TW200608024A - A highly resilient cantilever spring probe for testing ICs - Google Patents

A highly resilient cantilever spring probe for testing ICs

Info

Publication number
TW200608024A
TW200608024A TW094127405A TW94127405A TW200608024A TW 200608024 A TW200608024 A TW 200608024A TW 094127405 A TW094127405 A TW 094127405A TW 94127405 A TW94127405 A TW 94127405A TW 200608024 A TW200608024 A TW 200608024A
Authority
TW
Taiwan
Prior art keywords
cantilever spring
spring probe
highly resilient
resilient cantilever
base
Prior art date
Application number
TW094127405A
Other languages
English (en)
Inventor
Phillip Mai
Original Assignee
Jem America Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jem America Corp filed Critical Jem America Corp
Publication of TW200608024A publication Critical patent/TW200608024A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW094127405A 2004-08-16 2005-08-12 A highly resilient cantilever spring probe for testing ICs TW200608024A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/919,836 US6956389B1 (en) 2004-08-16 2004-08-16 Highly resilient cantilever spring probe for testing ICs

Publications (1)

Publication Number Publication Date
TW200608024A true TW200608024A (en) 2006-03-01

Family

ID=35066157

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127405A TW200608024A (en) 2004-08-16 2005-08-12 A highly resilient cantilever spring probe for testing ICs

Country Status (6)

Country Link
US (3) US6956389B1 (zh)
JP (1) JP2008510166A (zh)
KR (1) KR20070041581A (zh)
CN (1) CN101014865A (zh)
TW (1) TW200608024A (zh)
WO (1) WO2006023380A1 (zh)

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USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7733101B2 (en) 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US8330485B2 (en) * 2004-10-21 2012-12-11 Palo Alto Research Center Incorporated Curved spring structure with downturned tip
US7230440B2 (en) * 2004-10-21 2007-06-12 Palo Alto Research Center Incorporated Curved spring structure with elongated section located under cantilevered section
US7564172B1 (en) * 2005-08-03 2009-07-21 Kolo Technologies, Inc. Micro-electro-mechanical transducer having embedded springs
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
JP5232382B2 (ja) * 2005-12-06 2013-07-10 株式会社エンプラス プローブチップ及びプローブカード
US7649367B2 (en) * 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7384277B1 (en) * 2006-12-17 2008-06-10 Formfactor, Inc. Reinforced contact elements
JP5147227B2 (ja) * 2006-12-19 2013-02-20 株式会社日本マイクロニクス 電気的接続装置の使用方法
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
JP2008268145A (ja) * 2007-04-25 2008-11-06 Micronics Japan Co Ltd プローブ組立体
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7671610B2 (en) 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
CN102539849B (zh) * 2012-01-12 2014-10-22 南京瑞尼特微电子有限公司 一种微探针阵列及其制作方法
US9086433B2 (en) * 2012-12-19 2015-07-21 International Business Machines Corporation Rigid probe with compliant characteristics
JP6029535B2 (ja) * 2013-05-27 2016-11-24 三菱電機株式会社 コンタクトプローブ
US9382960B2 (en) 2014-02-19 2016-07-05 Massachusetts Institute Of Technology Beam-based nonlinear spring
US10908182B2 (en) 2016-06-28 2021-02-02 Kabushiki Kaisha Nihon Micronics Electrical connecting apparatus and contact
JP6737171B2 (ja) 2016-12-28 2020-08-05 信越化学工業株式会社 希土類焼結磁石のマルチ切断加工方法
WO2019089611A1 (en) * 2017-10-31 2019-05-09 Formfactor, Inc. Mems probe card assembly having decoupled electrical and mechanical probe connections
IT201800001170A1 (it) * 2018-01-17 2019-07-17 Technoprobe Spa Testa di misura di tipo cantilever e relativa sonda di contatto
JP2022187216A (ja) * 2021-06-07 2022-12-19 株式会社日本マイクロニクス プローブ
CN116008618B (zh) * 2021-10-22 2025-08-26 台湾中华精测科技股份有限公司 悬臂式探针结构
CN114594373B (zh) * 2022-05-11 2023-01-13 深圳市卓汉材料技术有限公司 一种面向集成电路测试的悬臂式探针及探针台
KR20230172900A (ko) 2022-06-16 2023-12-26 현대자동차주식회사 수소 전기차의 연료전지 생성수 처리 시스템
KR20240008139A (ko) 2022-07-11 2024-01-18 현대자동차주식회사 연료전지 생성수 처리 시스템
KR102532503B1 (ko) * 2022-09-01 2023-05-17 주식회사 프로이천 프로브니들
US12498398B2 (en) 2023-02-23 2025-12-16 Snap-On Incorporated Electrical testing device with probe having an adjustable angle
US12504442B2 (en) 2023-02-23 2025-12-23 Snap-On Incorporated Electrical testing device with probe having portions with different cross-sectional areas

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US5884398A (en) 1993-11-16 1999-03-23 Form Factor, Inc. Mounting spring elements on semiconductor devices
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
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EP1482314B1 (en) * 1996-05-17 2009-11-11 FormFactor, Inc. Microelectronic spring contact element
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
CA2286326C (en) 1997-04-04 2007-06-26 Adam L. Cohen Article, method, and apparatus for electrochemical fabrication
US6014032A (en) * 1997-09-30 2000-01-11 International Business Machines Corporation Micro probe ring assembly and method of fabrication
US6414501B2 (en) * 1998-10-01 2002-07-02 Amst Co., Ltd. Micro cantilever style contact pin structure for wafer probing
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
US6218203B1 (en) * 1999-06-28 2001-04-17 Advantest Corp. Method of producing a contact structure
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6250933B1 (en) * 2000-01-20 2001-06-26 Advantest Corp. Contact structure and production method thereof
US6625004B1 (en) * 2001-08-31 2003-09-23 Superconductor Technologies, Inc. Electrostatic actuators with intrinsic stress gradient
US7649145B2 (en) * 2004-06-18 2010-01-19 Micron Technology, Inc. Compliant spring contact structures

Also Published As

Publication number Publication date
WO2006023380A1 (en) 2006-03-02
US6956389B1 (en) 2005-10-18
KR20070041581A (ko) 2007-04-18
JP2008510166A (ja) 2008-04-03
US20060033521A1 (en) 2006-02-16
US7061262B2 (en) 2006-06-13
US20060033520A1 (en) 2006-02-16
CN101014865A (zh) 2007-08-08

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