TW200624716A - Illuminator and method for producing such illuminator - Google Patents
Illuminator and method for producing such illuminatorInfo
- Publication number
- TW200624716A TW200624716A TW094140141A TW94140141A TW200624716A TW 200624716 A TW200624716 A TW 200624716A TW 094140141 A TW094140141 A TW 094140141A TW 94140141 A TW94140141 A TW 94140141A TW 200624716 A TW200624716 A TW 200624716A
- Authority
- TW
- Taiwan
- Prior art keywords
- illuminator
- producing
- conductive layer
- reflective layer
- structured conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Led Device Packages (AREA)
- Optical Elements Other Than Lenses (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to an illuminator (10) comprising a substrate (12), a structured conductive layer (16) applied to one surface of the substrate, and at least one light source (18, 26) connected to the structured conductive layer. The illuminator is characterized in that it further comprises an unstructured reflective layer (24) applied on top of said structured conductive layer, which unstructured reflective layer has an essentially continuous extension at least in a surrounding of the at least one light source. Due to the unstructured reflective layer, the optical efficiency of the illuminator can be improved. The invention also relates to a method for producing such illuminator.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04105892 | 2004-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200624716A true TW200624716A (en) | 2006-07-16 |
Family
ID=35695734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094140141A TW200624716A (en) | 2004-11-18 | 2005-11-15 | Illuminator and method for producing such illuminator |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8541797B2 (en) |
| EP (1) | EP1815535B1 (en) |
| JP (1) | JP5038147B2 (en) |
| KR (1) | KR101187746B1 (en) |
| CN (1) | CN101061590B (en) |
| AT (1) | ATE541320T1 (en) |
| TW (1) | TW200624716A (en) |
| WO (1) | WO2006054228A2 (en) |
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|---|---|---|---|---|
| US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
| US8669572B2 (en) | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
| US7675145B2 (en) | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
| US8748915B2 (en) | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
| US11210971B2 (en) | 2009-07-06 | 2021-12-28 | Cree Huizhou Solid State Lighting Company Limited | Light emitting diode display with tilted peak emission pattern |
| US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
| US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
| US8367945B2 (en) | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US9111950B2 (en) * | 2006-09-28 | 2015-08-18 | Philips Lumileds Lighting Company, Llc | Process for preparing a semiconductor structure for mounting |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
| USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
| USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
| USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
| US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
| US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
| US8791471B2 (en) * | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
| US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
| US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
| US8598809B2 (en) | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| US8455882B2 (en) | 2010-10-15 | 2013-06-04 | Cree, Inc. | High efficiency LEDs |
| US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
| DE102015119343B4 (en) * | 2015-11-10 | 2024-05-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Arrangement with a carrier made of a glass material and an optoelectronic semiconductor component and method for producing such an arrangement |
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-
2005
- 2005-11-14 CN CN2005800395819A patent/CN101061590B/en not_active Expired - Lifetime
- 2005-11-14 US US11/719,240 patent/US8541797B2/en active Active
- 2005-11-14 WO PCT/IB2005/053742 patent/WO2006054228A2/en not_active Ceased
- 2005-11-14 AT AT05805752T patent/ATE541320T1/en active
- 2005-11-14 EP EP05805752A patent/EP1815535B1/en not_active Expired - Lifetime
- 2005-11-14 KR KR1020077013555A patent/KR101187746B1/en not_active Expired - Lifetime
- 2005-11-14 JP JP2007542396A patent/JP5038147B2/en not_active Expired - Lifetime
- 2005-11-15 TW TW094140141A patent/TW200624716A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008521236A (en) | 2008-06-19 |
| KR101187746B1 (en) | 2012-10-05 |
| CN101061590A (en) | 2007-10-24 |
| JP5038147B2 (en) | 2012-10-03 |
| ATE541320T1 (en) | 2012-01-15 |
| CN101061590B (en) | 2010-05-12 |
| US8541797B2 (en) | 2013-09-24 |
| EP1815535A2 (en) | 2007-08-08 |
| EP1815535B1 (en) | 2012-01-11 |
| KR20070089167A (en) | 2007-08-30 |
| WO2006054228A2 (en) | 2006-05-26 |
| US20090078948A1 (en) | 2009-03-26 |
| WO2006054228A3 (en) | 2006-08-03 |
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