TW200615565A - Radiation detecting apparatus, scintillator panel, their manufacturing method and radiation detecting system - Google Patents
Radiation detecting apparatus, scintillator panel, their manufacturing method and radiation detecting systemInfo
- Publication number
- TW200615565A TW200615565A TW094127203A TW94127203A TW200615565A TW 200615565 A TW200615565 A TW 200615565A TW 094127203 A TW094127203 A TW 094127203A TW 94127203 A TW94127203 A TW 94127203A TW 200615565 A TW200615565 A TW 200615565A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- scintillator
- radiation detecting
- protection layer
- protection
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000012943 hotmelt Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20188—Auxiliary details, e.g. casings or cooling
- G01T1/20189—Damping or insulation against damage, e.g. caused by heat or pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2002—Optical details, e.g. reflecting or diffusing layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/301—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices being sensitive to very short wavelength, e.g. being sensitive to X-rays, gamma-rays or corpuscular radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
- H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/496—Luminescent members, e.g. fluorescent sheets
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measurement Of Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004233417 | 2004-08-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200615565A true TW200615565A (en) | 2006-05-16 |
| TWI290231B TWI290231B (en) | 2007-11-21 |
Family
ID=35839277
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095146120A TWI334934B (en) | 2004-08-10 | 2005-08-10 | Radiation detecting apparatus and scintillator panel |
| TW094127203A TWI290231B (en) | 2004-08-10 | 2005-08-10 | Radiation detecting apparatus, scintillator panel, their manufacturing method and radiation detecting system |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095146120A TWI334934B (en) | 2004-08-10 | 2005-08-10 | Radiation detecting apparatus and scintillator panel |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7514686B2 (zh) |
| EP (1) | EP1779140B1 (zh) |
| CN (1) | CN101002110B (zh) |
| TW (2) | TWI334934B (zh) |
| WO (1) | WO2006016505A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI872356B (zh) * | 2022-01-19 | 2025-02-11 | 友達光電股份有限公司 | 光感測器 |
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| EP1118880B1 (en) | 1998-06-18 | 2003-11-26 | Hamamatsu Photonics K.K. | Method of organic film deposition |
| DE602006008994D1 (de) * | 2005-01-13 | 2009-10-22 | Aloka Co Ltd | Szintillatorteil und Herstellungsverfahren dafür sowie Strahlungsmessvorrichtung |
| JP4579894B2 (ja) * | 2005-12-20 | 2010-11-10 | キヤノン株式会社 | 放射線検出装置及び放射線検出システム |
| JP4920994B2 (ja) * | 2006-03-02 | 2012-04-18 | キヤノン株式会社 | シンチレータパネル、放射線検出装置及び放射線検出システム |
| US7772558B1 (en) * | 2006-03-29 | 2010-08-10 | Radiation Monitoring Devices, Inc. | Multi-layer radiation detector and related methods |
| JP5004848B2 (ja) * | 2007-04-18 | 2012-08-22 | キヤノン株式会社 | 放射線検出装置及び放射線検出システム |
| JP4834614B2 (ja) * | 2007-06-12 | 2011-12-14 | キヤノン株式会社 | 放射線検出装置および放射線撮像システム |
| JP5142943B2 (ja) * | 2007-11-05 | 2013-02-13 | キヤノン株式会社 | 放射線検出装置の製造方法、放射線検出装置及び放射線撮像システム |
| JP4764407B2 (ja) * | 2007-11-20 | 2011-09-07 | 東芝電子管デバイス株式会社 | 放射線検出器及びその製造方法 |
| CN102473792A (zh) * | 2009-08-19 | 2012-05-23 | 夏普株式会社 | 光传感器、半导体器件和液晶面板 |
| WO2011021477A1 (ja) * | 2009-08-20 | 2011-02-24 | シャープ株式会社 | 光センサ、半導体装置、及び液晶パネル |
| JP2011137665A (ja) * | 2009-12-26 | 2011-07-14 | Canon Inc | シンチレータパネル及び放射線撮像装置とその製造方法、ならびに放射線撮像システム |
| EP2530682B1 (en) * | 2010-01-29 | 2019-11-20 | Hamamatsu Photonics K.K. | Radiation image conversion panel |
| JP5607426B2 (ja) | 2010-05-28 | 2014-10-15 | キヤノン株式会社 | 放射線検出装置及び放射線撮像システム |
| JP5562134B2 (ja) | 2010-06-17 | 2014-07-30 | キヤノン株式会社 | 放射線検出装置、その製造方法及び放射線撮像システム |
| JP5665494B2 (ja) | 2010-06-24 | 2015-02-04 | キヤノン株式会社 | 放射線検出装置及び放射線撮像システム |
| JP5680943B2 (ja) | 2010-11-16 | 2015-03-04 | キヤノン株式会社 | シンチレータ、放射線検出装置および放射線撮影装置 |
| JP5538205B2 (ja) * | 2010-12-27 | 2014-07-02 | 富士フイルム株式会社 | 放射線画像変換パネル及び放射線画像変換パネルの製造方法、並びに放射線画像検出装置 |
| JP5792958B2 (ja) | 2011-01-13 | 2015-10-14 | キヤノン株式会社 | 放射線撮像装置、放射線撮像システム及び放射線撮像装置の製造方法 |
| JP5629593B2 (ja) | 2011-02-01 | 2014-11-19 | 株式会社東芝 | 放射線検出器 |
| JP2012163396A (ja) * | 2011-02-04 | 2012-08-30 | Toshiba Corp | シンチレータパネル及び放射線検出器 |
| JP2012177624A (ja) * | 2011-02-25 | 2012-09-13 | Fujifilm Corp | 放射線画像検出装置及び放射線画像検出装置の製造方法 |
| JP5728250B2 (ja) * | 2011-03-01 | 2015-06-03 | キヤノン株式会社 | 放射線検出装置、シンチレータパネル、それらの製造方法、および放射線検出システム |
| JP5744570B2 (ja) * | 2011-03-02 | 2015-07-08 | キヤノン株式会社 | 放射線検出装置、放射線検出装置の製造方法及び放射線検出システム |
| CN102354696B (zh) * | 2011-07-22 | 2013-05-01 | 上海奕瑞光电子科技有限公司 | X射线探测器 |
| JP2013029384A (ja) | 2011-07-27 | 2013-02-07 | Canon Inc | 放射線検出装置、その製造方法および放射線検出システム |
| EP2793234B1 (en) | 2011-12-16 | 2019-09-25 | Canon Electron Tubes & Devices Co., Ltd. | Device for producing radiation detection panel and method for producing radiation detection panel |
| JP2013217769A (ja) * | 2012-04-09 | 2013-10-24 | Canon Inc | 放射線検出装置 |
| JP6200171B2 (ja) | 2012-06-04 | 2017-09-20 | キヤノン株式会社 | 放射線検出装置及び撮像システム |
| JP2014003183A (ja) * | 2012-06-19 | 2014-01-09 | Canon Inc | 検出装置及び放射線検出システム |
| JP5997512B2 (ja) | 2012-06-20 | 2016-09-28 | キヤノン株式会社 | 放射線検出装置及び撮像システム |
| US9640676B2 (en) * | 2012-06-29 | 2017-05-02 | Sunpower Corporation | Methods and structures for improving the structural integrity of solar cells |
| JP6071283B2 (ja) | 2012-07-04 | 2017-02-01 | キヤノン株式会社 | 放射線検出装置及びその製造方法 |
| JP5928208B2 (ja) * | 2012-07-12 | 2016-06-01 | ソニー株式会社 | 放射線検出器 |
| JP2014048061A (ja) * | 2012-08-29 | 2014-03-17 | Canon Inc | 放射線撮像装置、その製造方法、及び放射線撮像システム |
| DE102013217278B4 (de) * | 2012-09-12 | 2017-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Photodetektorschaltung, Bildgebungsvorrichtung und Verfahren zum Ansteuern einer Photodetektorschaltung |
| JP5906162B2 (ja) * | 2012-09-27 | 2016-04-20 | 富士フイルム株式会社 | 放射線画像検出装置 |
| JP6092568B2 (ja) | 2012-10-11 | 2017-03-08 | キヤノン株式会社 | 放射線検出装置及び放射線検出システム |
| JP2014122820A (ja) * | 2012-12-20 | 2014-07-03 | Canon Inc | シンチレータ、放射線検出装置および放射線検出システム |
| JP6100045B2 (ja) | 2013-03-19 | 2017-03-22 | キヤノン株式会社 | 放射線検出装置、放射線検出システム及び放射線検出装置の製造方法 |
| CN103305925B (zh) * | 2013-06-28 | 2016-08-10 | 电子科技大学 | 掺铊碘化铯薄膜表面缺陷处理方法 |
| JP6310216B2 (ja) * | 2013-09-06 | 2018-04-11 | キヤノン株式会社 | 放射線検出装置及びその製造方法並びに放射線検出システム |
| TWI550836B (zh) * | 2014-05-06 | 2016-09-21 | 友達光電股份有限公司 | 光偵測器及其製造方法 |
| JP2015230175A (ja) * | 2014-06-03 | 2015-12-21 | コニカミノルタ株式会社 | 放射線画像検出装置及びその製造方法 |
| CN104022047B (zh) * | 2014-06-10 | 2018-02-16 | 平生医疗科技(昆山)有限公司 | 一种易潮解性辐射晶体面板的封装方法及结构 |
| US9513380B2 (en) * | 2014-07-25 | 2016-12-06 | General Electric Company | X-ray detectors supported on a substrate having a surrounding metal barrier |
| US10712454B2 (en) | 2014-07-25 | 2020-07-14 | General Electric Company | X-ray detectors supported on a substrate having a metal barrier |
| US9526468B2 (en) | 2014-09-09 | 2016-12-27 | General Electric Company | Multiple frame acquisition for exposure control in X-ray medical imagers |
| JP6478538B2 (ja) | 2014-09-10 | 2019-03-06 | キヤノン株式会社 | 放射線撮像装置および放射線撮像システム |
| JP6512830B2 (ja) * | 2015-01-09 | 2019-05-15 | キヤノン株式会社 | 放射線撮像装置、その製造方法及び放射線検査装置 |
| JP6487263B2 (ja) * | 2015-04-20 | 2019-03-20 | 浜松ホトニクス株式会社 | 放射線検出器及びその製造方法 |
| JP6573377B2 (ja) | 2015-07-08 | 2019-09-11 | キヤノン株式会社 | 放射線撮像装置、その制御方法及びプログラム |
| JP6573378B2 (ja) | 2015-07-10 | 2019-09-11 | キヤノン株式会社 | 放射線撮像装置、その制御方法及びプログラム |
| JP6611511B2 (ja) | 2015-08-06 | 2019-11-27 | キヤノン株式会社 | シンチレータの製造方法 |
| JP6663210B2 (ja) | 2015-12-01 | 2020-03-11 | キヤノン株式会社 | 放射線撮像装置及びその制御方法 |
| JP6706963B2 (ja) | 2016-04-18 | 2020-06-10 | キヤノン株式会社 | 放射線撮像装置、放射線撮像システム、及び、放射線撮像装置の制御方法 |
| CN106252372A (zh) * | 2016-09-26 | 2016-12-21 | 上海奕瑞光电子科技有限公司 | 放射线图像传感器及其制备方法 |
| CN108091255A (zh) * | 2016-11-21 | 2018-05-29 | 群创光电股份有限公司 | 显示装置及其制造方法 |
| JP6778118B2 (ja) | 2017-01-13 | 2020-10-28 | キヤノン株式会社 | 放射線撮像装置及び放射線撮像システム |
| KR20190099539A (ko) * | 2017-02-17 | 2019-08-27 | 야스 메디칼 이메이징 테크놀로지 가부시키가이샤 | 신틸레이터 모듈, 신틸레이터 센서 유닛 및 신틸레이터 모듈의 제조 방법 |
| WO2019012846A1 (ja) | 2017-07-10 | 2019-01-17 | キヤノン株式会社 | 放射線撮像装置および放射線撮像システム |
| JP7030478B2 (ja) | 2017-11-09 | 2022-03-07 | キヤノン株式会社 | 撮影台および放射線撮影システム |
| JP7601553B2 (ja) * | 2019-12-25 | 2024-12-17 | 浜松ホトニクス株式会社 | 放射線検出器及び放射線検出器の製造方法 |
| JP7564655B2 (ja) | 2020-07-14 | 2024-10-09 | キヤノン株式会社 | 放射線撮像パネル、放射線撮像装置、放射線撮像システム、および、シンチレータプレート |
| US11656370B2 (en) | 2020-07-27 | 2023-05-23 | Canon Kabushiki Kaisha | Radiation imaging panel, radiation imaging apparatus, radiation imaging system, method of manufacturing radiation imaging panel, and scintillator plate |
| TWI921579B (zh) * | 2021-07-27 | 2026-04-11 | 優顯科技股份有限公司 | 影像偵測器 |
| JP2023071243A (ja) * | 2021-11-11 | 2023-05-23 | キヤノン株式会社 | 放射線撮影装置及びその製造方法 |
| JP2024027374A (ja) * | 2022-08-17 | 2024-03-01 | キヤノン株式会社 | 放射線撮像装置の製造方法 |
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-
2005
- 2005-07-27 US US11/570,125 patent/US7514686B2/en not_active Expired - Fee Related
- 2005-07-27 CN CN2005800271303A patent/CN101002110B/zh not_active Expired - Fee Related
- 2005-07-27 EP EP05768845.9A patent/EP1779140B1/en not_active Expired - Lifetime
- 2005-07-27 WO PCT/JP2005/014144 patent/WO2006016505A1/en not_active Ceased
- 2005-08-10 TW TW095146120A patent/TWI334934B/zh not_active IP Right Cessation
- 2005-08-10 TW TW094127203A patent/TWI290231B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI872356B (zh) * | 2022-01-19 | 2025-02-11 | 友達光電股份有限公司 | 光感測器 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1779140B1 (en) | 2018-06-20 |
| CN101002110A (zh) | 2007-07-18 |
| US7514686B2 (en) | 2009-04-07 |
| WO2006016505A1 (en) | 2006-02-16 |
| TWI334934B (en) | 2010-12-21 |
| CN101002110B (zh) | 2010-12-08 |
| EP1779140A4 (en) | 2016-08-31 |
| TWI290231B (en) | 2007-11-21 |
| US20070257198A1 (en) | 2007-11-08 |
| TW200722781A (en) | 2007-06-16 |
| EP1779140A1 (en) | 2007-05-02 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |