TW200639005A - Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount - Google Patents

Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Info

Publication number
TW200639005A
TW200639005A TW094115045A TW94115045A TW200639005A TW 200639005 A TW200639005 A TW 200639005A TW 094115045 A TW094115045 A TW 094115045A TW 94115045 A TW94115045 A TW 94115045A TW 200639005 A TW200639005 A TW 200639005A
Authority
TW
Taiwan
Prior art keywords
diamond
conditioning device
exposure amount
pad conditioning
polish pad
Prior art date
Application number
TW094115045A
Other languages
English (en)
Other versions
TWI283614B (en
Inventor
Wen-Hua Lee
Jui-Lin Chou
Min-Hong Gao
Wen-Ting Ye
Original Assignee
Opetech Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opetech Materials Co Ltd filed Critical Opetech Materials Co Ltd
Priority to TW94115045A priority Critical patent/TWI283614B/zh
Publication of TW200639005A publication Critical patent/TW200639005A/zh
Application granted granted Critical
Publication of TWI283614B publication Critical patent/TWI283614B/zh

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW94115045A 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount TWI283614B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94115045A TWI283614B (en) 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94115045A TWI283614B (en) 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Publications (2)

Publication Number Publication Date
TW200639005A true TW200639005A (en) 2006-11-16
TWI283614B TWI283614B (en) 2007-07-11

Family

ID=39430813

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94115045A TWI283614B (en) 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Country Status (1)

Country Link
TW (1) TWI283614B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580523B (zh) * 2014-01-21 2017-05-01 中國砂輪企業股份有限公司 具有最佳磨料露出率之化學機械研磨修整器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799769B (zh) * 2020-12-18 2023-04-21 遠東科技大學 一種均質的金屬玻璃基鑽石工具之製作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580523B (zh) * 2014-01-21 2017-05-01 中國砂輪企業股份有限公司 具有最佳磨料露出率之化學機械研磨修整器

Also Published As

Publication number Publication date
TWI283614B (en) 2007-07-11

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Legal Events

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MK4A Expiration of patent term of an invention patent