TW200713525A - Solid image-taking element package, its production method and solid image-taking device - Google Patents
Solid image-taking element package, its production method and solid image-taking deviceInfo
- Publication number
- TW200713525A TW200713525A TW095128873A TW95128873A TW200713525A TW 200713525 A TW200713525 A TW 200713525A TW 095128873 A TW095128873 A TW 095128873A TW 95128873 A TW95128873 A TW 95128873A TW 200713525 A TW200713525 A TW 200713525A
- Authority
- TW
- Taiwan
- Prior art keywords
- solid image
- resin
- taking
- package
- taking element
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The present invention provides a solid image-taking element package, its production method and solid image-taking device containing the package. The solid image-taking element package is a hollow box made of resin, which forms into a unified piece by the bottom board made of the roughly rectangular resin and the side walls made of the roughly vertical resin installed in the circumferential edges, and is inserted by the metal-made island-shape portion installed with the metal-made lead terminal and the fixing-disposed solid image-taking element having the opening portion closed by the transparent board. The character is in that the package box is obtained by passing it through the thermoplastic resin or its composition to be injection-molded into a piece. The gate used for the injection molding is disposed on the single sidewall of the short-side direction; and the resin flow is used to control so that the protruding-formed concave is installed into the single side-wall, which is utilized to change the flow direction of the resin or its composition injecting out and flowing into the gate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005229696 | 2005-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200713525A true TW200713525A (en) | 2007-04-01 |
Family
ID=37722347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095128873A TW200713525A (en) | 2005-08-08 | 2006-08-07 | Solid image-taking element package, its production method and solid image-taking device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100550983C (en) |
| TW (1) | TW200713525A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009099173A1 (en) * | 2008-02-06 | 2009-08-13 | Murata Manufacturing Co., Ltd. | Injection molded article and magnetic sensor |
| JP5674996B2 (en) | 2012-05-10 | 2015-02-25 | 三菱電機株式会社 | Image sensor |
| WO2022004104A1 (en) * | 2020-06-29 | 2022-01-06 | 富士電機株式会社 | Semiconductor module case and method for producing semiconductor module case |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3417225B2 (en) | 1996-05-17 | 2003-06-16 | ソニー株式会社 | Solid-state imaging device and camera using it |
| JPH1065132A (en) | 1996-08-14 | 1998-03-06 | Sony Corp | Semiconductor imaging device |
-
2006
- 2006-08-07 TW TW095128873A patent/TW200713525A/en unknown
- 2006-08-07 CN CNB200610110158XA patent/CN100550983C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100550983C (en) | 2009-10-14 |
| CN1913588A (en) | 2007-02-14 |
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