ATE476864T1 - Kühlbaugruppe - Google Patents

Kühlbaugruppe

Info

Publication number
ATE476864T1
ATE476864T1 AT05754987T AT05754987T ATE476864T1 AT E476864 T1 ATE476864 T1 AT E476864T1 AT 05754987 T AT05754987 T AT 05754987T AT 05754987 T AT05754987 T AT 05754987T AT E476864 T1 ATE476864 T1 AT E476864T1
Authority
AT
Austria
Prior art keywords
heat
circuit board
electronic component
cooling assembly
heat sink
Prior art date
Application number
AT05754987T
Other languages
English (en)
Inventor
Per Holmberg
Ulf Andretzky
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Application granted granted Critical
Publication of ATE476864T1 publication Critical patent/ATE476864T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Polarising Elements (AREA)
  • Inorganic Insulating Materials (AREA)
AT05754987T 2005-06-23 2005-06-23 Kühlbaugruppe ATE476864T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2005/001008 WO2006137763A1 (en) 2005-06-23 2005-06-23 Cooling asssembly

Publications (1)

Publication Number Publication Date
ATE476864T1 true ATE476864T1 (de) 2010-08-15

Family

ID=37570708

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05754987T ATE476864T1 (de) 2005-06-23 2005-06-23 Kühlbaugruppe

Country Status (8)

Country Link
US (1) US7545646B2 (de)
EP (1) EP1900265B1 (de)
JP (1) JP2008547216A (de)
CN (1) CN101209006A (de)
AT (1) ATE476864T1 (de)
CA (1) CA2611578A1 (de)
DE (1) DE602005022783D1 (de)
WO (1) WO2006137763A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2653998C (en) * 2006-05-30 2013-01-15 Jen-Shyan Chen Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency
US20080264608A1 (en) * 2007-04-30 2008-10-30 Trentent Tye Cooling mechanism comprising a heat pipe and water block
EP2271874B1 (de) * 2008-04-29 2013-12-04 Koninklijke Philips N.V. Lichtemittierednes modul, kühlkörper und beleuchtungssystem
US20110048677A1 (en) * 2009-08-31 2011-03-03 Kuo-Len Lin Heat-conducting assembly for heat pipes of different diameters and heat sink having the same
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US9036353B2 (en) 2012-11-26 2015-05-19 Northrop Grumman Systems Corporation Flexible thermal interface for electronics
CN103415184A (zh) * 2013-07-23 2013-11-27 苏州天脉导热科技有限公司 一种热传递与热扩散器件的结合方法
KR102173141B1 (ko) * 2014-02-04 2020-11-02 삼성전자주식회사 히트 파이프를 포함하는 휴대 장치
WO2015184603A1 (zh) 2014-06-04 2015-12-10 华为技术有限公司 一种电子设备
US9750127B2 (en) 2015-12-04 2017-08-29 General Electric Company Circuit card assembly including heat transfer assembly and method of manufacturing such
US10119759B2 (en) * 2016-03-31 2018-11-06 Hoya Candeo Optronics Corporation Heat radiating apparatus and light illuminating apparatus with the same
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
WO2018053005A1 (en) * 2016-09-16 2018-03-22 Heraeus Noblelight America Llc Heatsink including thick film layer for uv led arrays, and methods of forming uv led arrays
EP3301999B1 (de) * 2016-09-30 2020-06-17 HP Scitex Ltd Led-kühlkörper
US9894803B1 (en) 2016-11-18 2018-02-13 Abaco Systems, Inc. Thermal sink with an embedded heat pipe
TWI685638B (zh) * 2018-09-14 2020-02-21 財團法人工業技術研究院 立體脈衝式熱管、立體脈衝式熱管組和散熱模組
US10667378B1 (en) * 2019-01-14 2020-05-26 Eagle Technology, Llc Electronic assemblies having embedded passive heat pipes and associated method
JPWO2024085051A1 (de) * 2022-10-17 2024-04-25
JPWO2024085050A1 (de) * 2022-10-17 2024-04-25

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461673A (en) * 1977-10-25 1979-05-18 Oki Electric Ind Co Ltd Printed circuit board for radiation
JPS5715609A (en) * 1980-06-27 1982-01-27 Toshiba Corp Machining method and its device for turbine blade
JPS5748699A (en) * 1980-09-08 1982-03-20 Japan Gasoline Method of treating liquid containing radioactive nuclide
EP0353568A1 (de) * 1988-07-26 1990-02-07 Siemens Aktiengesellschaft Verfahren zum Reduzieren der beim Abspielen von Videomagnetbändern in Videorekordern auftretenden Bildstörungen und Vorrichtung zur Durchführung des Verfahrens
JPH0370968U (de) * 1989-11-15 1991-07-17
US5353192A (en) * 1993-02-08 1994-10-04 At&T Bell Laboratories Circuit card assembly
JPH07176661A (ja) * 1993-12-20 1995-07-14 Hitachi Cable Ltd ヒートシンク
JP3414996B2 (ja) * 1997-09-01 2003-06-09 株式会社Ｐｆｕ 基板実装型熱交換構造
TW450381U (en) * 1998-08-07 2001-08-11 Foxconn Prec Components Co Ltd Heat sink device
JP4493117B2 (ja) * 1999-03-25 2010-06-30 レノボ シンガポール プライヴェート リミテッド ノートブック型パーソナルコンピューターの冷却方法及び冷却装置
JP4223628B2 (ja) * 1999-05-20 2009-02-12 ティーエス ヒートロニクス 株式会社 電子機器冷却装置
JP3982947B2 (ja) * 1999-05-26 2007-09-26 株式会社フジクラ ヒートシンクの固定構造
US6639799B2 (en) * 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器
JP2003218294A (ja) * 2002-01-23 2003-07-31 Mitsubishi Electric Corp 放熱器
JP2003229689A (ja) * 2002-02-04 2003-08-15 Fujikura Ltd 電子素子の冷却装置
JP2004022786A (ja) * 2002-06-17 2004-01-22 Matsushita Electric Ind Co Ltd ファンユニット
US7057895B2 (en) * 2003-06-30 2006-06-06 Intel Corporation Thermal standoff for close proximity thermal management
JP4041023B2 (ja) * 2003-07-04 2008-01-30 株式会社東芝 配線基板
CN100377343C (zh) * 2004-09-21 2008-03-26 鸿富锦精密工业（深圳）有限公司 散热装置的制造方法

Also Published As

Publication number Publication date
US20080198554A1 (en) 2008-08-21
EP1900265B1 (de) 2010-08-04
CA2611578A1 (en) 2006-12-28
EP1900265A1 (de) 2008-03-19
US7545646B2 (en) 2009-06-09
WO2006137763A1 (en) 2006-12-28
CN101209006A (zh) 2008-06-25
JP2008547216A (ja) 2008-12-25
DE602005022783D1 (de) 2010-09-16

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