TW200639005A - Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount - Google Patents

Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Info

Publication number
TW200639005A
TW200639005A TW094115045A TW94115045A TW200639005A TW 200639005 A TW200639005 A TW 200639005A TW 094115045 A TW094115045 A TW 094115045A TW 94115045 A TW94115045 A TW 94115045A TW 200639005 A TW200639005 A TW 200639005A
Authority
TW
Taiwan
Prior art keywords
diamond
conditioning device
exposure amount
pad conditioning
polish pad
Prior art date
Application number
TW094115045A
Other languages
Chinese (zh)
Other versions
TWI283614B (en
Inventor
Wen-Hua Lee
Jui-Lin Chou
Min-Hong Gao
Wen-Ting Ye
Original Assignee
Opetech Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opetech Materials Co Ltd filed Critical Opetech Materials Co Ltd
Priority to TW94115045A priority Critical patent/TWI283614B/en
Publication of TW200639005A publication Critical patent/TW200639005A/en
Application granted granted Critical
Publication of TWI283614B publication Critical patent/TWI283614B/en

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

This invention is to provide a manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount, utilizing a slot provided on a mold to determine the diamond exposure amount of the diamond polish pad conditioning device which the diamond can be secured firmly, so as to enhance the lifetime of the diamond polish pad conditioning device and reduce the cost.
TW94115045A 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount TWI283614B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94115045A TWI283614B (en) 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94115045A TWI283614B (en) 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Publications (2)

Publication Number Publication Date
TW200639005A true TW200639005A (en) 2006-11-16
TWI283614B TWI283614B (en) 2007-07-11

Family

ID=39430813

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94115045A TWI283614B (en) 2005-05-10 2005-05-10 Manufacturing method for diamond polish pad conditioning device capable of controlling diamond exposure amount

Country Status (1)

Country Link
TW (1) TWI283614B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580523B (en) * 2014-01-21 2017-05-01 中國砂輪企業股份有限公司 Chemical mechanical polishing conditioner with optimal abrasive exposing rate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI799769B (en) * 2020-12-18 2023-04-21 遠東科技大學 Method for producing homogeneous metal-glass base diamond tool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI580523B (en) * 2014-01-21 2017-05-01 中國砂輪企業股份有限公司 Chemical mechanical polishing conditioner with optimal abrasive exposing rate

Also Published As

Publication number Publication date
TWI283614B (en) 2007-07-11

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Legal Events

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