TW200510932A - Radiation-sensitive resin composition, interlayer insulating film, microlens and their manufacturing method - Google Patents

Radiation-sensitive resin composition, interlayer insulating film, microlens and their manufacturing method

Info

Publication number
TW200510932A
TW200510932A TW093122996A TW93122996A TW200510932A TW 200510932 A TW200510932 A TW 200510932A TW 093122996 A TW093122996 A TW 093122996A TW 93122996 A TW93122996 A TW 93122996A TW 200510932 A TW200510932 A TW 200510932A
Authority
TW
Taiwan
Prior art keywords
radiation
resin composition
sensitive resin
microlens
insulating film
Prior art date
Application number
TW093122996A
Other languages
Chinese (zh)
Other versions
TWI326799B (en
Inventor
Hideki Nishimura
Takaki Minowa
Eiichiro Urushihara
Eiji Takamoto
Michinori Nishikawa
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200510932A publication Critical patent/TW200510932A/en
Application granted granted Critical
Publication of TWI326799B publication Critical patent/TWI326799B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

A radiation-sensitive resin composition is characterized in comprising: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing unsaturated compound, (a3) a maleimide monomer containing a hydroxyl group or a carboxyl group, and (a4) an unsaturated compound excluding (a1), (a2) and (a3); and [B] a 1, 2-naphthoquinone diazide compound. The interlayer insulating film and the microlens are produced from the above composition. The radiation-sensitive resin composition has high radiation sensitivity and development margin to form a favorable pattern even when the process time exceeds the optimum developing time in a developing process, and with which a pattern thin film having excellent adhesiveness can be easily formed.
TW093122996A 2003-07-31 2004-07-30 Radiation-sensitive resin composition, interlayer insulating film, microlens and their manufacturing method TW200510932A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003283291A JP4127150B2 (en) 2003-07-31 2003-07-31 Radiation-sensitive resin composition, interlayer insulating film and microlens, and production method thereof

Publications (2)

Publication Number Publication Date
TW200510932A true TW200510932A (en) 2005-03-16
TWI326799B TWI326799B (en) 2010-07-01

Family

ID=34268219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093122996A TW200510932A (en) 2003-07-31 2004-07-30 Radiation-sensitive resin composition, interlayer insulating film, microlens and their manufacturing method

Country Status (3)

Country Link
JP (1) JP4127150B2 (en)
KR (1) KR101021725B1 (en)
TW (1) TW200510932A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101221468B1 (en) * 2005-01-27 2013-01-11 주식회사 동진쎄미켐 Photosensitive resin composition
KR100758879B1 (en) * 2006-07-13 2007-09-14 제일모직주식회사 One component type thermosetting resin composition for color filter protective film
KR100908694B1 (en) * 2006-08-07 2009-07-22 도쿄 오카 고교 가부시키가이샤 Photosensitive resin composition for interlayer insulating film and method of forming interlayer insulating film
JP4935565B2 (en) * 2007-08-01 2012-05-23 住友化学株式会社 Photosensitive resin composition
JP5240459B2 (en) * 2008-02-19 2013-07-17 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film, microlens and method for forming them
JP5182365B2 (en) * 2008-03-31 2013-04-17 Ｊｓｒ株式会社 Positive radiation-sensitive resin composition, microlens and method for forming microlens
US9348224B2 (en) 2012-03-27 2016-05-24 Nissan Chemical Industries, Ltd. Photosensitive resin composition
KR102765177B1 (en) * 2018-08-10 2025-02-11 가부시키가이샤 오사카소다 Acrylic copolymer and rubber material
JP7451270B2 (en) * 2020-04-09 2024-03-18 Jsr株式会社 Method for processing radiation-sensitive compositions

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3114166B2 (en) * 1992-10-22 2000-12-04 ジェイエスアール株式会社 Radiation-sensitive resin composition for microlenses
KR100252546B1 (en) * 1997-11-01 2000-04-15 김영환 Copolymer Resin, Photoresist and Manufacturing Method Thereof
SG85221A1 (en) * 1999-12-01 2001-12-19 Jsr Corp Radiation sensitive composition and color liquid crystal display device
JP3965868B2 (en) * 2000-06-12 2007-08-29 Ｊｓｒ株式会社 Interlayer insulation film and microlens

Also Published As

Publication number Publication date
JP2005049720A (en) 2005-02-24
KR101021725B1 (en) 2011-03-15
KR20050014742A (en) 2005-02-07
JP4127150B2 (en) 2008-07-30
TWI326799B (en) 2010-07-01

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Legal Events

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MK4A Expiration of patent term of an invention patent