TW200501231A - Method and apparatus for etching a substrate - Google Patents

Method and apparatus for etching a substrate

Info

Publication number
TW200501231A
TW200501231A TW093115595A TW93115595A TW200501231A TW 200501231 A TW200501231 A TW 200501231A TW 093115595 A TW093115595 A TW 093115595A TW 93115595 A TW93115595 A TW 93115595A TW 200501231 A TW200501231 A TW 200501231A
Authority
TW
Taiwan
Prior art keywords
substrate
treatment tank
etchant
treatment
disposed
Prior art date
Application number
TW093115595A
Other languages
Chinese (zh)
Other versions
TWI243407B (en
Inventor
Satoshi Suzuki
Yukio Tomifuji
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003157433A external-priority patent/JP4156975B2/en
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200501231A publication Critical patent/TW200501231A/en
Application granted granted Critical
Publication of TWI243407B publication Critical patent/TWI243407B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)

Abstract

The invention provides an apparatus that does not require treatment tanks to be large-sized for treating large size substrates. The apparatus is free from defective etching that may occur in the process of immersion treatment. The apparatus comprises: a first treatment tank 14; a first conveying roller 20 that is disposed in the first treatment tank 14, supports and conveys a substrate W; a spray nozzle 22 that is disposed above the substrate conveying passage and sprays an etchant toward the surface of the substrate W; a second treatment tank 28 provided adjacent the first treatment tank 14 side by side; a conveying roller 30 that is disposed in the second treatment tank 28, supports and conveys the substrate W; and a jet nozzle that supplies an etchant to the surface of the substrate W taken out of the first treatment tank 14 and conveyed into the second treatment tank 28, and applies the etchant all over the surface of the substrate W.
TW093115595A 2003-06-03 2004-06-01 Method and apparatus for etching a substrate TWI243407B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003157433A JP4156975B2 (en) 2003-06-03 2003-06-03 Substrate processing equipment
JP2003157434 2003-06-03

Publications (2)

Publication Number Publication Date
TW200501231A true TW200501231A (en) 2005-01-01
TWI243407B TWI243407B (en) 2005-11-11

Family

ID=34525346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115595A TWI243407B (en) 2003-06-03 2004-06-01 Method and apparatus for etching a substrate

Country Status (3)

Country Link
KR (1) KR100699336B1 (en)
CN (1) CN100405559C (en)
TW (1) TWI243407B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387038B (en) * 2006-08-23 2013-02-21 大日本網板製造股份有限公司 A posture changer and a substrate handling device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007007393A1 (en) * 2005-07-11 2007-01-18 Sony Chemicals Corporation Etching device and etching method
JP4557872B2 (en) * 2005-11-28 2010-10-06 株式会社日立ハイテクノロジーズ Substrate processing apparatus, substrate processing method, and substrate manufacturing method
KR100860294B1 (en) 2008-01-09 2008-09-25 주식회사 이코니 Glass substrate etching apparatus and glass sheet manufactured by the etching apparatus
CN103021905B (en) 2011-07-20 2016-12-21 显示器生产服务株式会社 Substrate board treatment
KR101279376B1 (en) 2011-07-20 2013-07-24 주식회사 디엠에스 Apparatus for treating substrate
CN103187337A (en) * 2011-12-29 2013-07-03 均豪精密工业股份有限公司 Substrate surface treatment device and method thereof
CN105225982B (en) * 2014-05-30 2020-07-28 盛美半导体设备（上海）有限公司 Semiconductor processing device and process method for processing semiconductor workpiece
CN105140167A (en) 2015-07-28 2015-12-09 合肥鑫晟光电科技有限公司 Carrying device, wet etching equipment and application method of wet etching equipment
CN105578774A (en) * 2015-12-25 2016-05-11 惠州中京电子科技有限公司 Fabrication method for female and male copper thicknesses of printed circuit board (PCB)
JP6789721B2 (en) * 2016-08-12 2020-11-25 東京エレクトロン株式会社 Substrate processing method and substrate processing equipment
CN108203247A (en) * 2018-03-13 2018-06-26 凌卫平 Multi-angle automatic etching machine
CN109680278A (en) * 2019-02-26 2019-04-26 合肥永淇智材科技有限公司 A kind of the vertical Etaching device and its engraving method of FMM sheet metal

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719767B2 (en) * 1986-05-08 1995-03-06 大日本スクリ−ン製造株式会社 Surface treatment equipment
JP3489992B2 (en) * 1998-07-16 2004-01-26 大日本スクリーン製造株式会社 Substrate processing equipment
JP4078434B2 (en) * 1998-10-29 2008-04-23 芝浦メカトロニクス株式会社 Substrate processing method and apparatus
JP3865978B2 (en) * 1999-09-28 2007-01-10 大日本スクリーン製造株式会社 Substrate processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387038B (en) * 2006-08-23 2013-02-21 大日本網板製造股份有限公司 A posture changer and a substrate handling device

Also Published As

Publication number Publication date
CN1574251A (en) 2005-02-02
CN100405559C (en) 2008-07-23
KR100699336B1 (en) 2007-03-26
KR20040104405A (en) 2004-12-10
TWI243407B (en) 2005-11-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees