TW200719085A - Photosensitive resin composition, composition for solder resist, and photosensitive dry film - Google Patents

Photosensitive resin composition, composition for solder resist, and photosensitive dry film

Info

Publication number
TW200719085A
TW200719085A TW095128351A TW95128351A TW200719085A TW 200719085 A TW200719085 A TW 200719085A TW 095128351 A TW095128351 A TW 095128351A TW 95128351 A TW95128351 A TW 95128351A TW 200719085 A TW200719085 A TW 200719085A
Authority
TW
Taiwan
Prior art keywords
compound
carbon
composition
resin composition
double bond
Prior art date
Application number
TW095128351A
Other languages
English (en)
Other versions
TWI387851B (zh
Inventor
Makoto Hirakawa
Masao Takei
Hiroshi Niizuma
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Publication of TW200719085A publication Critical patent/TW200719085A/zh
Application granted granted Critical
Publication of TWI387851B publication Critical patent/TWI387851B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW095128351A 2005-08-03 2006-08-02 A photosensitive resin composition, a solder resist composition, and a photosensitive dry film TWI387851B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005226020 2005-08-03
JP2005373645 2005-12-27

Publications (2)

Publication Number Publication Date
TW200719085A true TW200719085A (en) 2007-05-16
TWI387851B TWI387851B (zh) 2013-03-01

Family

ID=37708703

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128351A TWI387851B (zh) 2005-08-03 2006-08-02 A photosensitive resin composition, a solder resist composition, and a photosensitive dry film

Country Status (5)

Country Link
US (1) US7670752B2 (zh)
JP (1) JP4770836B2 (zh)
KR (1) KR101307124B1 (zh)
TW (1) TWI387851B (zh)
WO (1) WO2007015423A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007043240A1 (ja) * 2005-10-07 2007-04-19 Hitachi Chemical Company, Ltd. 感光性樹脂組成物及びこれを用いた感光性エレメント
JP5051217B2 (ja) * 2007-03-05 2012-10-17 東亞合成株式会社 感光性組成物、ソルダーレジストおよび感光性ドライフィルム
JP2009065091A (ja) * 2007-09-10 2009-03-26 Momentive Performance Materials Japan Kk 電気・電子部品の金属製導電部保護方法および電気・電子部品
JP5417071B2 (ja) * 2009-07-21 2014-02-12 電気化学工業株式会社 回路基板
JP5799952B2 (ja) * 2010-05-20 2015-10-28 日立化成株式会社 感光性樹脂組成物、感光性フィルム、リブパターンの形成方法、中空構造とその形成方法及び電子部品
JP5464067B2 (ja) * 2010-06-11 2014-04-09 東亞合成株式会社 感光性樹脂組成物、ソルダーレジスト及び感光性ドライフィルム
JP2012063645A (ja) * 2010-09-17 2012-03-29 Nitto Denko Corp 感光性樹脂組成物およびそれを用いた金属支持体付回路基板
JP5625721B2 (ja) * 2010-10-15 2014-11-19 日立化成株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
JP4850313B1 (ja) * 2011-02-14 2012-01-11 積水化学工業株式会社 ２液混合型の第１，第２の液及びプリント配線板の製造方法
JP4991960B1 (ja) * 2011-02-14 2012-08-08 積水化学工業株式会社 ２液混合型の第１，第２の液及びプリント配線板の製造方法
TW201300951A (zh) * 2011-03-28 2013-01-01 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性薄膜、圖型形成方法、中空構造之形成方法及電子零件
JP6221204B2 (ja) * 2011-03-28 2017-11-01 日立化成株式会社 感光性樹脂組成物、感光性フィルム、パターン形成方法、中空構造の形成方法、及び電子部品
KR20150118096A (ko) * 2013-02-12 2015-10-21 디아이씨 가부시끼가이샤 절연 재료용 수지 조성물, 절연 잉크, 절연막 및 그것을 사용한 유기 전계 효과 트랜지스터
US10647056B2 (en) * 2015-03-19 2020-05-12 Dow Global Technologies Llc Method of additive manufacturing using photoregulated radical polymerization
CN109690404B (zh) * 2016-12-07 2023-04-04 旭化成株式会社 感光性树脂组合物和感光性树脂层叠体
CN114555750A (zh) * 2019-08-02 2022-05-27 布鲁尔科技公司 永久性粘结和图案化材料
CN115413280B (zh) * 2020-07-08 2025-10-21 捷恩智株式会社 光硬化性组合物、喷墨用油墨组合物、活性能量线硬化型油墨组合物、硬化物及电子零件
CN112578633B (zh) * 2020-11-30 2022-04-29 珠海市能动科技光学产业有限公司 一种光致抗蚀剂
CN115291450B (zh) * 2022-08-19 2024-06-21 中国科学院苏州纳米技术与纳米仿生研究所 印刷电解质层的方法、电致变色器件及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPH08292569A (ja) * 1995-04-24 1996-11-05 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム
JP2718007B2 (ja) 1995-06-06 1998-02-25 太陽インキ製造株式会社 アルカリ現像可能な一液型フォトソルダーレジスト組成物及びそれを用いたプリント配線板の製造方法
JP3190251B2 (ja) 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
JPH1124263A (ja) * 1997-07-04 1999-01-29 Hitachi Chem Co Ltd 感光性樹脂組成物
JP4237944B2 (ja) * 1999-03-19 2009-03-11 日本化薬株式会社 ウレタンオリゴマー、その樹脂組成物、その硬化物
JP2001051415A (ja) * 1999-08-09 2001-02-23 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2001100410A (ja) 1999-09-29 2001-04-13 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
US6297294B1 (en) * 1999-10-07 2001-10-02 E. I. Du Pont De Nemours And Company Method for improving the adhesion of a photopolymerizable composition to copper
US20030091926A1 (en) * 1999-11-03 2003-05-15 Shipley Company, L.L.C. Dry film photoresist
JP4316093B2 (ja) 2000-03-21 2009-08-19 昭和高分子株式会社 感光性樹脂組成物
JP4623890B2 (ja) * 2000-09-11 2011-02-02 昭和電工株式会社 感光性組成物及びその硬化物並びにそれを用いたプリント配線基板
AU2001284499A1 (en) * 2000-09-11 2002-03-26 Showa Denko K K Photosensitive composition, cured article thereof, and printed circuit board using the same
JP2002162739A (ja) * 2000-11-27 2002-06-07 Hitachi Chem Co Ltd 永久マスクレジスト、永久マスクレジストの製造法及び永久マスクレジスト積層基板
JP2003131362A (ja) * 2001-10-25 2003-05-09 Showa Denko Kk レジスト用硬化性樹脂組成物及びその硬化物
EP1402321A1 (en) * 2001-07-04 2004-03-31 Showa Denko K.K. Resist curable resin composition and cured article thereof
JP2004062057A (ja) * 2002-07-31 2004-02-26 Showa Denko Kk 感光性熱硬化性樹脂組成物及びその硬化物
JP2005060662A (ja) * 2003-07-31 2005-03-10 Hitachi Chem Co Ltd 変性エポキシ樹脂、その製造方法、感光性樹脂組成物及び感光性エレメント
JP2006323089A (ja) * 2005-05-18 2006-11-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム
JP2007023131A (ja) * 2005-07-14 2007-02-01 Hitachi Chem Co Ltd 変性エポキシ樹脂及びその製造方法、感光性樹脂組成物並びに感光性エレメント

