TW200606540A - Method of bonding substrates and apparatus for bonding substrates - Google Patents

Method of bonding substrates and apparatus for bonding substrates

Info

Publication number
TW200606540A
TW200606540A TW094125389A TW94125389A TW200606540A TW 200606540 A TW200606540 A TW 200606540A TW 094125389 A TW094125389 A TW 094125389A TW 94125389 A TW94125389 A TW 94125389A TW 200606540 A TW200606540 A TW 200606540A
Authority
TW
Taiwan
Prior art keywords
substrates
fluid
contact
bonding substrates
releasing
Prior art date
Application number
TW094125389A
Other languages
Chinese (zh)
Other versions
TWI379129B (en
Inventor
Tsutomu Makino
Takashi Takahashi
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200606540A publication Critical patent/TW200606540A/en
Application granted granted Critical
Publication of TWI379129B publication Critical patent/TWI379129B/en

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

To provide a method capable of sticking substrates to each other by uniformly applying a pressure thereto without damaging the substrates. The method includes steps of: holding two substrates in a reduced pressure atmosphere and bringing them close to each other in a vertical direction to bring them into contact with each other through a fluid; driving two substrates brought into contact with each other through the fluid, relatively in a horizontal direction to align them; releasing the held state of one of two aligned substrates, which is placed on the other; and applying a pressure to two substrates being in contact with each other through the fluid, to stuck them to each other by a sealing agent after releasing the held state of one substrate.
TW094125389A 2004-08-03 2005-07-27 Method of bonding substrates and apparatus for bonding substrates TWI379129B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004226993A JP4482395B2 (en) 2004-08-03 2004-08-03 Substrate bonding method and bonding apparatus

Publications (2)

Publication Number Publication Date
TW200606540A true TW200606540A (en) 2006-02-16
TWI379129B TWI379129B (en) 2012-12-11

Family

ID=36026215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125389A TWI379129B (en) 2004-08-03 2005-07-27 Method of bonding substrates and apparatus for bonding substrates

Country Status (4)

Country Link
JP (1) JP4482395B2 (en)
KR (1) KR101170942B1 (en)
CN (2) CN101900912B (en)
TW (1) TWI379129B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8054437B2 (en) * 2006-03-31 2011-11-08 Citizen Holdings Co., Ltd. Large substrate, method of manufacturing liquid crystal device from the same, and liquid crystal device obtained
JP4786693B2 (en) 2008-09-30 2011-10-05 三菱重工業株式会社 Wafer bonding apparatus and wafer bonding method
CN102654668B (en) * 2011-08-01 2014-11-19 北京京东方光电科技有限公司 Vacuum box aligning equipment and box aligning system
KR101311369B1 (en) * 2011-11-25 2013-09-25 (주)다이솔티모 Apparatus for sealing electrolyte injection hole and method for manufacturing dye sensitized solar cell using the same
JP5852244B2 (en) * 2012-07-30 2016-02-03 芝浦メカトロニクス株式会社 Substrate pasting apparatus and substrate pasting method
JP6406247B2 (en) 2013-04-30 2018-10-17 Ａｇｃ株式会社 Laminate manufacturing apparatus and laminate manufacturing method
JP5705937B2 (en) * 2013-09-13 2015-04-22 信越エンジニアリング株式会社 Bonding device manufacturing apparatus and manufacturing method
JP2015158603A (en) * 2014-02-24 2015-09-03 株式会社Sat Substrate bonding device
CN104267494B (en) * 2014-09-29 2017-10-10 华南师范大学 Accurate contraposition and the process apparatus and method fitted under a kind of electric moistening display part liquid level
CN104849936B (en) * 2015-04-15 2018-04-10 华南师范大学 A kind of method for encapsulating electric moistening display part
TWI582411B (en) * 2015-09-10 2017-05-11 由田新技股份有限公司 Panel press inspection machine
CN109581707B (en) * 2018-11-15 2021-02-26 惠科股份有限公司 Method for laminating display panel, control device and vacuum laminating machine
US11604372B2 (en) 2018-11-15 2023-03-14 HKC Corporation Limited Method and control device for laminating display panel as well as vacuum laminator
US11231604B2 (en) * 2019-02-20 2022-01-25 Jvckenwood Corporation Manufacturing apparatus and manufacturing method of liquid crystal device
CN112937058B (en) * 2021-03-24 2024-05-24 滁州惠科光电科技有限公司 Air suction control method and system of vacuum laminating machine and vacuum laminating machine

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002098975A (en) 2000-09-21 2002-04-05 Seiko Epson Corp Liquid crystal device manufacturing method
JP4224959B2 (en) 2001-08-21 2009-02-18 株式会社日立プラントテクノロジー Liquid crystal substrate assembly equipment
JP2003131241A (en) 2001-10-24 2003-05-08 Matsushita Electric Ind Co Ltd Liquid crystal substrate bonding method
JP2003233080A (en) 2002-02-05 2003-08-22 Lg Phillips Lcd Co Ltd Coupling device and method of manufacturing liquid crystal display device using the same
US6784970B2 (en) * 2002-02-27 2004-08-31 Lg.Philips Lcd Co., Ltd. Method of fabricating LCD
KR100720414B1 (en) * 2002-02-27 2007-05-22 엘지.필립스 엘시디 주식회사 Manufacturing Method Of Liquid Crystal Display
US6833901B2 (en) * 2002-02-27 2004-12-21 Lg. Philips Lcd Co., Ltd. Method for fabricating LCD having upper substrate coated with sealant
US7341641B2 (en) * 2002-03-20 2008-03-11 Lg.Philips Lcd Co., Ltd. Bonding device for manufacturing liquid crystal display device
CN1325981C (en) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 Working platform structure of binding machine and its control method
KR100493384B1 (en) * 2002-11-07 2005-06-07 엘지.필립스 엘시디 주식회사 structure for loading of substrate in substrate bonding device for manucturing a liquid crystal display device
CN1183955C (en) * 2003-04-09 2005-01-12 李保刚 Method of continuously producing eucommia extract powder, gutta percha, eucommia resin and organic fertilizer using eucommia leaf

Also Published As

Publication number Publication date
CN101900912B (en) 2012-05-23
JP4482395B2 (en) 2010-06-16
JP2006047575A (en) 2006-02-16
CN1737672A (en) 2006-02-22
KR101170942B1 (en) 2012-08-03
TWI379129B (en) 2012-12-11
CN101900912A (en) 2010-12-01
CN1737672B (en) 2010-12-08
KR20060049044A (en) 2006-05-18

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