portion, and a base material on which the release sheet 10 is peeled off and adhered to the black layer 6 side of the wiring portion. 3. The release sheet 9 of the wiring unit 2 is peeled, and the other release sheet 4 having the slits formed thereon is adhered in the same shape as the base material 3. After removing the slits of the release sheet 4 and sticking, then peel and stick the other parts of the release sheet 4, and finally, peel off the base material 3 and stick only the wiring part 2 to the front -18- (16) (16) 200423474 square The method of the glass 11 is also the same as that of the first example. According to this example, since the resin sheet layer 1 3 is adhered to the wiring portion 2 through the strong adhesive layer i 2, the resin sheet layer 13 is repeatedly provided with a weak adhesive layer 7 that can be adhered and peeled off, so not only can it be obtained! The same effect as in the example is used, and the wiring portion 2 is reinforced by the resin sheet layer 13 to make it less likely to be damaged during adhesion or when the substrate 3 is peeled off. Figures 11 (a) and (b) are a fourth example of an embodiment of the present invention. First, Fig. 11 (a) is a partial cross-sectional view showing a sheet-shaped adhesive circuit sheet 1 having been completed. In the figure, the structure of the wiring portion 2 (conductor layer 8) is arranged on the release sheet 4 via the adhesive layer 7, and the upper portion of the wiring portion 2 and its surroundings are covered with the protective sheet 20 via the third adhesive layer 18, and further on it The upper part is covered with the sheet-like substrate 3 via the first adhesive layer 5. The third adhesive layer 18 has the same strong adhesiveness as the second adhesive layer 7, and the protective sheet 20 remains on the surface of the wiring portion 2 in a state where the substrate 3 has been peeled off. This protective sheet 20 is made of a transparent resin sheet. As shown in FIG. 1 (b), the pattern shape of the wiring portion 2 is wider than the width of the conductor layer 8 to be covered thereon. In a state where the substrate 3 is peeled off and adhered to the glass surface, the entire periphery of the exposed surface side of the wiring portion 2 is covered. In this state, the periphery of the protective sheet 20 is also adhered to the glass surface to perform the wiring portion 2. 'Protection' makes durability improved. The first example of the method for manufacturing the above-mentioned adhesive circuit sheet having the protective sheet 20-19- (17) (17) 200423474 will be described with reference to Figs. 2 (a) to (f). First, as shown in Figs. 12 (a) and (b), the case where the conductor layer 8 is attached to one side through the second adhesive layer 7 on the release sheet 4 is formed by cutting to form the wiring portion 2 in a predetermined pattern. The foregoing embodiments are the same. Then, on the entire surface of the wiring portion 2 and the release sheet 4, as shown in FIG. 12 (c), the protective sheet 20 is adhered to the entire surface via the third adhesive layer 18, and then as shown in FIG. 1 (d). In the state of covering the pattern of the wiring portion 2, it is cut to be wider than its width. Further, in (d), reference numeral 22 is a cutting blade of a stamping die, and is set so that the cutting depth does not reach the cutting depth of the release sheet 4 and the protective sheet 20 can be completely cut. After the cutting, peel off and remove the attachment place to the wiring portion 2 of the protective sheet 20, and the outer place is also the sticking place to the release sheet 4. After that, as shown by the arrow in FIG. Compaction work, such as a roller, is performed to eliminate the gap between the side surface of the wiring portion 2 and the protective sheet 20, and to defoam while adhering. When air bubbles remain between the side surface of the wiring portion 2 and the protective sheet 20, not only the transparency is reduced, but the appearance is deteriorated during use. In addition, when it is adhered to the front glass of the car, it also hinders the field of vision and further forms a peeling. the reason. However, in this example, if the air bubbles are sufficiently eliminated between the side surface of the wiring portion 2 and the protective sheet 20, such a disadvantage does not occur. Then, as shown in Fig. 12 (f), when the sheet-like substrate 3 is adhered via the first adhesive layer 5, the adhesive circuit sheet 1 is completed. In addition, the stretching operation of the roller may be performed after the pattern of the protective sheet -20- (18) (18) 200423474 2 0 is formed, or it may be performed after the adhesion operation of the substrate 3. Regardless of the above-mentioned operation, the compaction operation is performed by a roller or the like in the long direction to eliminate the gap between the side surface of the wiring portion 2 and the protective sheet 20, and to defoam while adhering. Next, a method for manufacturing an adhesive circuit sheet having a protective sheet 20 will be described with reference to Figs. The method of forming the wiring portion 2 is the same as that shown in FIGS. 1 2 (a) and (b), and a description thereof will be omitted. On the other hand, as shown in FIG. 13 (a), the third adhesive layer 18 of the protective sheet 20 is previously attached with a release paper 24, and the release paper 24 is used as a bonding surface side, and is adhered to the substrate through the first adhesive layer 5. 3. Then, by a cutting process as shown in FIG. 13 (b), a pattern of a pattern covering the periphery of the wiring portion 2 on the base material 3 is cut. In this case, the pattern is formed to be mirror-symmetrical to the formation pattern of the wiring portion 2 described above. That is, since the substrate 3 is in a state where the side of the substrate 3 and the release sheet 4 face each other, the formation pattern is mirror-symmetrical. As shown in FIG. 1 3 (c), the remaining space other than the wiring section 2 is to remove the release paper 24 ′ from the entire adhesive surface with the substrate 3 and also to remove the release paper 24 attached to the position of the wiring section 2. The wiring part 2 which has been processed through the process shown in Figs. 12 (a) and (b) is positioned opposite to the wiring part 2 and then adhered, as shown in Fig. 13 (d), the protective sheet 20 passes through the first 3 The adhesive layer 1 8 is adhered to the surface of the wiring portion 2. Fig. 14 (a) shows the facing state, and Fig. 14 (b) shows the sticking state. The release paper 4 and the substrate 3 have the same outer dimensions. 'The wiring section 2 and the protective sheet are accurately formed by precision. The pattern formation position of 20 is-21-(19) (19) 200423474, so that the wiring portion 2 is adhered to the central position of the protective sheet 20. Furthermore, in this embodiment, a soft translucent such as Japanese paper is used. The sheet is used as the base material 3, and since the two sheets are brought together, the protective sheet 20 can be easily adhered to the side of the wiring portion 2 by roller compaction operation, so that the operation becomes simpler. In each of the examples described above, the front glass of the car is exemplified as an adhesive circuit, but the installation object is not only the front glass of the car, but also other glass windows, and it may not be a glass surface. For example, the object of installation may be industrial products or parts thereof other than automobiles, mobile or installation-type equipment, structures, structures such as homes and buildings, or a part thereof. As the mounting surface for these mounting objects, if it is a surface that can be mounted by an adhesive layer, a metal surface, a wooden surface, or an inorganic surface other than glass may be used, regardless of whether it is a flat surface or a curved surface. The function of the sticky circuit is not limited to an antenna, and it may be a circuit composed of conductive wires as a predetermined pattern capable of performing a predetermined function. Here, this circuit refers to electrical and electronic circuits that include heaters, speakers, and other uses in addition to antennas for various purposes. [Brief description of the drawings] Fig. 1 is a plan view of an adhesive circuit sheet used for installing an adhesive circuit on a mounting surface of an adherend. Fig. 2 is an enlarged cross-sectional view taken along a line A-A in Fig. 1. Figures 3 (a) and (b) are cross-sectional views of the materials used to explain the manufacturing of the adhesive circuit sheet -22- (20) (20) 200423474. Figures 4 (a) and (b) are diagrams illustrating the manufacturing of the adhesive circuit sheet. Fig. 5 (a) is a diagram for explaining the production of an adhesive circuit sheet, and Fig. 5 (b) is an enlarged perspective view of part B of Fig. 1. Fig. 6 (a) is a process diagram showing a process for installing an adhesive circuit on a mounting surface using an adhesive circuit sheet, and Fig. 6 (b) is a perspective view showing a process of peeling a slit portion. Fig. 7 is a perspective view showing a state where the sticky circuit of this example is installed in a window glass of a car. Fig. 8 is a perspective view showing a state where the adhesive circuit of this example is installed on the front glass of the car. Fig. 9 is a diagram showing a second example, and is an enlarged sectional view corresponding to the second diagram of the first example. Fig. 10 (a) is a cross-sectional view of the sheet-like conductive layer of the third example, Fig. 10 (b) is a cross-sectional view of the base material of the rectangular sheet of the third example, and Fig. 10 (c) is a display The diagram of the third example corresponds to the enlarged sectional view of the second diagram of the first example. Fig. 11 (a) is a partially enlarged sectional view of the sheet-like conductor layer of the fourth example, and Fig. 11 (b) is a perspective view of the same. Figures 12 (a) to (f) are cross-sectional explanatory diagrams showing the manufacturing process of the first example of the manufacturing method of the fourth example. Figures 3 (a) to (f) are sectional explanatory views showing the manufacturing process of the second example of the fourth manufacturing method. -23- (21) (21) 200423474 Figures 14 (a) and (b) are perspective views used to illustrate the bonding with the manufacturing process. Fig. 15 is a plan view of a conventional antenna sheet. Fig. 16 is a sectional view of a conventional antenna sheet. Fig. 17 is a perspective view showing a state where a conventional antenna sheet is installed on a front glass of a car. [Explanation of drawing number] la ... Adhesive circuit sheet 2 ... Wiring part 3 ... Substrates 4, 9, 10 ... Release sheet (release paper) 5 ... First adhesive layer 6 ... Black layer 7 ... Second adhesive layer 8 ... Conductor Layer 1 1 ... glass (front glass) to be mounted 1 2 ... strong adhesive layer 13 as a third adhesive layer 13 resin sheet layer 18 ... third adhesive layer 20 ... protective sheet-24