TW200712190A - Thermal conductive adhesive and elastics composition and a cooling device - Google Patents

Thermal conductive adhesive and elastics composition and a cooling device

Info

Publication number
TW200712190A
TW200712190A TW095120258A TW95120258A TW200712190A TW 200712190 A TW200712190 A TW 200712190A TW 095120258 A TW095120258 A TW 095120258A TW 95120258 A TW95120258 A TW 95120258A TW 200712190 A TW200712190 A TW 200712190A
Authority
TW
Taiwan
Prior art keywords
thermal conductive
elastics
composition
cooling device
conductive adhesive
Prior art date
Application number
TW095120258A
Other languages
Chinese (zh)
Other versions
TWI332964B (en
Inventor
Akihiro Yasuda
Akio Idei
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200712190A publication Critical patent/TW200712190A/en
Application granted granted Critical
Publication of TWI332964B publication Critical patent/TWI332964B/zh

Links

Landscapes

  • Lubricants (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

This invention provides a thermal conductive resin that contains polyhydron inorganic particles as filler. A 40﹪~ 90﹪are corresponding to the coarse grains of average diameter 5 ~17 μm and 10 ~ 60 ﹪at 40~90% of the 1/3 ~ 1/40 average particles diameter owns 40 ~ 90% volume size of the mixed particles. It is then mix with 0.2 ~ 20 wt ﹪non-ironic surfactant and 10 ~ 60 volume% base oil (resin).
TW095120258A 2005-09-07 2006-06-07 Thermal conductive adhesive and elastics composition and a cooling device TW200712190A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005259851A JP2007070492A (en) 2005-09-07 2005-09-07 Thermally conductive grease, adhesive, and elastomer composition, and cooling device

Publications (2)

Publication Number Publication Date
TW200712190A true TW200712190A (en) 2007-04-01
TWI332964B TWI332964B (en) 2010-11-11

Family

ID=37858173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120258A TW200712190A (en) 2005-09-07 2006-06-07 Thermal conductive adhesive and elastics composition and a cooling device

Country Status (3)

Country Link
JP (1) JP2007070492A (en)
CN (1) CN1928039B (en)
TW (1) TW200712190A (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5269366B2 (en) * 2007-08-22 2013-08-21 コスモ石油ルブリカンツ株式会社 Heat-resistant thermal grease
US8435485B2 (en) 2008-10-28 2013-05-07 Sakai Chemical Industry Co., Ltd. Method for producing zinc oxide using ammonium bromide, exoergic filler, resin composition, exoergic grease and exoergic coating composition comprising the zinc oxide
JP2011021069A (en) 2009-07-14 2011-02-03 Sakai Chem Ind Co Ltd Heat-radiating filler composition, resin composition, heat-radiating grease and heat-radiating coating composition
US8546476B2 (en) 2009-07-14 2013-10-01 Sakai Chemical Industry Co., Ltd. Exoergic filler composition, resin composition, exoergic grease and exoergic coating composition
US8399092B2 (en) 2009-10-07 2013-03-19 Sakai Chemical Industry Co., Ltd. Zinc oxide particle having high bulk density, method for producing it, exoergic filler, exoergic resin composition, exoergic grease and exoergic coating composition
EP2409952B1 (en) 2009-10-07 2016-11-23 Sakai Chemical Industry Co., Ltd. Zinc oxide particle, heat conductive filler, heat conductive resin composition, heat conductive grease and heat conductive coating composition
JP2011179468A (en) * 2010-03-03 2011-09-15 Dow Corning Toray Co Ltd Dispenser for high viscosity fluid
JP2012102301A (en) * 2010-11-13 2012-05-31 Nitto Denko Corp Bubble-containing thermally conductive resin composition layer, method for manufacturing the same, and pressure-sensitive adhesive tape or sheet using the same
JP5781407B2 (en) * 2011-09-05 2015-09-24 コスモ石油ルブリカンツ株式会社 Thermally conductive compound
JP2015216216A (en) * 2014-05-09 2015-12-03 凸版印刷株式会社 Sealant for solar batteries, and solar battery module
US9777205B2 (en) 2014-09-22 2017-10-03 Dow Global Technologies Llc Thermal grease based on hyperbranched olefinic fluid
JP6580949B2 (en) * 2015-11-06 2019-09-25 株式会社トクヤマ Composite filler and resin composition containing the same
CN107454893B (en) * 2015-12-14 2021-08-06 傲而特股份有限公司 Stabilized hexagonal boron nitride nanoparticles
JP6923885B2 (en) * 2016-12-13 2021-08-25 トヨタ自動車株式会社 Thermal characterization and measurement device and thermal characterization and measurement method using it
JP6811670B2 (en) * 2017-03-31 2021-01-13 太平洋セメント株式会社 Magnesium oxide powder and composites
CN107760428A (en) * 2017-11-20 2018-03-06 合肥鑫伟电力设备有限公司 A kind of Heat sink grease of transformation cabinet
CN109913297A (en) * 2019-03-06 2019-06-21 江苏龙蟠科技股份有限公司 A kind of heat transfer lubricating grease and preparation method thereof
JP7256534B2 (en) * 2019-06-28 2023-04-12 北川工業株式会社 THERMAL CONDUCTIVE ELASTOMER COMPOSITION AND THERMALLY CONDUCTIVE MOLDED PRODUCT
JP2023166735A (en) * 2022-05-10 2023-11-22 住友金属鉱山株式会社 Heat-conductive grease, and production method of heat-conductive grease
WO2023238797A1 (en) * 2022-06-08 2023-12-14 Ａｇｃ株式会社 Composition
JP7762175B2 (en) * 2023-03-31 2025-10-29 ノリタケ株式会社 thermal grease
CN116500849A (en) * 2023-04-26 2023-07-28 高创(苏州)电子有限公司 Closed projection device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252572A (en) * 1993-02-23 1994-09-09 Toshiba Corp Radiator
JP3572692B2 (en) * 1994-12-20 2004-10-06 住友化学工業株式会社 α-Alumina powder-containing resin composition and rubber composition
JP2938428B1 (en) * 1998-02-27 1999-08-23 信越化学工業株式会社 Thermal conductive grease composition
JP3474839B2 (en) * 1999-09-01 2003-12-08 北川工業株式会社 Thermal conductive sheet and manufacturing method thereof
JP2002080726A (en) * 2000-09-07 2002-03-19 Aisin Seiki Co Ltd Resin composition for sealing
JP3911554B2 (en) * 2000-12-13 2007-05-09 独立行政法人産業技術総合研究所 Spherical aluminum nitride filler and method for producing the same
JP4603700B2 (en) * 2001-01-04 2010-12-22 株式会社日立製作所 High thermal conductive grease composition and cooling device using the same
JP4796704B2 (en) * 2001-03-30 2011-10-19 株式会社タイカ Manufacturing method of containers filled and sealed with extrudable grease-like heat dissipation material

Also Published As

Publication number Publication date
JP2007070492A (en) 2007-03-22
CN1928039A (en) 2007-03-14
CN1928039B (en) 2010-09-08
TWI332964B (en) 2010-11-11

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MM4A Annulment or lapse of patent due to non-payment of fees