TW200632147A - - Google Patents

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Publication number
TW200632147A
TW200632147A TW940139666A TW940139666A TW200632147A TW 200632147 A TW200632147 A TW 200632147A TW 940139666 A TW940139666 A TW 940139666A TW 940139666 A TW940139666 A TW 940139666A TW 200632147 A TW200632147 A TW 200632147A
Authority
TW
Taiwan
Prior art keywords
electrolytic plating
composition according
plating composition
cationic species
patent application
Prior art date
Application number
TW940139666A
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English (en)
Chinese (zh)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36337269&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200632147(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of TW200632147A publication Critical patent/TW200632147A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW940139666A 2004-11-12 2005-11-11 TW200632147A (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62770004P 2004-11-12 2004-11-12

Publications (1)

Publication Number Publication Date
TW200632147A true TW200632147A (2) 2006-09-16

Family

ID=36337269

Family Applications (2)

Application Number Title Priority Date Filing Date
TW940139666A TW200632147A (2) 2004-11-12 2005-11-11
TW094139666A TWI400365B (zh) 2004-11-12 2005-11-11 微電子裝置上的銅電沈積

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW094139666A TWI400365B (zh) 2004-11-12 2005-11-11 微電子裝置上的銅電沈積

Country Status (8)

Country Link
US (3) US7303992B2 (2)
EP (1) EP1810322B1 (2)
JP (1) JP4888913B2 (2)
KR (1) KR101138588B1 (2)
CN (1) CN101099231B (2)
IN (1) IN2007DE03488A (2)
TW (2) TW200632147A (2)
WO (1) WO2006053242A2 (2)

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TWI487814B (zh) * 2009-04-07 2015-06-11 巴地斯顏料化工廠 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物
TWI489011B (zh) * 2009-04-07 2015-06-21 巴地斯顏料化工廠 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物
TWI489012B (zh) * 2009-04-07 2015-06-21 巴地斯顏料化工廠 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物

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JP2008519908A (ja) 2008-06-12
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EP1810322B1 (en) 2022-07-27
KR101138588B1 (ko) 2012-06-27
USRE49202E1 (en) 2022-09-06
JP4888913B2 (ja) 2012-02-29
WO2006053242A3 (en) 2006-06-29
US20070289875A1 (en) 2007-12-20
US7815786B2 (en) 2010-10-19
CN101099231B (zh) 2011-06-29
US20060141784A1 (en) 2006-06-29
IN2007DE03488A (2) 2007-08-31
US7303992B2 (en) 2007-12-04
WO2006053242A2 (en) 2006-05-18
CN101099231A (zh) 2008-01-02
EP1810322A2 (en) 2007-07-25
TWI400365B (zh) 2013-07-01

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