TW200637448A - Method for fabricating conducting bump structures of circuit board - Google Patents

Method for fabricating conducting bump structures of circuit board

Info

Publication number
TW200637448A
TW200637448A TW094110691A TW94110691A TW200637448A TW 200637448 A TW200637448 A TW 200637448A TW 094110691 A TW094110691 A TW 094110691A TW 94110691 A TW94110691 A TW 94110691A TW 200637448 A TW200637448 A TW 200637448A
Authority
TW
Taiwan
Prior art keywords
layer
circuit board
bump structures
conducting
openings
Prior art date
Application number
TW094110691A
Other languages
Chinese (zh)
Other versions
TWI270329B (en
Inventor
Wen-Hung Hu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW094110691A priority Critical patent/TWI270329B/en
Priority to US11/397,417 priority patent/US20060219567A1/en
Publication of TW200637448A publication Critical patent/TW200637448A/en
Application granted granted Critical
Publication of TWI270329B publication Critical patent/TWI270329B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

A method for fabricating conducting bump structures of a circuit board is proposed. A circuit board has a plurality of electrical connecting pads thereon, and an insulating protection layer with openings for exposing the electrical connecting pads covers the circuit board. A conducting layer is formed on the insulating protection layer and surface of openings. A metal layer is formed on the conducting layer by electroplating. A resist layer is formed on the metal layer, a plurality of openings corresponding to the electrical connection pads are formed in the resist layer, and an adhesive layer is formed on the resist layer and surface of openings. After removing the resist layer, and the conducting layer and the metal layer that are covered by the resist layer, the conducting bump structures for electrically connecting the circuit board to other means are formed on the electrical connecting pads.
TW094110691A 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board TWI270329B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094110691A TWI270329B (en) 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board
US11/397,417 US20060219567A1 (en) 2005-04-04 2006-04-03 Fabrication method of conductive bump structures of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094110691A TWI270329B (en) 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board

Publications (2)

Publication Number Publication Date
TW200637448A true TW200637448A (en) 2006-10-16
TWI270329B TWI270329B (en) 2007-01-01

Family

ID=37069006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110691A TWI270329B (en) 2005-04-04 2005-04-04 Method for fabricating conducting bump structures of circuit board

Country Status (2)

Country Link
US (1) US20060219567A1 (en)
TW (1) TWI270329B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI261329B (en) * 2005-03-09 2006-09-01 Phoenix Prec Technology Corp Conductive bump structure of circuit board and method for fabricating the same
TWI327876B (en) * 2007-08-23 2010-07-21 Unimicron Technology Corp Circuit board having electrical connecting structure and fabrication method thereof
EP2180770A1 (en) * 2008-10-21 2010-04-28 Atotech Deutschland Gmbh Method to form solder deposits on substrates
MY158939A (en) * 2008-10-21 2016-11-30 Atotech Deutschland Gmbh Method to form solder deposits on substrates
EP2244285A1 (en) 2009-04-24 2010-10-27 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
TWI419284B (en) * 2010-05-26 2013-12-11 南茂科技股份有限公司 Bulk structure of wafer and manufacturing method of bump structure
EP2405469B1 (en) 2010-07-05 2016-09-21 ATOTECH Deutschland GmbH Method to form solder alloy deposits on substrates
EP2405468A1 (en) * 2010-07-05 2012-01-11 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
EP2416634A1 (en) 2010-08-02 2012-02-08 ATOTECH Deutschland GmbH Method to form solder deposits on substrates
EP2506690A1 (en) 2011-03-28 2012-10-03 Atotech Deutschland GmbH Method to form solder deposits and non-melting bump structures on substrates
JP2013534367A (en) 2010-08-02 2013-09-02 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング Method for forming solder deposits and non-molten bumps on a substrate
EP2453471A3 (en) * 2010-11-15 2013-05-15 Dyconex AG Method for electrodeposition of an elctrode on a dielectric substrate
EP2503029B1 (en) 2011-03-22 2013-03-20 Atotech Deutschland GmbH Process for etching a recessed structure filled with tin or a tin alloy
CN103635017B (en) * 2012-08-24 2016-12-28 碁鼎科技秦皇岛有限公司 Circuit board and preparation method thereof
EP2709160B1 (en) * 2012-09-14 2016-03-30 ATOTECH Deutschland GmbH Method for metallization of solar cell substrates
US10115690B2 (en) * 2015-02-26 2018-10-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing micro pins and isolated conductive micro pin
EP3560304B1 (en) 2016-12-23 2021-02-03 ATOTECH Deutschland GmbH Method of forming a solderable solder deposit on a contact pad
CN114900955A (en) * 2022-05-07 2022-08-12 微智医疗器械有限公司 Connection method of electronic element and circuit board, circuit board assembly and electronic equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2728693A (en) * 1953-08-24 1955-12-27 Motorola Inc Method of forming electrical conductor upon an insulating base
US5545308A (en) * 1995-06-19 1996-08-13 Lynntech, Inc. Method of using conductive polymers to manufacture printed circuit boards
TWI255158B (en) * 2004-09-01 2006-05-11 Phoenix Prec Technology Corp Method for fabricating electrical connecting member of circuit board
TWI261329B (en) * 2005-03-09 2006-09-01 Phoenix Prec Technology Corp Conductive bump structure of circuit board and method for fabricating the same

Also Published As

Publication number Publication date
US20060219567A1 (en) 2006-10-05
TWI270329B (en) 2007-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees