TW200710055A - An inorganic materials fabrication method - Google Patents

An inorganic materials fabrication method

Info

Publication number
TW200710055A
TW200710055A TW095118444A TW95118444A TW200710055A TW 200710055 A TW200710055 A TW 200710055A TW 095118444 A TW095118444 A TW 095118444A TW 95118444 A TW95118444 A TW 95118444A TW 200710055 A TW200710055 A TW 200710055A
Authority
TW
Taiwan
Prior art keywords
fabrication method
inorganic materials
deteriorated
materials fabrication
irradiated
Prior art date
Application number
TW095118444A
Other languages
Chinese (zh)
Inventor
Satoshi Jibiki
Takao Miwa
Hirotaka Koyo
Original Assignee
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd filed Critical Nippon Sheet Glass Co Ltd
Publication of TW200710055A publication Critical patent/TW200710055A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching

Landscapes

  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The purpose of this invention is to provide a fabrication method and a device for forming deep and uniform micro slots on an inorganic materials. The fabrication method of this invention includes the following steps: (A) the step of creating continuous micro cracks and deteriorated surronding areas on the inorganic substrate by using pulsed laser irradiation in that part of each of irradiated area are over irradiated with the consecutive laser radiation.. and, (B) the step of etching the deteriorated zones.
TW095118444A 2005-09-02 2006-05-24 An inorganic materials fabrication method TW200710055A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255461A JP2007069216A (en) 2005-09-02 2005-09-02 Inorganic material working method

Publications (1)

Publication Number Publication Date
TW200710055A true TW200710055A (en) 2007-03-16

Family

ID=37931129

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118444A TW200710055A (en) 2005-09-02 2006-05-24 An inorganic materials fabrication method

Country Status (3)

Country Link
JP (1) JP2007069216A (en)
KR (1) KR20070025990A (en)
TW (1) TW200710055A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103025475A (en) * 2010-07-26 2013-04-03 浜松光子学株式会社 Laser processing method
TWI729203B (en) * 2016-09-08 2021-06-01 美商康寧公司 Articles having holes with morphology attributes and methods for fabricating the same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008069099A1 (en) * 2006-11-30 2008-06-12 Sumitomo Electric Industries, Ltd. Light condensing optical system, laser processing method and apparatus, and method of manufacturing fragile material
CN102623373B (en) 2007-05-25 2015-07-15 浜松光子学株式会社 Working method for cutting
JP5105153B2 (en) * 2007-06-27 2012-12-19 三菱マテリアル株式会社 Manufacturing method of processing tool and processing tool
JP5110085B2 (en) * 2007-08-16 2012-12-26 旭硝子株式会社 Method for removing foreign matter from glass substrate surface
JP2010153590A (en) * 2008-12-25 2010-07-08 Hamamatsu Photonics Kk Processing method for cutting
JP2013133259A (en) * 2011-12-27 2013-07-08 Fujikura Ltd Substrate having microhole and method for production thereof
JP2018509365A (en) * 2015-02-27 2018-04-05 コーニング インコーポレイテッド Method for manufacturing channels in glass articles by laser damage and etching and articles made thereby
US11072041B2 (en) 2017-03-06 2021-07-27 Lpkf Laser & Electronics Ag Method for producing a technical mask
JP7063542B2 (en) 2017-04-17 2022-05-09 浜松ホトニクス株式会社 How to cut the object to be machined
JP7063543B2 (en) 2017-04-17 2022-05-09 浜松ホトニクス株式会社 How to cut the object to be machined
CN111093885A (en) 2017-08-22 2020-05-01 钻石技术有限公司 System and method for manufacturing a predetermined structure from a diamond mass
JP7230650B2 (en) 2019-04-05 2023-03-01 Tdk株式会社 Inorganic material substrate processing method, device, and device manufacturing method
WO2020228893A1 (en) * 2019-05-13 2020-11-19 Lpkf Laser & Electronics Ag Method for producing a display having a carrier substrate, a carrier substrate produced according to said method, and a cover glass intended for a flexible display

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103025475A (en) * 2010-07-26 2013-04-03 浜松光子学株式会社 Laser processing method
TWI729203B (en) * 2016-09-08 2021-06-01 美商康寧公司 Articles having holes with morphology attributes and methods for fabricating the same

Also Published As

Publication number Publication date
JP2007069216A (en) 2007-03-22
KR20070025990A (en) 2007-03-08

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