Also Published As

Publication number Publication date
JP4770836B2 (ja) 2011-09-14
WO2007015423A1 (ja) 2007-02-08
US20090068595A1 (en) 2009-03-12
KR101307124B1 (ko) 2013-09-10
TWI387851B (zh) 2013-03-01
US7670752B2 (en) 2010-03-02
JPWO2007015423A1 (ja) 2009-02-19
KR20080030554A (ko) 2008-04-04

Similar Documents

Publication Publication Date Title
TW200719085A (en) Photosensitive resin composition, composition for solder resist, and photosensitive dry film
US10642155B2 (en) Mixed-type photosensitive resin and preparation method therefor
JP7200130B2 (ja) 不飽和二重結合含有化合物、それを用いた酸素吸収剤、及び樹脂組成物
KR101528737B1 (ko) 경화성 수지 조성물
KR101626454B1 (ko) 혐기 경화성 조성물
JP2009051954A (ja) 光および加熱硬化性組成物とその硬化物
JP2011043806A5 (zh)
WO2008139679A1 (ja) 光及び／又は熱硬化性共重合体、硬化性樹脂組成物及び硬化物
WO2010114077A1 (ja) α－（不飽和アルコキシアルキル）アクリレート組成物及びその製造方法
KR20140021678A (ko) 경화성 수지 조성물
JP5344794B2 (ja) 活性エネルギー線硬化型コーティング樹脂組成物
WO2008108390A1 (ja) 光硬化性組成物およびこれを用いた硬化物
KR20140012581A (ko) 라디칼 중합성 조성물, 경화물 및 플라스틱 렌즈
JP5697977B2 (ja) 耐熱性の嫌気的に硬化する組成物
TW200801800A (en) Photosensitive resin composition
EP1564232A4 (en) LIGHT-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING HYDROGEL
JP2015025110A (ja) （メタ）アクリレート化合物、その製造方法及び微生物付着防止機能を有する高分子化合物
TW201945412A (zh) 聚合物以及使用其之氧吸收劑及樹脂組成物
TW200602448A (en) Thermosetting adhesive or pressure-sensitive adhesive composition and thermosetting adhesive or pressure-sensitive adhesive tape or sheet
TW200801802A (en) Curable composition and cured product thereof
WO2009017064A1 (ja) アルカリ現像性感光性樹脂組成物及びβ－ジケトン化合物
JP2020176214A (ja) アミドイミド樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
JP6780809B1 (ja) 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
FI3749723T3 (fi) Uv-kovettuva isosyanaatiton polyureapolymeeri ja sitä sisältävä uv-kovettuva pinnoitekoostumus
DE60125201D1 (de) Flüssige, härtbare harzzusammensetzungen und gehärtete produkte

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees