TW200619635A - Sheet-like probe, its manufacturing method, and its application - Google Patents

Sheet-like probe, its manufacturing method, and its application

Info

Publication number
TW200619635A
TW200619635A TW094139461A TW94139461A TW200619635A TW 200619635 A TW200619635 A TW 200619635A TW 094139461 A TW094139461 A TW 094139461A TW 94139461 A TW94139461 A TW 94139461A TW 200619635 A TW200619635 A TW 200619635A
Authority
TW
Taiwan
Prior art keywords
insulating film
sheet
frame plate
inspected
metal frame
Prior art date
Application number
TW094139461A
Other languages
Chinese (zh)
Inventor
Mutsuhiko Yoshioka
Hitoshi Fujiyama
Hisao Igarashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200619635A publication Critical patent/TW200619635A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention provides a sheet-like probe capable of reliably preventing positional deviations between electrode structures and electrodes to be inspected due to temperature changes in burn-in tests even if targets to be inspected are large-area wafers having a diameter of 8 inches or larger and circuit devices having electrodes to be inspected of extremely small pitch, thereby stably maintaining a satisfactory state of electric connection. The sheet-like probe is provide with both a metal frame plate in which through holes are formed and a contact film supported at peripheral edge parts of the through holes of the metal frame plate. The contact film is provided with both an insulating film made of a flexible resin and electrode structures formed in such a way as to pass through the front and back surfaces of the insulating film. The electrode structures are provided with both surface electrode parts formed in the surface of the insulating film and back electrode parts formed in the back surface of the insulating film. The metal frame plate and the back electrode parts are constituted of different metal members.
TW094139461A 2004-11-11 2005-11-10 Sheet-like probe, its manufacturing method, and its application TW200619635A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004327943 2004-11-11
JP2004329882 2004-11-12

Publications (1)

Publication Number Publication Date
TW200619635A true TW200619635A (en) 2006-06-16

Family

ID=36336554

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139461A TW200619635A (en) 2004-11-11 2005-11-10 Sheet-like probe, its manufacturing method, and its application

Country Status (2)

Country Link
TW (1) TW200619635A (en)
WO (1) WO2006051878A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110929831A (en) * 2019-11-05 2020-03-27 四川华大恒芯科技有限公司 Chip transfer prevention method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019027932A (en) * 2017-07-31 2019-02-21 日東電工株式会社 Substrate for inspection and substrate for inspection with conduction protection

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152019A (en) * 1991-11-28 1993-06-18 Nitto Denko Corp Anisotropic conductive connector
JP3658029B2 (en) * 1994-02-21 2005-06-08 株式会社ルネサステクノロジ Connection apparatus and manufacturing method thereof
JP3565086B2 (en) * 1999-04-16 2004-09-15 富士通株式会社 Probe card and method for testing semiconductor device
JP4640738B2 (en) * 2000-09-04 2011-03-02 Ｈｏｙａ株式会社 Contact component for wafer batch contact board and manufacturing method thereof
JP2004172588A (en) * 2002-10-28 2004-06-17 Jsr Corp Sheet-like connector, method of manufacturing the same, and probe device
JP3781048B2 (en) * 2003-05-13 2006-05-31 Ｊｓｒ株式会社 Sheet probe and its application

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110929831A (en) * 2019-11-05 2020-03-27 四川华大恒芯科技有限公司 Chip transfer prevention method

Also Published As

Publication number Publication date
WO2006051878A1 (en) 2006-05-18

Similar Documents

Publication Publication Date Title
TW200602645A (en) Method of manufacturing sheetlike probe and its application
ATE373831T1 (en) PLATE-SHAPED PROBE, PROCESS FOR MANUFACTURING IT AND ITS USE
WO2012056025A3 (en) Circuit for applying heat and electrical stimulation
TW200728723A (en) Anisotropic conductive connector device and circuit device inspection device
FR2857153B1 (en) BISTABLE MICRO-SWITCH WITH LOW CONSUMPTION.
TW200513650A (en) Micro-electromechanical probe circuit film, method for making the same and applications thereof
TW200625501A (en) Electrostatic chuck
EP1612873A4 (en) COLLECTOR PLATE AND ELECTROCHEMICAL DEVICE
DE502008000072D1 (en) Circuit arrangement with connecting device and manufacturing method thereof
TW200700586A (en) Electroplating jig
WO2010038179A3 (en) An oled device and an electronic circuit
WO2008120654A1 (en) Anisotropic conductive connector, probe member and wafer inspection equipment
TW200720665A (en) Jig for inspecting substrate, and inspection probe
TW200618304A (en) Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus
TW200704288A (en) Electronic device substrate, electronic device, method of manufacturing electronic device, and electronic apparatus
EP2518558A3 (en) Liquid crystal display and array substrate
TW200709509A (en) Anisotropic conductive sheet and manufacturing method, connection method and inspection method of the same
ATE518278T1 (en) CIRCUIT CARD CONNECTION FOR TWO PARALLEL CIRCUIT BOARDS
TW200511468A (en) Anisotropic conductive connector, probe member, wafer-inspecting device, and wafer-inspecting
TW200707848A (en) Complex porous resin substrate and a method of fabricating the same
WO2009004759A1 (en) Thermoelectric device
EP4650766A3 (en) Electrode film and electrochemical measurement system
JP2007507004A5 (en)
TW200619635A (en) Sheet-like probe, its manufacturing method, and its application
ATE434264T1 (en) METHOD FOR ASSEMBLING A DOUBLE-SIDED CIRCUIT COMPONENT