TW200712257A - Aqeous anti-oxidation agent for tin and tin alloy - Google Patents

Aqeous anti-oxidation agent for tin and tin alloy

Info

Publication number
TW200712257A
TW200712257A TW095132844A TW95132844A TW200712257A TW 200712257 A TW200712257 A TW 200712257A TW 095132844 A TW095132844 A TW 095132844A TW 95132844 A TW95132844 A TW 95132844A TW 200712257 A TW200712257 A TW 200712257A
Authority
TW
Taiwan
Prior art keywords
tin
oxidation agent
aqeous
tin alloy
molecule
Prior art date
Application number
TW095132844A
Other languages
Chinese (zh)
Other versions
TWI327605B (en
Inventor
Takashi Ouchi
Katsuyuki Tsuchida
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of TW200712257A publication Critical patent/TW200712257A/en
Application granted granted Critical
Publication of TWI327605B publication Critical patent/TWI327605B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
    • C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
    • C23G1/066—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors phosphorus-containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M137/00—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing phosphorus
    • C10M137/12—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing phosphorus having a phosphorus-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/167—Phosphorus-containing compounds
    • C23F11/1673—Esters of phosphoric or thiophosphoric acids
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/167—Phosphorus-containing compounds
    • C23F11/1676—Phosphonic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2223/00—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions
    • C10M2223/06—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions having phosphorus-to-carbon bonds
    • C10M2223/061—Metal salts
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2223/00—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions
    • C10M2223/06—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions having phosphorus-to-carbon bonds
    • C10M2223/063—Ammonium or amine salts
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/02—Groups 1 or 11
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/08—Groups 4 or 14
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/10—Inhibition of oxidation, e.g. anti-oxidants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

This invention provides an anti-oxidation agent which exhibits an excellent oxidation preventing property when used in heating or wetting process, and a good soldering wettability when used in treating tin or tin alloy. The aqueous anti-oxidation agent for tin or tin alloy according to the invention, comprises a compound having 2 or more phosphono in one molecule and no ester bond in a molecule, and/or salt thereof, and a phosphate having an alkyl with carbon number 6 to 10. The anti-oxidation agent has a pH below 5 and preferably further comprises 0.01 to 10g/L of surfactant.
TW095132844A 2005-09-07 2006-09-06 Aqeous anti－oxidation agent for tin and tin alloy TWI327605B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005258826 2005-09-07

Publications (2)

Publication Number Publication Date
TW200712257A true TW200712257A (en) 2007-04-01
TWI327605B TWI327605B (en) 2010-07-21

Family

ID=37835708

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132844A TWI327605B (en) 2005-09-07 2006-09-06 Aqeous anti－oxidation agent for tin and tin alloy

Country Status (5)

Country Link
JP (1) JP4601670B2 (en)
KR (1) KR100964063B1 (en)
CN (1) CN101258268B (en)
TW (1) TWI327605B (en)
WO (1) WO2007029589A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007197791A (en) * 2006-01-27 2007-08-09 Daiwa Fine Chemicals Co Ltd (Laboratory) Post-plating agent composition
US7883738B2 (en) * 2007-04-18 2011-02-08 Enthone Inc. Metallic surface enhancement
ATE509136T1 (en) * 2008-10-21 2011-05-15 Atotech Deutschland Gmbh AFTERTREATMENT COMPOSITION FOR INCREASE RUST PROTECTION OF METAL OR METAL ALLOY SURFACES
CN105945454B (en) * 2011-03-02 2018-09-25 千住金属工业株式会社 Soldering paste scaling powder
JP5928142B2 (en) * 2011-05-13 2016-06-01 上村工業株式会社 Post-treatment agent for tin or tin alloy plating film, and method for treating tin or tin alloy plating film
JP6029435B2 (en) * 2012-06-27 2016-11-24 Ｊｘ金属株式会社 METAL MATERIAL FOR ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, CONNECTOR TERMINAL USING THE SAME, CONNECTOR AND ELECTRONIC COMPONENT
JP5427945B2 (en) * 2012-06-27 2014-02-26 Ｊｘ日鉱日石金属株式会社 METAL MATERIAL FOR ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, CONNECTOR TERMINAL USING THE SAME, CONNECTOR AND ELECTRONIC COMPONENT
JP6050664B2 (en) * 2012-06-27 2016-12-21 Ｊｘ金属株式会社 METAL MATERIAL FOR ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD, CONNECTOR TERMINAL USING THE SAME, CONNECTOR AND ELECTRONIC COMPONENT
WO2014017238A1 (en) * 2012-07-25 2014-01-30 Jx日鉱日石金属株式会社 Metal material for electronic components, method for producing same, connector terminal using same, connector and electronic component
JP5667152B2 (en) * 2012-09-19 2015-02-12 Jx日鉱日石金属株式会社 Surface treatment plating material, method for producing the same, and electronic component
KR101696796B1 (en) * 2014-12-10 2017-01-16 주식회사피엔티 A method for plating copper alloy with tin
CN107326413A (en) * 2017-07-04 2017-11-07 苏州道蒙恩电子科技有限公司 A kind of electrotinning fastness inorganic agent and application method
CN107829093A (en) * 2017-09-27 2018-03-23 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt surface protectant and preparation method thereof
KR102600306B1 (en) 2017-11-24 2023-11-10 센주긴조쿠고교 가부시키가이샤 Solder materials, solder paste and solder joints
CN108315789A (en) * 2018-03-01 2018-07-24 深圳市盛元半导体有限公司 A kind of copper-based tin plating high temperature resistant protective agent
JP6573019B1 (en) * 2018-10-25 2019-09-11 千住金属工業株式会社 Flux and solder paste
WO2020241319A1 (en) 2019-05-27 2020-12-03 千住金属工業株式会社 Solder alloy, solder paste, solder ball, solder preform, and solder joint
CN111962081A (en) * 2020-08-11 2020-11-20 湖北工程学院 Organic phosphonic acid and its derivative-based copper foil antioxidant additive and preparation method thereof
CN114086169A (en) * 2021-11-09 2022-02-25 南通群安电子材料有限公司 Tin surface protective agent
CN115070259A (en) * 2022-07-15 2022-09-20 深圳市同方电子新材料有限公司 A new type of environmentally friendly lead-free solder paste with ultra-fine solder powder
CN115985550B (en) * 2022-12-05 2025-04-25 晶澜光电科技(江苏)有限公司 A copper paste with oxidation resistance and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1046385A (en) 1996-08-02 1998-02-17 Daiwa Kasei Kenkyusho:Kk Electrical and electronic circuit components
JP4215235B2 (en) * 2002-10-18 2009-01-28 日鉱金属株式会社 Surface treatment agent and surface treatment method for Sn alloy
JP4277954B2 (en) * 2004-01-21 2009-06-10 荏原ユージライト株式会社 Discoloration removal / prevention agent for tin or tin alloy plating
JP2005296860A (en) 2004-04-14 2005-10-27 Nitto Denko Corp Air filter media

Also Published As

Publication number Publication date
CN101258268B (en) 2010-11-10
JP4601670B2 (en) 2010-12-22
KR100964063B1 (en) 2010-06-16
WO2007029589A1 (en) 2007-03-15
KR20080049768A (en) 2008-06-04
JPWO2007029589A1 (en) 2009-03-19
TWI327605B (en) 2010-07-21
CN101258268A (en) 2008-09-03

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