TW200624716A - Illuminator and method for producing such illuminator - Google Patents

Illuminator and method for producing such illuminator

Info

Publication number
TW200624716A
TW200624716A TW094140141A TW94140141A TW200624716A TW 200624716 A TW200624716 A TW 200624716A TW 094140141 A TW094140141 A TW 094140141A TW 94140141 A TW94140141 A TW 94140141A TW 200624716 A TW200624716 A TW 200624716A
Authority
TW
Taiwan
Prior art keywords
illuminator
producing
conductive layer
reflective layer
structured conductive
Prior art date
Application number
TW094140141A
Other languages
Chinese (zh)
Inventor
Chirstoph Gerard August Hoelen
Den Ackerveken Antonius Constant Johanna Corne Van
Cornelius Franciscus Jozef Rutjes
Os Koen Van
Samber Marc Andre De
Theodoor Cornelis Treurniet
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200624716A publication Critical patent/TW200624716A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light source (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.
TW094140141A 2004-11-18 2005-11-15 Illuminator and method for producing such illuminator TW200624716A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04105892 2004-11-18

Publications (1)

Publication Number Publication Date
TW200624716A true TW200624716A (en) 2006-07-16

Family

ID=35695734

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140141A TW200624716A (en) 2004-11-18 2005-11-15 Illuminator and method for producing such illuminator

Country Status (8)

Country Link
US (1) US8541797B2 (en)
EP (1) EP1815535B1 (en)
JP (1) JP5038147B2 (en)
KR (1) KR101187746B1 (en)
CN (1) CN101061590B (en)
AT (1) ATE541320T1 (en)
TW (1) TW200624716A (en)
WO (1) WO2006054228A2 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9111950B2 (en) * 2006-09-28 2015-08-18 Philips Lumileds Lighting Company, Llc Process for preparing a semiconductor structure for mounting
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
DE102015119343B4 (en) * 2015-11-10 2024-05-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Arrangement with a carrier made of a glass material and an optoelectronic semiconductor component and method for producing such an arrangement

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3869637A (en) * 1972-04-28 1975-03-04 Sony Corp Alpha-numeric display device utilizing light emitting diodes
JPS63174379A (en) * 1987-01-14 1988-07-18 Toshiba Corp Luminous display device
JP3023883B2 (en) * 1991-10-26 2000-03-21 ローム株式会社 Submount laser
EP0582078B1 (en) * 1992-08-05 2000-08-16 Motorola, Inc. Superluminescent edge emitting device
US5397867A (en) * 1992-09-04 1995-03-14 Lucas Industries, Inc. Light distribution for illuminated keyboard switches and displays
JPH06318734A (en) * 1993-05-10 1994-11-15 Rohm Co Ltd Led line light source
US5710441A (en) * 1995-10-30 1998-01-20 Motorola, Inc. Microcavity LED with photon recycling
US20020068373A1 (en) * 2000-02-16 2002-06-06 Nova Crystals, Inc. Method for fabricating light emitting diodes
WO2001084640A1 (en) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Gan-based light-emitting-diode chip and a method for producing a luminescent diode component
TW501282B (en) * 2000-06-07 2002-09-01 Semiconductor Energy Lab Method of manufacturing semiconductor device
TW507482B (en) * 2000-06-09 2002-10-21 Sanyo Electric Co Light emitting device, its manufacturing process, and lighting device using such a light-emitting device
JP2002221801A (en) * 2001-01-29 2002-08-09 Hitachi Ltd Wiring board manufacturing method
TW525278B (en) * 2001-03-15 2003-03-21 Opto Tech Corp Package structure of high-efficiency electro-optical device and the forming method thereof
JP4101468B2 (en) * 2001-04-09 2008-06-18 豊田合成株式会社 Method for manufacturing light emitting device
IE20020300A1 (en) 2001-04-23 2003-03-19 Plasma Ireland Ltd An Illuminator
TWI243095B (en) * 2001-04-24 2005-11-11 Mitsui Chemicals Inc Lamp reflector and reflector
TW543128B (en) * 2001-07-12 2003-07-21 Highlink Technology Corp Surface mounted and flip chip type LED package
US6594414B2 (en) * 2001-07-25 2003-07-15 Motorola, Inc. Structure and method of fabrication for an optical switch
JP3627707B2 (en) * 2002-01-23 2005-03-09 富士電機ホールディングス株式会社 Color conversion filter substrate, organic multicolor EL display panel using the same, and manufacturing method thereof
KR100909733B1 (en) * 2002-01-28 2009-07-29 니치아 카가쿠 고교 가부시키가이샤 Nitride semiconductor device having support substrate and manufacturing method thereof
US6924514B2 (en) * 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
JP2003273405A (en) * 2002-03-19 2003-09-26 Kyocera Corp Light emitting element storage package
JP2004022895A (en) * 2002-06-18 2004-01-22 Kyocera Corp Light emitting element mounting substrate
JP2004047748A (en) * 2002-07-12 2004-02-12 Stanley Electric Co Ltd Light emitting diode
JP4307094B2 (en) * 2003-02-04 2009-08-05 パナソニック株式会社 LED light source, LED illumination device, and LED display device
JP4527714B2 (en) * 2003-02-07 2010-08-18 パナソニック株式会社 Metal base substrate for light emitter, light emission source, illumination device and display device
JP2004265977A (en) * 2003-02-28 2004-09-24 Noritsu Koki Co Ltd Light emitting diode light source unit
DE10308866A1 (en) * 2003-02-28 2004-09-09 Osram Opto Semiconductors Gmbh Lighting module and method for its production
US20040184270A1 (en) * 2003-03-17 2004-09-23 Halter Michael A. LED light module with micro-reflector cavities
US6809261B1 (en) * 2003-06-23 2004-10-26 Agilent Technologies, Inc. Physically compact device package
JP3841092B2 (en) * 2003-08-26 2006-11-01 住友電気工業株式会社 Light emitting device
US7183587B2 (en) * 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US6995402B2 (en) * 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
US7157744B2 (en) * 2003-10-29 2007-01-02 M/A-Com, Inc. Surface mount package for a high power light emitting diode
KR100590532B1 (en) * 2003-12-22 2006-06-15 삼성전자주식회사 Flip chip type nitride light emitting device and its manufacturing method
KR100624416B1 (en) * 2003-12-23 2006-09-18 삼성전자주식회사 Flip chip type nitride light emitting device and its manufacturing method
JP2005252219A (en) 2004-02-06 2005-09-15 Toyoda Gosei Co Ltd Light emitting device and sealing member
US20050211991A1 (en) * 2004-03-26 2005-09-29 Kyocera Corporation Light-emitting apparatus and illuminating apparatus
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US20060124953A1 (en) * 2004-12-14 2006-06-15 Negley Gerald H Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same
TW200638559A (en) * 2005-04-29 2006-11-01 Hon Hai Prec Ind Co Ltd Light emitting chip and light emitting diode
TWI322522B (en) * 2006-12-18 2010-03-21 Delta Electronics Inc Electroluminescent device, and fabrication method thereof

Also Published As

Publication number Publication date
CN101061590B (en) 2010-05-12
JP2008521236A (en) 2008-06-19
WO2006054228A2 (en) 2006-05-26
ATE541320T1 (en) 2012-01-15
EP1815535A2 (en) 2007-08-08
EP1815535B1 (en) 2012-01-11
JP5038147B2 (en) 2012-10-03
US20090078948A1 (en) 2009-03-26
US8541797B2 (en) 2013-09-24
KR20070089167A (en) 2007-08-30
WO2006054228A3 (en) 2006-08-03
KR101187746B1 (en) 2012-10-05
CN101061590A (en) 2007-10-24

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