TW200613108A - Method of manufacturing cured film applied to in-mold decoration injection molding - Google Patents

Method of manufacturing cured film applied to in-mold decoration injection molding

Info

Publication number
TW200613108A
TW200613108A TW095101819A TW95101819A TW200613108A TW 200613108 A TW200613108 A TW 200613108A TW 095101819 A TW095101819 A TW 095101819A TW 95101819 A TW95101819 A TW 95101819A TW 200613108 A TW200613108 A TW 200613108A
Authority
TW
Taiwan
Prior art keywords
injection molding
mold decoration
cured film
film applied
decoration injection
Prior art date
Application number
TW095101819A
Other languages
Chinese (zh)
Other versions
TWI268843B (en
Inventor
Kevin Lee
Tong-Chee Hsu
Chia-Yu Liu
Hsing Lung
Yen-Ching Chang
Original Assignee
E San Prec Coating Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E San Prec Coating Corp filed Critical E San Prec Coating Corp
Priority to TW95101819A priority Critical patent/TWI268843B/en
Publication of TW200613108A publication Critical patent/TW200613108A/en
Application granted granted Critical
Publication of TWI268843B publication Critical patent/TWI268843B/en

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  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a method of manufacturing cured film applied to in-mold decoration injection molding. First, a thermo-compressible plastic film for in-mold decoration (IMD) injection molding is fabricated to form a cured layer whose surface is in B stage. The thermo-compressible plastic film having a B stage surface is characterized by that when applied to in-mold decoration injection molding, no cracks will be caused on the cured layer, even experiencing a deep stretching shaping. After finishing the stretching shaping, the cured layer is completely cured. The IMD process used by the present invention can be massively applied to the industry so as to improve the yield, efficiency and coloration of the production, reducing the environmental contaminations.
TW95101819A 2006-01-18 2006-01-18 Method of producing hard coating applied to in-mold decoration injection molding TWI268843B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95101819A TWI268843B (en) 2006-01-18 2006-01-18 Method of producing hard coating applied to in-mold decoration injection molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95101819A TWI268843B (en) 2006-01-18 2006-01-18 Method of producing hard coating applied to in-mold decoration injection molding

Publications (2)

Publication Number Publication Date
TW200613108A true TW200613108A (en) 2006-05-01
TWI268843B TWI268843B (en) 2006-12-21

Family

ID=38291355

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95101819A TWI268843B (en) 2006-01-18 2006-01-18 Method of producing hard coating applied to in-mold decoration injection molding

Country Status (1)

Country Link
TW (1) TWI268843B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9242505B2 (en) 2009-09-14 2016-01-26 Compal Electronics, Inc. Production method of workpiece and workpiece with three-dimensional pattern
US9290039B2 (en) 2009-09-14 2016-03-22 Compal Electronics, Inc. Production method of workpiece and workpiece with three-dimensional pattern
TWI371374B (en) * 2009-09-14 2012-09-01 Compal Electronics Inc Production method of three dimensional pattern
TW201236887A (en) * 2011-03-15 2012-09-16 Imprinting Lithography Decoration Tech Co Ltd Transcription method of 3D pattern solidified with UV light
TWI468306B (en) * 2011-11-24 2015-01-11 Compal Electronics Inc Production method of workpiece and workpiece with three-dimensional pattern

Also Published As

Publication number Publication date
TWI268843B (en) 2006-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees