TW200714191A - Electronic apparatus capable of dissipating heat uniformly - Google Patents

Electronic apparatus capable of dissipating heat uniformly

Info

Publication number
TW200714191A
TW200714191A TW094133601A TW94133601A TW200714191A TW 200714191 A TW200714191 A TW 200714191A TW 094133601 A TW094133601 A TW 094133601A TW 94133601 A TW94133601 A TW 94133601A TW 200714191 A TW200714191 A TW 200714191A
Authority
TW
Taiwan
Prior art keywords
electronic apparatus
casing
heat uniformly
apparatus capable
dissipating heat
Prior art date
Application number
TW094133601A
Other languages
English (en)
Other versions
TWI266597B (en
Inventor
Qing Guo
Bao-Hua Li
Dong Lin
Jin-Fa Zhang
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW094133601A priority Critical patent/TWI266597B/zh
Priority to US11/345,482 priority patent/US7239519B2/en
Application granted granted Critical
Publication of TWI266597B publication Critical patent/TWI266597B/zh
Publication of TW200714191A publication Critical patent/TW200714191A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/005—Casings being nesting containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW094133601A 2005-09-27 2005-09-27 Electronic apparatus capable of dissipating heat uniformly TWI266597B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094133601A TWI266597B (en) 2005-09-27 2005-09-27 Electronic apparatus capable of dissipating heat uniformly
US11/345,482 US7239519B2 (en) 2005-09-27 2006-02-01 Electronic device with uniform heat-dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094133601A TWI266597B (en) 2005-09-27 2005-09-27 Electronic apparatus capable of dissipating heat uniformly

Publications (2)

Publication Number Publication Date
TWI266597B TWI266597B (en) 2006-11-11
TW200714191A true TW200714191A (en) 2007-04-01

Family

ID=37893600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133601A TWI266597B (en) 2005-09-27 2005-09-27 Electronic apparatus capable of dissipating heat uniformly

Country Status (2)

Country Link
US (1) US7239519B2 (zh)
TW (1) TWI266597B (zh)

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JP4536467B2 (ja) * 2004-09-17 2010-09-01 株式会社エヌ・ティ・ティ・ドコモ 平面回路用筐体
US7738264B2 (en) * 2006-03-31 2010-06-15 Lifescan Scotland Ltd. Devices and methods for protecting handheld electronic devices from electrostatic discharge
JP3128387U (ja) * 2006-10-25 2007-01-11 船井電機株式会社 電気機器の電源回路部構造
US7729131B2 (en) * 2007-01-05 2010-06-01 Apple Inc. Multiple circuit board arrangements in electronic devices
AU2008261793A1 (en) * 2007-06-13 2008-12-18 E. I. Du Pont De Nemours And Company Isoxazoline insecticides
TWI430995B (zh) * 2007-06-26 2014-03-21 Du Pont 萘異唑啉無脊椎有害動物控制劑
ES2549731T3 (es) * 2007-06-27 2015-11-02 E. I. Du Pont De Nemours And Company Método para el control de plagas en animales
TWI649303B (zh) * 2007-08-17 2019-02-01 杜邦股份有限公司 製備４-乙醯基-ｎ-〔２-側氧基-２-〔（２，２，２-三氟乙基）胺基〕乙基〕-１-萘甲醯胺之化合物及方法
US8367584B2 (en) * 2007-10-03 2013-02-05 E.I. Du Pont De Nemours And Company Naphthalene isoxazoline compounds for control of invertebrate pests
CN102548341A (zh) * 2010-12-10 2012-07-04 旭丽电子(广州)有限公司 散热壳体结构
CN103025122A (zh) * 2011-09-23 2013-04-03 联想(北京)有限公司 一种电子设备
TWI484897B (zh) * 2012-01-20 2015-05-11 Lite On Technology Corp 散熱結構與具有此散熱結構的電子裝置
KR20140006392A (ko) * 2012-07-05 2014-01-16 엘에스산전 주식회사 자동차용 전장부품 박스
CN103547111B (zh) * 2012-07-09 2016-08-10 光宝电子(广州)有限公司 平面式散热结构及电子装置
US9480185B2 (en) * 2014-01-08 2016-10-25 Enphase Energy, Inc. Double insulated heat spreader
CN104779666A (zh) * 2015-03-18 2015-07-15 广东高标电子科技有限公司 便携式充电器
CN108123617B (zh) * 2016-11-29 2020-05-05 台达电子企业管理（上海）有限公司 用于安装高低压转换电路的装置、高低压转换系统及电源
JP7381219B2 (ja) * 2019-04-23 2023-11-15 日立Astemo株式会社 電子制御装置
CN112492863B (zh) 2019-09-10 2023-09-26 群光电能科技股份有限公司 绝缘罩固定结构以及防护装置
JP7490938B2 (ja) * 2019-09-30 2024-05-28 ブラザー工業株式会社 電源基板用エンクロージャー及び電源ユニット並びに板金部材
DE102020100360A1 (de) * 2020-01-09 2021-07-15 Bayerische Motoren Werke Aktiengesellschaft Gehäuseeinrichtung für eine Leistungselektronik eines Kraftfahrzeugs sowie Verfahren zum Bereitstellen einer Gehäuseeinrichtung für eine Leistungselektronik eines Kraftfahrzeugs
TWI773099B (zh) * 2021-01-25 2022-08-01 群光電能科技股份有限公司 殼體結構及具有殼體結構的電子裝置
US20240040756A1 (en) * 2022-07-28 2024-02-01 Te Connectivity Solutions Gmbh Power connector having an emi enclosure

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636617Y2 (ja) * 1988-09-03 1994-09-21 岩崎通信機株式会社 筒形外装ケース
US5124889A (en) * 1990-04-24 1992-06-23 Motorola, Inc. Electromagnetic shielding apparatus for cellular telephones
US5235492A (en) * 1990-04-24 1993-08-10 Motorola, Inc. Electromagnetic shielding apparatus for cellular telephones
FR2666190B1 (fr) * 1990-08-24 1996-07-12 Thomson Csf Procede et dispositif d'encapsulation hermetique de composants electroniques.
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5532427A (en) * 1994-10-24 1996-07-02 Gerome Manufacturing Company, Inc. Electrically conductive joint
EP0727932B1 (en) * 1994-11-28 1999-04-07 Kabushiki Kaisha Toshiba Electromagnetic shielded casing
US6313400B1 (en) * 1999-07-13 2001-11-06 Itt Manufacturing Enterprises, Inc. Data card easily assembled housing
FR2839417B1 (fr) * 2002-05-03 2004-07-16 Dav Dispositif de commutation de puissance refroidi
TWI250841B (en) * 2004-11-24 2006-03-01 Delta Electronics Inc Electronic apparatus with heat-dissipation structure

Also Published As

Publication number Publication date
US7239519B2 (en) 2007-07-03
US20070070606A1 (en) 2007-03-29
TWI266597B (en) 2006-11-11

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Legal Events

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