TW200629986A - Plasma processing apparatus - Google Patents

Plasma processing apparatus

Info

Publication number
TW200629986A
TW200629986A TW095102932A TW95102932A TW200629986A TW 200629986 A TW200629986 A TW 200629986A TW 095102932 A TW095102932 A TW 095102932A TW 95102932 A TW95102932 A TW 95102932A TW 200629986 A TW200629986 A TW 200629986A
Authority
TW
Taiwan
Prior art keywords
processing apparatus
plasma processing
plasma
substrate
cooler
Prior art date
Application number
TW095102932A
Other languages
Chinese (zh)
Other versions
TWI314842B (en
Inventor
Young-Jong Lee
Jun-Young Choi
Hyoung-Kyu Son
Jeong-Bin Lee
Chang-Keun Lee
Young Bae Ko
Chun Sik Kim
Original Assignee
Advanced Display Proc Eng Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050008023A external-priority patent/KR100571309B1/en
Priority claimed from KR1020050008021A external-priority patent/KR100572118B1/en
Priority claimed from KR1020050010470A external-priority patent/KR100914652B1/en
Priority claimed from KR1020050015540A external-priority patent/KR100697557B1/en
Priority claimed from KR1020050052017A external-priority patent/KR100559787B1/en
Priority claimed from KR1020050069398A external-priority patent/KR101079224B1/en
Application filed by Advanced Display Proc Eng Co filed Critical Advanced Display Proc Eng Co
Publication of TW200629986A publication Critical patent/TW200629986A/en
Application granted granted Critical
Publication of TWI314842B publication Critical patent/TWI314842B/en

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)

Abstract

A plasma processing apparatus is disclosed which performs a desired process for a substrate, using plasma generated in a chamber defined in the plasma processing apparatus and maintained in a vacuum state. The plasma processing apparatus includes a cooler which effectively cools an electrode unit included in the plasma processing apparatus, in order to enable uniform processing of a large-area substrate.
TW095102932A 2005-01-28 2006-01-25 Plasma processing apparatus TWI314842B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020050008023A KR100571309B1 (en) 2005-01-28 2005-01-28 Plasma processing equipment
KR1020050008021A KR100572118B1 (en) 2005-01-28 2005-01-28 Plasma processing equipment
KR1020050010470A KR100914652B1 (en) 2005-02-04 2005-02-04 Plasma processing equipment
KR1020050015540A KR100697557B1 (en) 2005-02-24 2005-02-24 Plasma treatment device and temperature control plate manufacturing method
KR1020050052017A KR100559787B1 (en) 2005-06-16 2005-06-16 Plasma processing equipment
KR1020050069398A KR101079224B1 (en) 2005-07-29 2005-07-29 Top electrode assembly and plasma processing apparatus

Publications (2)

Publication Number Publication Date
TW200629986A true TW200629986A (en) 2006-08-16
TWI314842B TWI314842B (en) 2009-09-11

Family

ID=45072995

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102932A TWI314842B (en) 2005-01-28 2006-01-25 Plasma processing apparatus

Country Status (1)

Country Link
TW (1) TWI314842B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414016B (en) * 2007-02-06 2013-11-01 Ｓｏｓｕｌ股份有限公司 Device for performing plasma etching process

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101123004B1 (en) * 2009-09-18 2012-03-12 주성엔지니어링(주) Plasma processing apparatus
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US9338871B2 (en) 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414016B (en) * 2007-02-06 2013-11-01 Ｓｏｓｕｌ股份有限公司 Device for performing plasma etching process

Also Published As

Publication number Publication date
TWI314842B (en) 2009-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees