TW200701355A - Wafer cutting method and wafer cutting apparatus - Google Patents

Wafer cutting method and wafer cutting apparatus

Info

Publication number
TW200701355A
TW200701355A TW095114859A TW95114859A TW200701355A TW 200701355 A TW200701355 A TW 200701355A TW 095114859 A TW095114859 A TW 095114859A TW 95114859 A TW95114859 A TW 95114859A TW 200701355 A TW200701355 A TW 200701355A
Authority
TW
Taiwan
Prior art keywords
cutting
wafer
wafer cutting
sheet
cutting apparatus
Prior art date
Application number
TW095114859A
Other languages
Chinese (zh)
Other versions
TWI393180B (en
Inventor
Akira Nakatsu
Original Assignee
Canon Machinery Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Machinery Inc filed Critical Canon Machinery Inc
Publication of TW200701355A publication Critical patent/TW200701355A/en
Application granted granted Critical
Publication of TWI393180B publication Critical patent/TWI393180B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is a method for cutting a wafer into small chips with high security and a cutting apparatus suitable to this cutting method. According to the wafer cutting method and cutting apparatus for cutting the wafer 1 pasted on the sheet 3 along the planned cutting lines 2 in the lattice pattern, the top surface of the cutting apparatus 10 is slid under the bottom surface of the sheet 3, and the sheet 3 is locally vacuum suctioned through the vacuum suction inlets 13 aligned on the top surface. The vacuum suction allows bending stress to be intensively applied on one of the planned cutting lines 2 of the wafer 1 so as to cut the wafer 1 along the planned cutting line 2.
TW095114859A 2005-06-10 2006-04-26 Wafer cutting method and wafer cutting device TWI393180B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005171440A JP4361516B2 (en) 2005-06-10 2005-06-10 Wafer dividing method

Publications (2)

Publication Number Publication Date
TW200701355A true TW200701355A (en) 2007-01-01
TWI393180B TWI393180B (en) 2013-04-11

Family

ID=37440160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114859A TWI393180B (en) 2005-06-10 2006-04-26 Wafer cutting method and wafer cutting device

Country Status (5)

Country Link
JP (1) JP4361516B2 (en)
KR (1) KR101226578B1 (en)
DE (1) DE102006019709A1 (en)
MY (1) MY147978A (en)
TW (1) TWI393180B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109545863A (en) * 2014-05-27 2019-03-29 太阳能公司 Stacking formula solar cell module
CN109768095A (en) * 2014-05-27 2019-05-17 太阳能公司 Stacking formula solar cell module
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
US11942561B2 (en) 2014-05-27 2024-03-26 Maxeon Solar Pte. Ltd. Shingled solar cell module

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KR101335051B1 (en) * 2009-11-20 2013-11-29 도꾸리쯔교세이호진상교기쥬쯔소고겡뀨죠 Method of examining defects, wafer subjected to defect examination or semiconductor element manufactured using the wafer, quality control method for wafer or semiconductor element, and defect examining device
JP5414486B2 (en) * 2009-12-01 2014-02-12 シチズン電子株式会社 Semiconductor manufacturing equipment
JP5546873B2 (en) * 2010-01-12 2014-07-09 キヤノンマシナリー株式会社 Semiconductor wafer dividing method and apparatus
CN102194652B (en) * 2010-03-11 2013-04-10 中芯国际集成电路制造(上海)有限公司 Method for preventing warping of wafers and wafers therefrom
JP5960389B2 (en) * 2010-04-19 2016-08-02 東京エレクトロン株式会社 Method for separating and transporting a semiconductor integrated circuit chip
JP6029334B2 (en) * 2012-06-07 2016-11-24 株式会社ディスコ Splitting device
US10090430B2 (en) 2014-05-27 2018-10-02 Sunpower Corporation System for manufacturing a shingled solar cell module
WO2014098771A1 (en) * 2012-12-17 2014-06-26 Agency For Science, Technology And Research Wafer dicing apparatus and wafer dicing method
JP6091335B2 (en) * 2013-05-28 2017-03-08 株式会社ディスコ Dividing method and dividing apparatus
JP6301658B2 (en) * 2014-01-15 2018-03-28 株式会社ディスコ Wafer processing method
CL2016003045A1 (en) * 2014-05-27 2017-06-09 Sunpower Corp Stepped solar cell module
CN104409386B (en) * 2014-10-20 2018-05-15 上海技美电子科技有限公司 Wafer sliver apparatus
US10084104B2 (en) 2015-08-18 2018-09-25 Sunpower Corporation Solar panel
JP6576735B2 (en) * 2015-08-19 2019-09-18 株式会社ディスコ Wafer division method
JP7125650B2 (en) * 2018-03-27 2022-08-25 株式会社東京精密 Wafer dividing apparatus and method
CN112701066B (en) * 2021-01-07 2021-07-20 深圳市粤海翔精密科技有限公司 A kind of cleaving knife equipment for wafer splitting and using method thereof
CN112847853B (en) * 2021-01-20 2022-12-27 中国科学院微电子研究所 Lobe of a leaf device
CN113524463B (en) * 2021-07-28 2025-07-25 广东省先进陶瓷材料科技有限公司 Stamping die and workpiece stamping method

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BE759715A (en) * 1969-12-12 1971-06-02 Shell Int Research BLOCK COPOLYMERS AS VISCOSITY INDEX IMPROVING AGENTS
JPH0574933A (en) * 1991-09-17 1993-03-26 Seiko Epson Corp Dicing machine
JP3276506B2 (en) * 1994-03-16 2002-04-22 株式会社日立製作所 Method for manufacturing semiconductor device
JPH0817767A (en) * 1994-06-29 1996-01-19 Hitachi Ltd Method and apparatus for breaking semiconductor wafer
JP3408805B2 (en) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 Cutting origin region forming method and workpiece cutting method
KR20040009802A (en) * 2002-07-25 2004-01-31 삼성전자주식회사 A package sawing apparatus having rubber plate for fixing frame that having bended type mount surface
TWI274406B (en) * 2003-07-16 2007-02-21 Freescale Semiconductor Inc Dual gauge leadframe
JP7254577B2 (en) * 2019-03-27 2023-04-10 積水化学工業株式会社 Piping material

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109545863A (en) * 2014-05-27 2019-03-29 太阳能公司 Stacking formula solar cell module
CN109768095A (en) * 2014-05-27 2019-05-17 太阳能公司 Stacking formula solar cell module
CN109545863B (en) * 2014-05-27 2021-09-14 迈可晟太阳能有限公司 Overlapping type solar cell module
CN114582986A (en) * 2014-05-27 2022-06-03 迈可晟太阳能有限公司 Overlapping type solar cell module
US11482639B2 (en) 2014-05-27 2022-10-25 Sunpower Corporation Shingled solar cell module
CN109768095B (en) * 2014-05-27 2023-04-04 迈可晟太阳能有限公司 Overlapping type solar cell module
US11942561B2 (en) 2014-05-27 2024-03-26 Maxeon Solar Pte. Ltd. Shingled solar cell module
US11949026B2 (en) 2014-05-27 2024-04-02 Maxeon Solar Pte. Ltd. Shingled solar cell module
US10861999B2 (en) 2015-04-21 2020-12-08 Sunpower Corporation Shingled solar cell module comprising hidden tap interconnects

Also Published As

Publication number Publication date
JP2006344910A (en) 2006-12-21
DE102006019709A1 (en) 2006-12-14
MY147978A (en) 2013-02-28
KR101226578B1 (en) 2013-01-28
KR20060128641A (en) 2006-12-14
TWI393180B (en) 2013-04-11
JP4361516B2 (en) 2009-11-11

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