TW200714149A - Electric inspection apparatus and method for printed board - Google Patents

Electric inspection apparatus and method for printed board

Info

Publication number
TW200714149A
TW200714149A TW095118425A TW95118425A TW200714149A TW 200714149 A TW200714149 A TW 200714149A TW 095118425 A TW095118425 A TW 095118425A TW 95118425 A TW95118425 A TW 95118425A TW 200714149 A TW200714149 A TW 200714149A
Authority
TW
Taiwan
Prior art keywords
printed board
inspection probes
depression force
contact
inspection
Prior art date
Application number
TW095118425A
Other languages
Chinese (zh)
Other versions
TWI305708B (en
Inventor
Kengo Tsuchida
Keiichiro Sasamine
Yugo Endoh
Original Assignee
Yamaha Fine Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Fine Tech Co Ltd filed Critical Yamaha Fine Tech Co Ltd
Publication of TW200714149A publication Critical patent/TW200714149A/en
Application granted granted Critical
Publication of TWI305708B publication Critical patent/TWI305708B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

Electric inspection is performed on a printed board by use of a support member for detachably supporting a fixing member fixing inspection probes and a drive mechanism for bringing inspection probes into contact with the printed board with the prescribed depression force by moving the fixing member close to or apart from the printed board. The depression force, which is applied when inspection probes come in contact with the printed board, is detected as reaction applied to the drive mechanism, which is thus driven in response to the detection value, so that inspection probes are controlled to come in contact with the printed board with the prescribed depression force. The depression force can be calculated based on physical characteristics of inspection probes and the number of inspection probes fixed to the fixing member, so that inspection probes are controlled to come in contact with the printed board with the calculated depression force. The aforementioned physical characteristics correspond to at least one of dimensions, materials, and spring constants of inspection probes. In addition, the depression force can be calculated in light of the arrangement of inspection probes.
TW095118425A 2005-05-27 2006-05-24 Electric inspection apparatus and method for printed board TWI305708B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005155381A JP4919617B2 (en) 2005-05-27 2005-05-27 Electrical inspection apparatus and electrical inspection method for printed circuit board
JP2005155377A JP5334355B2 (en) 2005-05-27 2005-05-27 Electrical inspection apparatus and electrical inspection method for printed circuit board

Publications (2)

Publication Number Publication Date
TW200714149A true TW200714149A (en) 2007-04-01
TWI305708B TWI305708B (en) 2009-01-21

Family

ID=37707981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118425A TWI305708B (en) 2005-05-27 2006-05-24 Electric inspection apparatus and method for printed board

Country Status (4)

Country Link
JP (2) JP4919617B2 (en)
KR (1) KR100816125B1 (en)
CN (1) CN100585415C (en)
TW (1) TWI305708B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837384B (en) * 2019-06-17 2024-04-01 日商日本電產理德股份有限公司 Inspection device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4461159B2 (en) * 2007-06-14 2010-05-12 ヤマハファインテック株式会社 Printed circuit board inspection apparatus and inspection method
KR101049396B1 (en) * 2010-06-11 2011-07-15 한국기계연구원 Printing process simulation apparatus and method
CN104155600A (en) * 2014-08-15 2014-11-19 宁波昌隆机电有限公司 High-efficiency electrical switch squeezing test method
JP6726077B2 (en) 2016-10-13 2020-07-22 ヤマハファインテック株式会社 Processor
CN109212273A (en) * 2017-07-07 2019-01-15 南京泊纳莱电子科技有限公司 Flying probe tester
CN108525895B (en) * 2018-04-17 2019-08-27 京东方科技集团股份有限公司 A kind of oriented film printing system and the control method of printing device
JP7371885B2 (en) * 2019-07-08 2023-10-31 ヤマハファインテック株式会社 Electrical inspection equipment and holding unit

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NL9001478A (en) * 1990-06-28 1992-01-16 Philips Nv TESTING DEVICE FOR ELECTRICAL SWITCHES ON PANELS.
KR0138754B1 (en) 1990-08-06 1998-06-15 이노우에 아키라 Touch sensor unit of probe for testing electric circuit and electric circuit testing apparatus using the touch sensor unit
JPH06140479A (en) * 1992-10-23 1994-05-20 Mitsubishi Denki Eng Kk Device for testing semiconductor integrated circuit
JPH0792479B2 (en) * 1993-03-18 1995-10-09 東京エレクトロン株式会社 Parallelism adjustment method for probe device
JP3099596B2 (en) * 1993-08-26 2000-10-16 トヨタ自動車株式会社 Probe pin arrangement determination device for in-circuit test
JPH0772218A (en) * 1993-08-31 1995-03-17 Azusa Denshi Kk Method and apparatus for inspection of printed-wiring board
JP2963828B2 (en) * 1993-09-24 1999-10-18 東京エレクトロン株式会社 Probe device
JPH0855883A (en) * 1994-08-15 1996-02-27 Hitachi Ltd Circuit element inspection method and inspection apparatus
KR0163688B1 (en) * 1995-07-28 1999-03-20 전주범 Internal circuit measuring device
JPH0989983A (en) * 1995-09-25 1997-04-04 Ando Electric Co Ltd Ic carrying device making changeable contact pressure of ic by data
JPH102931A (en) * 1996-06-17 1998-01-06 Tescon:Kk Inspection apparatus for burn-in board
TW369601B (en) * 1997-06-17 1999-09-11 Advantest Corp Probe card
JPH1152001A (en) 1997-07-31 1999-02-26 Sumitomo Wiring Syst Ltd Inspection part of connector-inspection apparatus
JP3028095B2 (en) * 1998-03-04 2000-04-04 日本電気株式会社 Probing apparatus and method
JP3397713B2 (en) * 1999-03-10 2003-04-21 キヤノン株式会社 Electrical connection device
JP2000284019A (en) * 1999-03-30 2000-10-13 Seiko Epson Corp Pressing device for IC device inspection device and IC device inspection device having the same
JP2002082144A (en) * 2000-09-06 2002-03-22 Toshiba Microelectronics Corp Method for measuring electrical characteristics of semiconductor package and test handler therefor
JP2003066097A (en) * 2001-08-27 2003-03-05 Toshiba Corp Testing equipment for semiconductor devices
JP2003185704A (en) * 2001-12-17 2003-07-03 Seiko Epson Corp Electrode inspection device
JP2003202359A (en) * 2001-12-28 2003-07-18 Fujitsu Ltd Contact pressure control device for contact
JP2004228332A (en) * 2003-01-23 2004-08-12 Yamaha Fine Technologies Co Ltd Electrical inspection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837384B (en) * 2019-06-17 2024-04-01 日商日本電產理德股份有限公司 Inspection device

Also Published As

Publication number Publication date
JP4919617B2 (en) 2012-04-18
KR20060122730A (en) 2006-11-30
JP5334355B2 (en) 2013-11-06
JP2006329861A (en) 2006-12-07
TWI305708B (en) 2009-01-21
CN1916649A (en) 2007-02-21
CN100585415C (en) 2010-01-27
JP2006332422A (en) 2006-12-07
KR100816125B1 (en) 2008-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees