TW200624251A - Flexible copper-polyimide laminate and manufacturing method thereof - Google Patents

Flexible copper-polyimide laminate and manufacturing method thereof

Info

Publication number
TW200624251A
TW200624251A TW094130096A TW94130096A TW200624251A TW 200624251 A TW200624251 A TW 200624251A TW 094130096 A TW094130096 A TW 094130096A TW 94130096 A TW94130096 A TW 94130096A TW 200624251 A TW200624251 A TW 200624251A
Authority
TW
Taiwan
Prior art keywords
mol
represented
formula
flexible copper
repeating unit
Prior art date
Application number
TW094130096A
Other languages
Chinese (zh)
Other versions
TWI267442B (en
Inventor
Sang-Kyun Kim
Jeong-Yeol Moon
Tae-Hyung Kim
Seong-Geun Kim
Chang-Beom Chung
Jong-Min Park
Original Assignee
Kolon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolon Inc filed Critical Kolon Inc
Publication of TW200624251A publication Critical patent/TW200624251A/en
Application granted granted Critical
Publication of TWI267442B publication Critical patent/TWI267442B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The present invention provides a flexible copper-polyimide laminate including a linear random block polyimide layer formed on the at least one side thereof, the linear random block polyimide layer comprising 0.25 to 90.25 mol.% of a repeating unit l represented by the formula 1, 0.25 to 90.25 mol.% of a repeating unit m represented by the formula 2, 0.25 to 90.25 mol.% of a repeating unit n represented by the formula 3, and 0.25 to 90.25 mol.% of a repeating unit o represented by the formula 4. The flexible copper-polyimide laminate having a polyimide layer is free from curls and excellent in dimensional stability, tensile property, folding endurance and resistance to flexural fatigue with low moisture content.
TW94130096A 2004-09-03 2005-09-02 Flexible copper-polyimide laminate and manufacturing method thereof TWI267442B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040070206A KR100591068B1 (en) 2004-09-03 2004-09-03 Flexible Copper Foil Polyimide Laminates and Manufacturing Method Thereof

Publications (2)

Publication Number Publication Date
TW200624251A true TW200624251A (en) 2006-07-16
TWI267442B TWI267442B (en) 2006-12-01

Family

ID=36000294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94130096A TWI267442B (en) 2004-09-03 2005-09-02 Flexible copper-polyimide laminate and manufacturing method thereof

Country Status (5)

Country Link
JP (1) JP2008511475A (en)
KR (1) KR100591068B1 (en)
CN (1) CN101010191B (en)
TW (1) TWI267442B (en)
WO (1) WO2006025684A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548524B (en) * 2012-09-28 2016-09-11 Dainippon Ink & Chemicals Laminated body, conductive pattern and circuit

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4767517B2 (en) * 2004-09-14 2011-09-07 三菱瓦斯化学株式会社 Resin composite copper foil, copper-clad laminate and printed wiring board using the same
KR101231941B1 (en) * 2006-03-09 2013-02-08 코오롱인더스트리 주식회사 Polyimide film and metal-Clad Laminates
CN100413911C (en) * 2006-09-06 2008-08-27 湖北省化学研究院 A kind of glue-free flexible aluminum-clad board and polyimide matrix resin used therefor
JP5346078B2 (en) * 2008-05-20 2013-11-20 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Thermal and dimensionally stable polyimide films and methods related thereto
KR101064816B1 (en) * 2009-04-03 2011-09-14 주식회사 두산 Polyamic Acid Solution, Polyimide Resin, and Flexible Metal Foil Laminate Using the Same
EP2501741A1 (en) * 2009-11-20 2012-09-26 E. I. du Pont de Nemours and Company Coverlay compositions and methods relating thereto
CN105131285B (en) * 2015-09-25 2017-12-08 太原理工大学 A kind of synthetic method of printing opacity electronic packaging polyimide material
GB2562736B (en) * 2017-05-23 2019-08-28 Shenzhen Dansha Tech Co Ltd Wearable power management system
JP6950307B2 (en) * 2017-07-10 2021-10-13 富士フイルムビジネスイノベーション株式会社 Particle-dispersed polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film
CN112194792B (en) * 2020-06-16 2022-03-29 中国科学院长春应用化学研究所 High-strength low-thermal-expansion transparent polyimide and preparation method thereof
JP7742740B2 (en) * 2021-08-30 2025-09-22 日鉄ケミカル＆マテリアル株式会社 Polyamic acid composition and method for producing same

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JPS6384188A (en) * 1986-09-29 1988-04-14 新日鐵化学株式会社 Manufacturing method of flexible printed circuit board
JPH02150453A (en) * 1988-12-01 1990-06-08 Sumitomo Bakelite Co Ltd Polyimide film and its production
JPH0446983A (en) * 1990-06-14 1992-02-17 Sumitomo Bakelite Co Ltd Polyimide adhesive
EP0474054B1 (en) * 1990-08-27 1995-12-06 E.I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
US5411795A (en) * 1992-10-14 1995-05-02 Monsanto Company Electroless deposition of metal employing thermally stable carrier polymers
KR960012028B1 (en) * 1993-10-28 1996-09-11 주식회사 선경인더스트리 Manufacturing method of polyimide separation membrane
JP3523952B2 (en) * 1995-12-26 2004-04-26 日東電工株式会社 Polyimide-metal foil composite film
JP3395640B2 (en) * 1998-03-31 2003-04-14 宇部興産株式会社 Metal layer laminated film
JP4491986B2 (en) * 2001-03-29 2010-06-30 宇部興産株式会社 Surface treatment method and polyimide film having metal thin film
EP1448669B1 (en) * 2001-09-27 2010-04-07 LG Chem Ltd. Adhesive composition comprising a polyimide copolymer and method for preparing the same
CN100376386C (en) * 2001-11-01 2008-03-26 荒川化学工业株式会社 Polyimide-metal laminates and polyamideimide-metal laminates
JP2004068002A (en) 2002-06-13 2004-03-04 Du Pont Toray Co Ltd Method for producing polyimide mixed film and metal wiring circuit board using the same
KR100517233B1 (en) * 2002-07-01 2005-09-27 미쓰이 가가쿠 가부시키가이샤 Polyimide resin and polyimide-metal clad laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548524B (en) * 2012-09-28 2016-09-11 Dainippon Ink & Chemicals Laminated body, conductive pattern and circuit

Also Published As

Publication number Publication date
TWI267442B (en) 2006-12-01
JP2008511475A (en) 2008-04-17
CN101010191A (en) 2007-08-01
WO2006025684A1 (en) 2006-03-09
KR100591068B1 (en) 2006-06-19
CN101010191B (en) 2012-07-04
KR20060021458A (en) 2006-03-08

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