TW200709902A - Method of and apparatus for partly cutting laminated film - Google Patents

Method of and apparatus for partly cutting laminated film

Info

Publication number
TW200709902A
TW200709902A TW095119302A TW95119302A TW200709902A TW 200709902 A TW200709902 A TW 200709902A TW 095119302 A TW095119302 A TW 095119302A TW 95119302 A TW95119302 A TW 95119302A TW 200709902 A TW200709902 A TW 200709902A
Authority
TW
Taiwan
Prior art keywords
partly cutting
circular blade
laminated film
photosensitive web
partly
Prior art date
Application number
TW095119302A
Other languages
Chinese (zh)
Inventor
Haruhito Arimitsu
Toshiyuki Masuda
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200709902A publication Critical patent/TW200709902A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/28—Splitting layers from work; Mutually separating layers by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/02—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with longitudinal slitters or perforators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/515—Cutting handled material
    • B65H2301/5152—Cutting partially, e.g. perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/171—Physical features of handled article or web
    • B65H2701/1719—Photosensitive, e.g. exposure, photographic or phosphor

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Details Of Cutting Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Nonmetal Cutting Devices (AREA)

Abstract

A partly cutting apparatus (36) has a heating mechanism (52) for heating a partly cutting region (34) of a photosensitive web (22) to a preset temperature depending on a rotary circular blade (68) or a fixed circular blade (80), and a cutter mechanism (54) for partly cutting the photosensitive web (22) by moving the rotary circular blade (68) or the fixed circular blade (80) along the partly cutting region (34) heated to the preset temperature. The heating mechanism (52) has a sheet heater (76) disposed in a cutter bearing base (70). The cutter bearing base (70) is held in contact with the photosensitive web (22) to heat the partly cutting region (34).
TW095119302A 2005-06-01 2006-06-01 Method of and apparatus for partly cutting laminated film TW200709902A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005161800A JP2006334715A (en) 2005-06-01 2005-06-01 Method and device for half cutting laminated body film

Publications (1)

Publication Number Publication Date
TW200709902A true TW200709902A (en) 2007-03-16

Family

ID=37054636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119302A TW200709902A (en) 2005-06-01 2006-06-01 Method of and apparatus for partly cutting laminated film

Country Status (5)

Country Link
JP (1) JP2006334715A (en)
KR (1) KR20080013985A (en)
CN (1) CN101189178B (en)
TW (1) TW200709902A (en)
WO (1) WO2006129870A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411505B (en) * 2009-07-15 2013-10-11 Au Optronics Suzhou Corp Cutting tool for cutting conductive film

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* Cited by examiner, † Cited by third party
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JP2007529344A (en) * 2004-03-18 2007-10-25 ヴェーエムイー エペ ホーランド ベー．ヴェー． Cutting device
JP2007260865A (en) * 2006-03-29 2007-10-11 Fujifilm Corp Method and apparatus for half-cutting laminated film
JP5785174B2 (en) 2009-10-13 2015-09-24 スリーエム イノベイティブ プロパティズ カンパニー Corrugated nip
JP2013103322A (en) * 2011-11-16 2013-05-30 Nitto Denko Corp Continuous manufacturing system of liquid crystal display element, and continuous manufacturing method of liquid crystal display element
JP5480315B2 (en) * 2012-02-23 2014-04-23 富士フイルム株式会社 Web cutting method and web cutting device
JP5501404B2 (en) * 2012-05-18 2014-05-21 日東電工株式会社 Cut line forming apparatus and cut line forming method
CN103481323B (en) * 2012-06-08 2015-06-17 珠海格力电器股份有限公司 Film cutting mechanism
JP6008681B2 (en) * 2012-10-02 2016-10-19 株式会社島精機製作所 Cutting machine
JP6099799B1 (en) * 2016-07-26 2017-03-22 株式会社 エイブル Cutting system and cutting method
CN107696086A (en) * 2017-09-28 2018-02-16 阜宁浔朋新材料科技有限公司 A kind of reduction device of photographic film
KR102091346B1 (en) * 2019-01-04 2020-03-19 전북대학교산학협력단 Apparatus for recycling Solar panel and method thereof
CN110421618A (en) * 2019-08-01 2019-11-08 广州元装滤清器有限公司 A kind of underlying cutter of the trimming item void knife for automatic welt fitting machine
CN110549680A (en) * 2019-10-12 2019-12-10 无锡鸿昌精密机械有限公司 Circular knife slitting device for square-bottom bag
CN110980382A (en) * 2019-10-30 2020-04-10 中国石油化工股份有限公司 Slitting method of ultrathin PVA optical film
US11498324B2 (en) * 2020-02-06 2022-11-15 Fives Machining Systems, Inc. Tape lamination machine cutting assembly
CN111805594B (en) * 2020-07-28 2024-11-29 浙江鸿昌机械有限公司 Safety sampling knife
KR102594046B1 (en) * 2020-12-15 2023-10-25 주식회사 에스에프에이 Apparatus for supplying separator packing vinyl
JP7005065B1 (en) 2021-07-01 2022-01-21 株式会社浅野研究所 Resin molded sheet cutting equipment
KR102457744B1 (en) * 2022-01-05 2022-10-24 주식회사 원광에스앤티 Solar panel disassembling apparatus
CN117049226A (en) * 2023-03-23 2023-11-14 浙江珂莉科技有限公司 Intelligent cutting and winding mechanism for instant hand sanitizer
KR102682620B1 (en) * 2024-01-12 2024-07-08 주식회사 지에스아이 Apparatus for cutting a sheet
CN118323936B (en) * 2024-05-21 2025-02-25 常州豪润包装材料股份有限公司 Conveying system for aluminum-plastic packaging film and working method thereof
KR102785664B1 (en) * 2024-06-11 2025-03-26 주식회사 원광에스앤티 Waste solar panel sealant removing apparatus
KR102750952B1 (en) * 2024-09-05 2025-01-10 케이지에이 주식회사 Electrode sheet slitting device for manufacturing secondary battery electrodes

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06210595A (en) * 1993-01-13 1994-08-02 Fuji Photo Film Co Ltd Method of cutting laminated film
JP3661174B2 (en) * 1995-09-25 2005-06-15 富士写真フイルム株式会社 Film cutting method
JP4138908B2 (en) * 1997-06-20 2008-08-27 富士フイルム株式会社 Film cutting device
JPH1134281A (en) * 1997-07-14 1999-02-09 Somar Corp Film sticking method and apparatus
JP4010613B2 (en) * 1997-10-30 2007-11-21 富士フイルム株式会社 Film cutting device
JP2001337411A (en) * 2000-03-21 2001-12-07 Fuji Photo Film Co Ltd Method and device for cutting heat developable material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411505B (en) * 2009-07-15 2013-10-11 Au Optronics Suzhou Corp Cutting tool for cutting conductive film

Also Published As

Publication number Publication date
WO2006129870A2 (en) 2006-12-07
KR20080013985A (en) 2008-02-13
CN101189178B (en) 2010-12-08
CN101189178A (en) 2008-05-28
WO2006129870A3 (en) 2007-02-22
JP2006334715A (en) 2006-12-14

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