TW200635687A - Method and device for cutting fragile material plate - Google Patents

Method and device for cutting fragile material plate

Info

Publication number
TW200635687A
TW200635687A TW095106167A TW95106167A TW200635687A TW 200635687 A TW200635687 A TW 200635687A TW 095106167 A TW095106167 A TW 095106167A TW 95106167 A TW95106167 A TW 95106167A TW 200635687 A TW200635687 A TW 200635687A
Authority
TW
Taiwan
Prior art keywords
plate member
fragile material
material plate
upper plate
lower plate
Prior art date
Application number
TW095106167A
Other languages
Chinese (zh)
Inventor
Yukihiro Uehara
Tomoo Uchikata
Chisa Inaka
Toshiyuki Jinda
Yasushi Maeda
Akihiro Kanazawa
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200635687A publication Critical patent/TW200635687A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

To cut a fragile material plate in a lattice shape by using laser beam without forming extra preliminary cutting groove. This device comprises a rotary table (1) pivotally supporting a glass plate having a lower plate member (1a), an upper plate member (1b), a spacer (1c) interposed along a center axis parallel with a first direction so as to connect the lower plate member (1a) to the upper plate member (1b), and actuators (1d) installed at the corner parts of the lower plate member (1a) and raising the corner parts of the upper plate member (1b).
TW095106167A 2005-02-23 2006-02-23 Method and device for cutting fragile material plate TW200635687A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005046365 2005-02-23

Publications (1)

Publication Number Publication Date
TW200635687A true TW200635687A (en) 2006-10-16

Family

ID=36927274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106167A TW200635687A (en) 2005-02-23 2006-02-23 Method and device for cutting fragile material plate

Country Status (5)

Country Link
JP (1) JP4884370B2 (en)
KR (1) KR20070106714A (en)
CN (1) CN101128294B (en)
TW (1) TW200635687A (en)
WO (1) WO2006090632A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070106714A (en) * 2005-02-23 2007-11-05 도레이 엔지니어링 가부시키가이샤 Brittle material plate cutting method and apparatus
JP2011131229A (en) * 2009-12-24 2011-07-07 Hitachi High-Technologies Corp Laser beam machining method, laser beam machining apparatus, and solar panel manufacturing method
KR101395054B1 (en) 2012-08-08 2014-05-14 삼성코닝정밀소재 주식회사 Cutting method and stage for cutting of tempered glass
KR101457445B1 (en) * 2013-05-09 2014-11-06 주식회사 케이엔제이 Cover glass manufacturing method
JP6428643B2 (en) * 2013-12-27 2018-11-28 Ａｇｃ株式会社 Method for processing brittle plate and apparatus for processing brittle plate
CN105643819B (en) * 2016-03-18 2017-10-03 武汉华工激光工程有限责任公司 Sapphire wafer sliver apparatus and method based on laser scribing processing technology
KR102394243B1 (en) * 2021-12-15 2022-05-03 이성준 Ceramic Plate Orthogonal Cutting System
CN114473245A (en) * 2022-03-18 2022-05-13 无锡革新幕墙装饰工程有限公司 Cutting device is used in production of curved surface curtain
KR102506881B1 (en) * 2022-10-24 2023-03-07 주식회사 조호레이저 Laser Cutting Method
CN116393842A (en) * 2023-05-26 2023-07-07 深圳铭创智能装备有限公司 Curved glass edge film cutting device and using method thereof
CN116690126A (en) * 2023-07-28 2023-09-05 宁波江丰电子材料股份有限公司 A welding method for indium tin oxide target assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603990A (en) * 1983-06-22 1985-01-10 Hitachi Ltd Laser working device
JPH08175837A (en) * 1994-12-26 1996-07-09 Asahi Glass Co Ltd Method for cleaving glass plate and apparatus therefor
JPH10244387A (en) * 1997-03-04 1998-09-14 Toshiba Corp Apparatus and method for cutting multilayer insulation
DE10041519C1 (en) * 2000-08-24 2001-11-22 Schott Spezialglas Gmbh Method and device for cutting a flat glass plate into several rectangular plates
KR20070106714A (en) * 2005-02-23 2007-11-05 도레이 엔지니어링 가부시키가이샤 Brittle material plate cutting method and apparatus

Also Published As

Publication number Publication date
WO2006090632A1 (en) 2006-08-31
JP4884370B2 (en) 2012-02-29
KR20070106714A (en) 2007-11-05
JPWO2006090632A1 (en) 2008-07-24
CN101128294A (en) 2008-02-20
CN101128294B (en) 2011-12-07

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