TW200713541A - Bake unit, method for cooling heating plate used in the bake unit, apparatus and method for treating substrates with the bake unit - Google Patents

Bake unit, method for cooling heating plate used in the bake unit, apparatus and method for treating substrates with the bake unit

Info

Publication number
TW200713541A
TW200713541A TW094140401A TW94140401A TW200713541A TW 200713541 A TW200713541 A TW 200713541A TW 094140401 A TW094140401 A TW 094140401A TW 94140401 A TW94140401 A TW 94140401A TW 200713541 A TW200713541 A TW 200713541A
Authority
TW
Taiwan
Prior art keywords
bake unit
heating plate
plate used
cooling heating
treating substrates
Prior art date
Application number
TW094140401A
Other languages
English (en)
Other versions
TWI300977B (en
Inventor
Hee-Young Kang
Sung-Hwan Yim
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW200713541A publication Critical patent/TW200713541A/zh
Application granted granted Critical
Publication of TWI300977B publication Critical patent/TWI300977B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW094140401A 2005-09-28 2005-11-17 Bake unit, method for cooling heating plate used in the bake unit, apparatus and method for treating substrates with the bake unit TWI300977B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050090371A KR100637717B1 (ko) 2005-09-28 2005-09-28 베이크 유닛, 상기 베이크 유닛에 사용되는 가열플레이트를 냉각하는 방법, 그리고 상기 베이크 유닛을포함하는 기판 처리 장치 및 방법

Publications (2)

Publication Number Publication Date
TW200713541A true TW200713541A (en) 2007-04-01
TWI300977B TWI300977B (en) 2008-09-11

Family

ID=37621764

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140401A TWI300977B (en) 2005-09-28 2005-11-17 Bake unit, method for cooling heating plate used in the bake unit, apparatus and method for treating substrates with the bake unit

Country Status (5)

Country Link
US (1) US20070068920A1 (zh)
JP (1) JP2007096243A (zh)
KR (1) KR100637717B1 (zh)
CN (1) CN1940730A (zh)
TW (1) TWI300977B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI865989B (zh) * 2022-06-28 2024-12-11 南韓商圓益Ｉｐｓ股份有限公司 基板處理裝置及具有該基板處理裝置的基板處理系統

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
KR100897850B1 (ko) * 2007-06-18 2009-05-15 세메스 주식회사 기판 처리 장치
KR100904392B1 (ko) 2007-06-18 2009-06-26 세메스 주식회사 기판 처리 장치
KR100905258B1 (ko) 2007-07-11 2009-06-29 세메스 주식회사 플레이트, 온도 조절 장치 및 이를 갖는 기판 처리 장치
KR101361815B1 (ko) 2007-08-24 2014-02-11 세메스 주식회사 기판 가열 장치
KR100933036B1 (ko) * 2007-12-27 2009-12-21 세메스 주식회사 베이크 장치
JP2010045190A (ja) * 2008-08-12 2010-02-25 Tokyo Electron Ltd 加熱システム、塗布、現像装置及び塗布、現像方法並びに記憶媒体
JP5611152B2 (ja) 2011-08-29 2014-10-22 東京エレクトロン株式会社 基板熱処理装置
KR102289486B1 (ko) 2014-08-04 2021-08-17 세메스 주식회사 기판 처리 장치 및 방법
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
KR102099103B1 (ko) * 2018-10-15 2020-04-09 세메스 주식회사 가열 플레이트 냉각 방법 및 기판 처리 장치
KR102262113B1 (ko) 2018-12-18 2021-06-11 세메스 주식회사 기판 처리 장치 및 방법
KR20210106610A (ko) 2020-02-20 2021-08-31 대진대학교 산학협력단 고속 가열냉각 플레이트
KR20240042855A (ko) 2022-09-26 2024-04-02 세메스 주식회사 기판처리장치
KR102779317B1 (ko) 2022-09-27 2025-03-07 세메스 주식회사 베이크 유닛, 베이크 유닛의 동작 방법, 및 포토 스피너 설비

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5191738A (en) * 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
JP2704309B2 (ja) 1990-06-12 1998-01-26 大日本スクリーン製造株式会社 基板処理装置及び基板の熱処理方法
EP0634699A1 (en) * 1993-07-16 1995-01-18 Semiconductor Systems, Inc. Clustered photolithography system
DE634783T1 (de) 1993-07-16 1996-02-15 Semiconductor Systems Inc Thermische Behandlungsmodul für Beschichtungs/Entwicklungseinrichtung für Substrat.
JPH11297735A (ja) * 1998-04-10 1999-10-29 Fujitsu Ltd バンプの製造方法及び半導体装置
US6517908B1 (en) * 2000-01-10 2003-02-11 Nec Electronics, Inc. Method for making a test wafer from a substrate
JP2002203770A (ja) 2000-12-28 2002-07-19 Canon Inc レジストの加熱・冷却方法
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
JP4115873B2 (ja) 2003-04-14 2008-07-09 大日本スクリーン製造株式会社 熱処理装置および基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI865989B (zh) * 2022-06-28 2024-12-11 南韓商圓益Ｉｐｓ股份有限公司 基板處理裝置及具有該基板處理裝置的基板處理系統

Also Published As

Publication number Publication date
CN1940730A (zh) 2007-04-04
TWI300977B (en) 2008-09-11
JP2007096243A (ja) 2007-04-12
US20070068920A1 (en) 2007-03-29
KR100637717B1 (ko) 2006-10-25

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