TW200620344A - Capacitor structure - Google Patents

Capacitor structure

Info

Publication number
TW200620344A
TW200620344A TW094135097A TW94135097A TW200620344A TW 200620344 A TW200620344 A TW 200620344A TW 094135097 A TW094135097 A TW 094135097A TW 94135097 A TW94135097 A TW 94135097A TW 200620344 A TW200620344 A TW 200620344A
Authority
TW
Taiwan
Prior art keywords
capacitor structure
disclosed
forming
structures
methods
Prior art date
Application number
TW094135097A
Other languages
English (en)
Other versions
TWI274355B (en
Inventor
John P Cahalen
Maria Anna Rzeznik
John E Schemenaur
Rajan Hariharan
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200620344A publication Critical patent/TW200620344A/zh
Application granted granted Critical
Publication of TWI274355B publication Critical patent/TWI274355B/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/696Electrodes comprising multiple layers, e.g. comprising a barrier layer and a metal layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09509Blind vias, i.e. vias having one side closed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW094135097A 2004-10-08 2005-10-07 Capacitor structure TWI274355B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61711104P 2004-10-08 2004-10-08

Publications (2)

Publication Number Publication Date
TW200620344A true TW200620344A (en) 2006-06-16
TWI274355B TWI274355B (en) 2007-02-21

Family

ID=35474657

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094135097A TWI274355B (en) 2004-10-08 2005-10-07 Capacitor structure

Country Status (6)

Country Link
US (1) US7190016B2 (zh)
EP (1) EP1646072A3 (zh)
JP (1) JP2006140454A (zh)
KR (1) KR20060052135A (zh)
CN (1) CN1783373A (zh)
TW (1) TWI274355B (zh)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US7914755B2 (en) 2001-04-12 2011-03-29 Eestor, Inc. Method of preparing ceramic powders using chelate precursors
JP3816508B2 (ja) * 2004-11-04 2006-08-30 三井金属鉱業株式会社 キャパシタ層形成材及びそのキャパシタ層形成材を用いて得られる内蔵キャパシタ層を備えたプリント配線板
US20060269762A1 (en) * 2005-03-02 2006-11-30 Pulugurtha Markondeya R Reactively formed integrated capacitors on organic substrates and fabrication methods
KR100755603B1 (ko) * 2005-06-30 2007-09-06 삼성전기주식회사 내장형 박막 캐패시터, 적층구조물 및 제조방법
JP2007180093A (ja) * 2005-12-27 2007-07-12 Tdk Corp 薄膜デバイスおよびその製造方法
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP4983102B2 (ja) * 2006-06-06 2012-07-25 Tdk株式会社 誘電体素子
US7773364B2 (en) * 2006-07-26 2010-08-10 Tdk Corporation Method of manufacturing capacitor
US7993611B2 (en) 2006-08-02 2011-08-09 Eestor, Inc. Method of preparing ceramic powders using ammonium oxalate
US8853116B2 (en) 2006-08-02 2014-10-07 Eestor, Inc. Method of preparing ceramic powders
TW200810043A (en) * 2006-08-04 2008-02-16 Phoenix Prec Technology Corp Circuit board structure with capacitor embedded therein and method for fabricating the same
KR100878414B1 (ko) * 2006-10-27 2009-01-13 삼성전기주식회사 캐패시터 내장형 인쇄회로기판 및 제조방법
TWI387421B (zh) * 2006-12-26 2013-02-21 Mitsui Mining & Smelting Co A multilayer printed circuit board capacitor layer forming material, and a capacitor layer forming material
EP2141971A4 (en) * 2007-04-18 2011-01-05 Ibiden Co Ltd MULTILAYER CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US7952261B2 (en) 2007-06-29 2011-05-31 Bayer Materialscience Ag Electroactive polymer transducers for sensory feedback applications
US8940850B2 (en) 2012-08-30 2015-01-27 Carver Scientific, Inc. Energy storage device
US9011627B2 (en) 2007-10-05 2015-04-21 Carver Scientific, Inc. Method of manufacturing high permittivity low leakage capacitor and energy storing device
WO2009046341A1 (en) 2007-10-05 2009-04-09 David Carver High permittivity low leakage capacitor and energy storing device and method for forming the same
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
US20090202738A1 (en) * 2008-02-13 2009-08-13 E. I. Du Pont De Nemours And Company Process for making capacitors by direct heating of electrodes
WO2009126199A2 (en) 2008-03-11 2009-10-15 Carnegie Institution Of Washington New class of pure piezoeletric materials
US20090238955A1 (en) * 2008-03-20 2009-09-24 E. I. Du Pont De Nemours And Company Processes for the manufacture of barium titanate capacitors on nickel foils
US20090238954A1 (en) * 2008-03-20 2009-09-24 Seigi Suh Large area thin film capacitors on metal foils and methods of manufacturing same
JP4946978B2 (ja) * 2008-06-09 2012-06-06 住友金属鉱山株式会社 薄膜キャパシタ材の製造方法
JP5163330B2 (ja) * 2008-07-14 2013-03-13 株式会社村田製作所 薄膜積層体の加工方法
US20100024181A1 (en) * 2008-07-31 2010-02-04 E. I. Dupont De Nemours And Company Processes for forming barium titanate capacitors on microstructurally stable metal foil substrates
US9214280B2 (en) 2008-10-03 2015-12-15 Carver Scientific, Inc. Very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices
US9214281B2 (en) 2008-10-03 2015-12-15 Carver Scientific, Inc. Very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
WO2010058552A1 (ja) * 2008-11-19 2010-05-27 三洋電機株式会社 コンデンサ用電極体およびコンデンサ
WO2010088684A2 (en) * 2009-02-02 2010-08-05 Space Charge, LLC Capacitor using carbon-based extensions
US20100285316A1 (en) * 2009-02-27 2010-11-11 Eestor, Inc. Method of Preparing Ceramic Powders
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
US8088658B2 (en) 2009-04-28 2012-01-03 E. I. Du Pont De Nemours And Company Thin film capacitor and method of fabrication thereof
US8409963B2 (en) * 2009-04-28 2013-04-02 CDA Procesing Limited Liability Company Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
US8391017B2 (en) * 2009-04-28 2013-03-05 Georgia Tech Research Corporation Thin-film capacitor structures embedded in semiconductor packages and methods of making
US9275801B2 (en) 2010-03-19 2016-03-01 Cardiac Pacemakers, Inc. Systems and methods for enhanced dielectric properties for electrolytic capacitors
WO2012118916A2 (en) 2011-03-01 2012-09-07 Bayer Materialscience Ag Automated manufacturing processes for producing deformable polymer devices and films
JP2014517331A (ja) 2011-03-22 2014-07-17 バイエル・インテレクチュアル・プロパティ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング 電場応答性高分子アクチュエータレンチキュラシステム
KR101862396B1 (ko) * 2011-09-08 2018-05-30 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
US9876160B2 (en) 2012-03-21 2018-01-23 Parker-Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
CN102709053A (zh) * 2012-06-04 2012-10-03 电子科技大学 一种聚合物叠片式电容器及其制备方法
KR20150031285A (ko) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 연신 공정을 위한 연신 프레임
US10199165B2 (en) 2012-08-30 2019-02-05 Carver Scientific, Inc. Energy storage device
WO2014054609A1 (ja) * 2012-10-04 2014-04-10 株式会社東芝 半導体回路基板およびそれを用いた半導体装置並びに半導体回路基板の製造方法
TW201436311A (zh) * 2012-10-16 2014-09-16 拜耳智慧財產有限公司 金屬化介電膜之方法
US9590193B2 (en) 2012-10-24 2017-03-07 Parker-Hannifin Corporation Polymer diode
US9805869B2 (en) 2012-11-07 2017-10-31 Carver Scientific, Inc. High energy density electrostatic capacitor
WO2014081918A2 (en) * 2012-11-21 2014-05-30 3M Innovative Properties Company Multilayer film including first and second dielectric layers
US20150294793A1 (en) * 2012-11-21 2015-10-15 3M Innovative Properties Company Multilayer film including first and second dielectric layers
CN103208974A (zh) * 2013-03-13 2013-07-17 南京航空航天大学 用于大功率平面emi滤波器的差共模电容集成模块
CN104073677B (zh) * 2013-03-27 2017-01-11 株式会社神户制钢所 Led的引线框用铜合金板条
US9870863B2 (en) * 2014-03-28 2018-01-16 Goodrich Corporation Peak temperature attenuation film
CN108292514B (zh) 2015-11-06 2022-04-29 卡弗科学有限公司 电熵存储器设备
US9707738B1 (en) 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
US10278290B2 (en) 2016-07-19 2019-04-30 Tdk Corporation Electronic component embedded substrate
CN107665879A (zh) 2016-07-29 2018-02-06 奥特斯奥地利科技与系统技术有限公司 器件载体及包括所述器件载体的电子系统
JP6750462B2 (ja) * 2016-11-04 2020-09-02 Tdk株式会社 薄膜コンデンサ及び電子部品内蔵基板
CN110431647B (zh) 2016-12-02 2022-06-28 卡弗科学有限公司 存储设备和电容储能设备
JP6816486B2 (ja) * 2016-12-07 2021-01-20 凸版印刷株式会社 コア基板、多層配線基板、半導体パッケージ、半導体モジュール、銅張基板、及びコア基板の製造方法
CN108257942B (zh) * 2016-12-28 2020-06-09 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
US11651902B2 (en) * 2018-06-29 2023-05-16 Intel Corporation Patterning of thin film capacitors in organic substrate packages
EP3754725A4 (en) * 2018-12-25 2021-05-12 Shenzhen Goodix Technology Co., Ltd. CONDENSER AND METHOD OF MANUFACTURING THE CONDENSER
KR102281132B1 (ko) * 2019-10-24 2021-07-26 일진머티리얼즈 주식회사 박막형 커패시터 제조용 전해니켈박 및 그의 제조방법
JP7534898B2 (ja) * 2020-09-16 2024-08-15 Tdk株式会社 誘電体薄膜素子および電子回路装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155593A (en) * 1980-04-08 1981-12-01 Furukawa Circuit Foil Steel foil for printed circuit and method of manufacturing same
NL9000602A (nl) * 1990-03-16 1991-10-16 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting met geheugenelementen vormende condensatoren met een ferroelectrisch dielectricum.
KR100275899B1 (ko) 1990-05-30 2000-12-15 마이클 에이. 센타니 전착구리호일 및 클로라이드(chloride) 이온농도가 낮은 전해액을 사용하여 이를 제조하는 방법
US5413838A (en) * 1991-06-18 1995-05-09 Sumitomo Bakelite Company Limited Both-side roughened copper foil with protection film
US5545466A (en) * 1993-03-19 1996-08-13 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate and printed wiring board
US5482784A (en) 1993-12-24 1996-01-09 Mitsui Mining And Smelting Co., Ltd. Printed circuit inner-layer copper foil and process for producing the same
JPH09139480A (ja) * 1995-01-27 1997-05-27 Toshiba Corp 薄膜キャパシタおよびこれを用いた半導体記憶装置
JP3155920B2 (ja) * 1996-01-16 2001-04-16 三井金属鉱業株式会社 プリント配線板用電解銅箔及びその製造方法
JP2001503197A (ja) 1996-08-12 2001-03-06 エナージーニアス,インコーポレイテッド 半導体スーパーキャパシタシステム、その製法、及び該製法による製品
US20040109298A1 (en) 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
JP3291482B2 (ja) 1999-08-31 2002-06-10 三井金属鉱業株式会社 整面電解銅箔、その製造方法および用途
US6780704B1 (en) 1999-12-03 2004-08-24 Asm International Nv Conformal thin films over textured capacitor electrodes
US20020075631A1 (en) * 1999-12-30 2002-06-20 Applied Materials, Inc. Iridium and iridium oxide electrodes used in ferroelectric capacitors
US6657849B1 (en) * 2000-08-24 2003-12-02 Oak-Mitsui, Inc. Formation of an embedded capacitor plane using a thin dielectric
US6610417B2 (en) 2001-10-04 2003-08-26 Oak-Mitsui, Inc. Nickel coated copper as electrodes for embedded passive devices
US6693793B2 (en) 2001-10-15 2004-02-17 Mitsui Mining & Smelting Co., Ltd. Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
US6555912B1 (en) * 2001-10-23 2003-04-29 International Business Machines Corporation Corrosion-resistant electrode structure for integrated circuit decoupling capacitors
US6819540B2 (en) 2001-11-26 2004-11-16 Shipley Company, L.L.C. Dielectric structure
US6661642B2 (en) 2001-11-26 2003-12-09 Shipley Company, L.L.C. Dielectric structure
EP1327995A3 (en) 2002-01-11 2005-10-12 Shipley Co. L.L.C. Resistor structure
US6984456B2 (en) * 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
US6818469B2 (en) 2002-05-27 2004-11-16 Nec Corporation Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
US20040126484A1 (en) 2002-12-30 2004-07-01 Robert Croswell Method for forming ceramic film capacitors
JP2004263296A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法

Also Published As

Publication number Publication date
US20060079050A1 (en) 2006-04-13
CN1783373A (zh) 2006-06-07
TWI274355B (en) 2007-02-21
KR20060052135A (ko) 2006-05-19
JP2006140454A (ja) 2006-06-01
EP1646072A3 (en) 2009-03-04
US7190016B2 (en) 2007-03-13
EP1646072A2 (en) 2006-04-12

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