TW200629009A - Method, treatment liquid and apparatus for removing adhesive material from substrate surface - Google Patents

Method, treatment liquid and apparatus for removing adhesive material from substrate surface

Info

Publication number
TW200629009A
TW200629009A TW094135368A TW94135368A TW200629009A TW 200629009 A TW200629009 A TW 200629009A TW 094135368 A TW094135368 A TW 094135368A TW 94135368 A TW94135368 A TW 94135368A TW 200629009 A TW200629009 A TW 200629009A
Authority
TW
Taiwan
Prior art keywords
fouling
organic system
treatment
treatment liquid
ozone
Prior art date
Application number
TW094135368A
Other languages
Chinese (zh)
Inventor
Hisashi Muraoka
Tadashi Nozaki
Original Assignee
Purex Co Ltd
Ums Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Purex Co Ltd, Ums Co Ltd filed Critical Purex Co Ltd
Publication of TW200629009A publication Critical patent/TW200629009A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

To provide a removing a treatment liquid, a treatment method and a removing device of an organic system fouling on a substrate surface capable of removing even a resist film hardened and denaturalized by high-concentration ion implantation at room temperature and provided with a multi-repeatable treatment capacity using environment-friendliness and ozone regeneration at almost the same level of ethylene carbonate (EC) treatment. (1) The removing method of the organic system fouling on the substrate surface, wherein the fouling is exfoliated by contacting the treatment liquid containing a mixed solvent composed of EC of a weight ratio 85/15 to 55/45 and α-butyrolactone (GBL) with the substrate having the organic system fouling on the surface.(2) The removing treatment of the organic system fouling, wherein a reaction product of the mixed solvent and ozone and a reaction product of the organic system fouling and ozone are contained in 0 to 5 weight% in total and a residue is the mixed solvent.(3) The removing device of the organic system fouling, wherein the system has a treatment liquid introducing means, a fouling contacting means, a treatment liquid circulating means and an ozone containing gas contacting means.
TW094135368A 2004-10-19 2005-10-11 Method, treatment liquid and apparatus for removing adhesive material from substrate surface TW200629009A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004304409 2004-10-19

Publications (1)

Publication Number Publication Date
TW200629009A true TW200629009A (en) 2006-08-16

Family

ID=36840240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094135368A TW200629009A (en) 2004-10-19 2005-10-11 Method, treatment liquid and apparatus for removing adhesive material from substrate surface

Country Status (3)

Country Link
KR (1) KR20060054058A (en)
CN (1) CN100582950C (en)
TW (1) TW200629009A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460556B (en) * 2007-11-01 2014-11-11 Dongjin Semichem Co Ltd Composition for stripping photoresist, method of stripping photoresist and method of manufacturing display device using the same
US9202731B2 (en) 2010-12-27 2015-12-01 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and recording medium having program for executing liquid processing method recorded therein

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101257409B1 (en) * 2006-01-10 2013-04-23 주식회사 동진쎄미켐 Composition for removing a (photo)resist
KR101294019B1 (en) * 2007-02-20 2013-08-16 주식회사 동진쎄미켐 Composition for stripping photoresist and method of stripping photoresist using the same
KR102021158B1 (en) * 2012-06-26 2019-09-11 노무라마이크로사이엔스가부시키가이샤 Resist stripping agent
JP2014080490A (en) * 2012-10-16 2014-05-08 Seiko Epson Corp Cleaning fluid for inkjet applications
CN104073381A (en) * 2013-03-29 2014-10-01 扬州新天然橡塑制品有限公司 Stripping roller aspirate detergent
CN106493121B (en) * 2016-11-01 2017-10-03 武汉大学 A kind of nanometer cleaning method based on active liquid and laser
CN106532101A (en) * 2016-12-03 2017-03-22 合肥国轩高科动力能源有限公司 A solution for removing sticky materials on the surface of rolls and its preparation method
CN109174754A (en) * 2018-08-20 2019-01-11 六安名家汇光电科技有限公司 A kind of dust removal method of the lamp housing of LED wall wash lamp
CN120436167A (en) 2020-03-19 2025-08-08 昂萨公司 Delivery of gas-phase antimicrobials via injected crystalline and porous solids
CN113805431B (en) * 2021-09-01 2023-11-03 合肥清溢光电有限公司 Stripping method and stripping device for small-size test plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460556B (en) * 2007-11-01 2014-11-11 Dongjin Semichem Co Ltd Composition for stripping photoresist, method of stripping photoresist and method of manufacturing display device using the same
US9202731B2 (en) 2010-12-27 2015-12-01 Tokyo Electron Limited Liquid processing apparatus, liquid processing method, and recording medium having program for executing liquid processing method recorded therein

Also Published As

Publication number Publication date
KR20060054058A (en) 2006-05-22
CN100582950C (en) 2010-01-20
CN1808286A (en) 2006-07-26

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