TW200701865A - Shielding case and the manufacturing method thereof - Google Patents

Shielding case and the manufacturing method thereof

Info

Publication number
TW200701865A
TW200701865A TW094120542A TW94120542A TW200701865A TW 200701865 A TW200701865 A TW 200701865A TW 094120542 A TW094120542 A TW 094120542A TW 94120542 A TW94120542 A TW 94120542A TW 200701865 A TW200701865 A TW 200701865A
Authority
TW
Taiwan
Prior art keywords
shielding
shielding case
manufacturing
maintenance
cover plate
Prior art date
Application number
TW094120542A
Other languages
English (en)
Other versions
TWI281845B (en
Inventor
jin-xing Hong
Original Assignee
Yuan Deng Metals Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuan Deng Metals Ind Co Ltd filed Critical Yuan Deng Metals Ind Co Ltd
Priority to TW094120542A priority Critical patent/TWI281845B/zh
Priority to US11/395,892 priority patent/US7544885B2/en
Publication of TW200701865A publication Critical patent/TW200701865A/zh
Application granted granted Critical
Publication of TWI281845B publication Critical patent/TWI281845B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)
TW094120542A 2005-06-21 2005-06-21 Shielding case and the manufacturing method thereof TWI281845B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094120542A TWI281845B (en) 2005-06-21 2005-06-21 Shielding case and the manufacturing method thereof
US11/395,892 US7544885B2 (en) 2005-06-21 2006-04-03 Isolating cover

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094120542A TWI281845B (en) 2005-06-21 2005-06-21 Shielding case and the manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200701865A true TW200701865A (en) 2007-01-01
TWI281845B TWI281845B (en) 2007-05-21

Family

ID=37572800

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120542A TWI281845B (en) 2005-06-21 2005-06-21 Shielding case and the manufacturing method thereof

Country Status (2)

Country Link
US (1) US7544885B2 (zh)
TW (1) TWI281845B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200847199A (en) * 2007-05-29 2008-12-01 Delta Electronics Inc Package structure for an inductance element
CN101730459B (zh) * 2008-10-17 2013-02-20 深圳富泰宏精密工业有限公司 屏蔽罩及其制作方法
KR20130023203A (ko) * 2010-02-12 2013-03-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 구동 방법
US8383960B2 (en) 2010-07-14 2013-02-26 A.K. Stamping Company, Inc. One-piece board level shielding with peel-away feature
US9538693B2 (en) 2013-03-15 2017-01-03 A.K. Stamping Company, Inc. Aluminum EMI / RF shield
TWM537383U (zh) * 2016-10-26 2017-02-21 啓碁科技股份有限公司 屏蔽罩
US10542644B2 (en) 2016-12-14 2020-01-21 A.K. Stamping Company, Inc. Two-piece solderable shield

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900006122Y1 (ko) * 1986-02-12 1990-07-06 알프스 덴기 가부시기가이샤 다련 슬라이드형 전기부품
JPH01241138A (ja) * 1988-03-23 1989-09-26 Toshiba Corp 半導体装置のワイヤボンディング方法
US6178097B1 (en) * 1999-01-22 2001-01-23 Dial Tool Industries, Inc. RF shield having removable cover
US6949706B2 (en) * 2001-09-28 2005-09-27 Siemens Information And Communication Mobile, Llc Radio frequency shield for electronic equipment
US6872880B2 (en) * 2003-06-17 2005-03-29 Delphi Technologies, Inc. Two-piece solderless EMC/EMI shield
TWI351918B (en) * 2004-01-29 2011-11-01 Laird Technologies Inc Ultra-low height electromagnetic interference shie
TW200700171A (en) * 2005-06-24 2007-01-01 Yuan Deng Metals Ind Co Ltd Isolating shield

Also Published As

Publication number Publication date
US7544885B2 (en) 2009-06-09
US20060284712A1 (en) 2006-12-21
TWI281845B (en) 2007-05-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees