TW200519345A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
TW200519345A
TW200519345A TW092134324A TW92134324A TW200519345A TW 200519345 A TW200519345 A TW 200519345A TW 092134324 A TW092134324 A TW 092134324A TW 92134324 A TW92134324 A TW 92134324A TW 200519345 A TW200519345 A TW 200519345A
Authority
TW
Taiwan
Prior art keywords
pipe
wick
heat pipe
operating fluid
hydrophilic materials
Prior art date
Application number
TW092134324A
Other languages
Chinese (zh)
Other versions
TWI233977B (en
Inventor
Yang-Chang Chien
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW92134324A priority Critical patent/TWI233977B/en
Application granted granted Critical
Publication of TWI233977B publication Critical patent/TWI233977B/en
Publication of TW200519345A publication Critical patent/TW200519345A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat pipe includes a pipe, a wick and an operating fluid. The wick having hydrophilic materials is disposed inside the pipe and contacted to inside walls of the pipe; and the operating fluid is sealed in the pipe and soaked in the wick. The hydrophilic materials improve capillarity of the wick and further promote the thermal conductivity of the heat pipe.
TW92134324A 2003-12-05 2003-12-05 Heat pipe TWI233977B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92134324A TWI233977B (en) 2003-12-05 2003-12-05 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92134324A TWI233977B (en) 2003-12-05 2003-12-05 Heat pipe

Publications (2)

Publication Number Publication Date
TWI233977B TWI233977B (en) 2005-06-11
TW200519345A true TW200519345A (en) 2005-06-16

Family

ID=36592675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92134324A TWI233977B (en) 2003-12-05 2003-12-05 Heat pipe

Country Status (1)

Country Link
TW (1) TWI233977B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102790021A (en) * 2011-05-20 2012-11-21 奇鋐科技股份有限公司 Heat dissipation unit, manufacturing method thereof, and heat dissipation module
US9903665B2 (en) 2011-07-05 2018-02-27 Asia Vital Components Co., Ltd. Heat dissipation unit and thermal module thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI692607B (en) * 2019-06-28 2020-05-01 新加坡商 Ｊ＆Ｊ 資本控股有限公司 Heat conduction structure, its manufacturing method and mobile device
TWI692605B (en) * 2019-06-28 2020-05-01 新加坡商 Ｊ＆Ｊ 資本控股有限公司 Heat conduction structure, its manufacturing method and mobile device
TWI692609B (en) * 2019-06-28 2020-05-01 新加坡商 Ｊ＆Ｊ 資本控股有限公司 Heat conduction structure, its manufacturing method and mobile device
CN113566625A (en) * 2020-09-23 2021-10-29 昆山同川铜业科技有限公司 Capillary wick, manufacturing method of capillary wick, phase change latent heat radiator
CN113418414A (en) * 2021-07-07 2021-09-21 福建强纶新材料股份有限公司 Novel heat pipe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102790021A (en) * 2011-05-20 2012-11-21 奇鋐科技股份有限公司 Heat dissipation unit, manufacturing method thereof, and heat dissipation module
CN102790021B (en) * 2011-05-20 2015-06-17 奇鋐科技股份有限公司 Heat dissipation unit, manufacturing method thereof, and heat dissipation module
US9903665B2 (en) 2011-07-05 2018-02-27 Asia Vital Components Co., Ltd. Heat dissipation unit and thermal module thereof

Also Published As

Publication number Publication date
TWI233977B (en) 2005-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees