TW200710161A - Epoxy resin composition for encapsulation and electronic part device - Google Patents

Epoxy resin composition for encapsulation and electronic part device

Info

Publication number
TW200710161A
TW200710161A TW095125966A TW95125966A TW200710161A TW 200710161 A TW200710161 A TW 200710161A TW 095125966 A TW095125966 A TW 095125966A TW 95125966 A TW95125966 A TW 95125966A TW 200710161 A TW200710161 A TW 200710161A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
encapsulation
resin composition
electronic part
magnesium hydroxide
Prior art date
Application number
TW095125966A
Other languages
English (en)
Chinese (zh)
Other versions
TWI332023B (2
Inventor
Ryoichi Ikezawa
Hidetaka Yoshizawa
Seiichi Akagi
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200710161A publication Critical patent/TW200710161A/zh
Application granted granted Critical
Publication of TWI332023B publication Critical patent/TWI332023B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
TW095125966A 2005-07-13 2006-07-13 Epoxy resin composition for encapsulation and electronic part device TW200710161A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005204290 2005-07-13

Publications (2)

Publication Number Publication Date
TW200710161A true TW200710161A (en) 2007-03-16
TWI332023B TWI332023B (2) 2010-10-21

Family

ID=37637223

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125966A TW200710161A (en) 2005-07-13 2006-07-13 Epoxy resin composition for encapsulation and electronic part device

Country Status (6)

Country Link
US (1) US20090137717A1 (2)
JP (1) JP5181219B2 (2)
KR (2) KR101413822B1 (2)
CN (1) CN101223235B (2)
TW (1) TW200710161A (2)
WO (1) WO2007007843A1 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9048187B2 (en) 2010-03-25 2015-06-02 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7846998B2 (en) * 2004-03-03 2010-12-07 Hitachi Chemical Co., Ltd. Sealant epoxy-resin molding material, and electronic component device
JP5177480B2 (ja) * 2007-06-14 2013-04-03 日本化薬株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP2010229368A (ja) * 2009-03-30 2010-10-14 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板
CN102453914A (zh) * 2010-10-22 2012-05-16 中国核动力研究设计院 用微晶石腊包裹强酸溶解金属焊接件易腐蚀部位的方法
CN109971122A (zh) * 2011-05-13 2019-07-05 日立化成株式会社 密封用环氧树脂成形材料及电子部件装置
JP5573773B2 (ja) * 2011-05-23 2014-08-20 日立化成株式会社 電子部品封止用樹脂組成物およびそれを用いた電子部品装置
JP5944714B2 (ja) * 2012-03-27 2016-07-05 タテホ化学工業株式会社 水酸化マグネシウム粒子、及びそれを含む樹脂組成物
JP6059577B2 (ja) * 2012-11-13 2017-01-11 タテホ化学工業株式会社 水酸化マグネシウム粒子、及びそれを含む樹脂組成物
KR20200109090A (ko) 2019-03-12 2020-09-22 동우 화인켐 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
KR20210078940A (ko) 2019-12-19 2021-06-29 동우 화인켐 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
EP4159810A4 (en) * 2020-06-02 2024-09-04 Sumitomo Bakelite Co., Ltd. PHENOLIC RESIN COMPOSITION FOR FRICTION MATERIAL
JP2022142564A (ja) * 2021-03-16 2022-09-30 キオクシア株式会社 半導体パッケージ及び半導体装置
CN119562989A (zh) * 2022-11-22 2025-03-04 株式会社力森诺科 成形用树脂组合物及电子零件装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56109820A (en) * 1980-02-06 1981-08-31 Shin Nippon Kagaku Kogyo Co Ltd Manufacture of magnesium hydroxide
JPH03170325A (ja) * 1989-11-27 1991-07-23 Mitsubishi Materials Corp 水酸化マグネシウムの製造方法
IL124061A (en) * 1997-04-15 2001-01-11 Taheto Chemical Ind Co Ltd Solid solutions of metal hydroxide and metal oxide and their preparation
JP2000233924A (ja) * 1998-12-14 2000-08-29 Kyowa Chem Ind Co Ltd 水酸化マグネシウム粒子およびその製造方法
CN1319860C (zh) * 1998-12-14 2007-06-06 协和化学工业株式会社 氢氧化镁粒子、阻燃性树脂组合物及成型制品
JP3836649B2 (ja) * 1999-11-22 2006-10-25 協和化学工業株式会社 半導体封止用樹脂組成物およびその成型品
WO2002024808A1 (fr) * 2000-09-25 2002-03-28 Hitachi Chemical Co., Ltd. Materiau de moulage de resine epoxy utilise a des fins d'etancheite
JP2002212392A (ja) * 2000-11-20 2002-07-31 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
CN100519650C (zh) * 2002-02-27 2009-07-29 日立化成工业株式会社 封装用环氧树脂组合物及使用该组合物的电子组件
JP2003327667A (ja) * 2002-03-07 2003-11-19 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び半導体装置
WO2003072628A1 (en) * 2002-02-27 2003-09-04 Hitachi Chemical Co., Ltd. Encapsulating epoxy resin composition, and electronic parts device using the same
TW200726784A (en) * 2003-04-07 2007-07-16 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
JP2004307646A (ja) * 2003-04-07 2004-11-04 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び半導体装置
WO2006006593A1 (ja) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置
KR100846547B1 (ko) * 2004-07-13 2008-07-15 히다치 가세고교 가부시끼가이샤 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치
JP4774236B2 (ja) * 2005-04-28 2011-09-14 タテホ化学工業株式会社 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物
JP4745713B2 (ja) * 2005-04-28 2011-08-10 タテホ化学工業株式会社 水酸化マグネシウム粒子及びその製造方法及びそれを含む樹脂組成物
JP5400267B2 (ja) * 2005-12-13 2014-01-29 日立化成株式会社 封止用エポキシ樹脂組成物及び電子部品装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9048187B2 (en) 2010-03-25 2015-06-02 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
TWI488912B (zh) * 2010-03-25 2015-06-21 住友電木股份有限公司 半導體密封用環氧樹脂組成物及使用其之半導體裝置

Also Published As

Publication number Publication date
TWI332023B (2) 2010-10-21
JP5181219B2 (ja) 2013-04-10
KR101413822B1 (ko) 2014-07-01
JPWO2007007843A1 (ja) 2009-01-29
KR20130105767A (ko) 2013-09-25
WO2007007843A1 (ja) 2007-01-18
CN101223235B (zh) 2011-07-27
US20090137717A1 (en) 2009-05-28
KR20080035624A (ko) 2008-04-23
KR101342206B1 (ko) 2013-12-16
CN101223235A (zh) 2008-07-16

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