TW200632146A - Immersion process for electroplating applications - Google Patents

Immersion process for electroplating applications

Info

Publication number
TW200632146A
TW200632146A TW095103955A TW95103955A TW200632146A TW 200632146 A TW200632146 A TW 200632146A TW 095103955 A TW095103955 A TW 095103955A TW 95103955 A TW95103955 A TW 95103955A TW 200632146 A TW200632146 A TW 200632146A
Authority
TW
Taiwan
Prior art keywords
substrate
immersion process
waveform
electroplating applications
plating solution
Prior art date
Application number
TW095103955A
Other languages
Chinese (zh)
Inventor
Hooman Hafezi
Joseph Behnke
Aron Rosenfeld
Timothy R Webb
Joseph Yahalom
Christopher Reiss Mcguirk
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200632146A publication Critical patent/TW200632146A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

A method for immersing a substrate into a plating solution. In one embodiment, the method includes applying a first waveform to the substrate as the substrate is being immersed into the plating solution, stopping the application of the first waveform to the substrate as soon as the substrate is fully immersed inside the plating solution, and applying a second waveform to the substrate prior to the substrate being situated into a plating position.
TW095103955A 2005-02-07 2006-02-06 Immersion process for electroplating applications TW200632146A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/052,443 US20060175201A1 (en) 2005-02-07 2005-02-07 Immersion process for electroplating applications

Publications (1)

Publication Number Publication Date
TW200632146A true TW200632146A (en) 2006-09-16

Family

ID=36778835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103955A TW200632146A (en) 2005-02-07 2006-02-06 Immersion process for electroplating applications

Country Status (3)

Country Link
US (1) US20060175201A1 (en)
TW (1) TW200632146A (en)
WO (1) WO2006086169A2 (en)

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US10508358B2 (en) * 2012-09-17 2019-12-17 Government Of The United States Of America, As Represented By The Secretary Of Commerce Process for forming a transition zone terminated superconformal filling
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US11814743B2 (en) * 2020-06-15 2023-11-14 Taiwan Semiconductor Manufacturing Company, Ltd. Plating membrane

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Also Published As

Publication number Publication date
WO2006086169A3 (en) 2007-11-15
US20060175201A1 (en) 2006-08-10
WO2006086169A2 (en) 2006-08-17

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