TW200719459A - Circuit substrate, method of fabricating the same and chip package structure using the same - Google Patents
Circuit substrate, method of fabricating the same and chip package structure using the sameInfo
- Publication number
- TW200719459A TW200719459A TW094140033A TW94140033A TW200719459A TW 200719459 A TW200719459 A TW 200719459A TW 094140033 A TW094140033 A TW 094140033A TW 94140033 A TW94140033 A TW 94140033A TW 200719459 A TW200719459 A TW 200719459A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- same
- disposed
- circuit substrate
- fabricating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010410 layer Substances 0.000 abstract 17
- 239000012792 core layer Substances 0.000 abstract 5
- 229910000679 solder Inorganic materials 0.000 abstract 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
A circuit substrate including a core layer and a stacked layer disposed thereon is provided. The stacked layer includes a first dielectric layer, a circuit layer, a solder mask layer and at least one first bump. The first dielectric layer is disposed on the core layer. The circuit layer is disposed on the core layer and lodged in the first dielectric layer, and the core layer includes a first conductive layer connected to the core layer and a second conductive layer disposed on the first conductive layer. The solder mask layer is disposed on the first dielectric layer. The first bump is disposed on the first dielectric layer and lodged in the solder mask layer. The first bump is electrically connected to the circuit layer, and exposed from the solder mask layer. The circuit substrate is electrically connected to other devices through the first bump, to improve the convenience in use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94140033A TWI267969B (en) | 2005-11-15 | 2005-11-15 | Circuit substrate, method of fabricating the same and chip package structure using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94140033A TWI267969B (en) | 2005-11-15 | 2005-11-15 | Circuit substrate, method of fabricating the same and chip package structure using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI267969B TWI267969B (en) | 2006-12-01 |
| TW200719459A true TW200719459A (en) | 2007-05-16 |
Family
ID=38220506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94140033A TWI267969B (en) | 2005-11-15 | 2005-11-15 | Circuit substrate, method of fabricating the same and chip package structure using the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI267969B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9699905B2 (en) | 2012-08-09 | 2017-07-04 | Ngk Spark Plug Co., Ltd. | Wiring board |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI351903B (en) | 2007-07-25 | 2011-11-01 | Unimicron Technology Corp | A circuit board structure with concave conductive |
| CN115440689A (en) * | 2021-06-01 | 2022-12-06 | 日月光半导体制造股份有限公司 | Bonding structure and method for forming the same |
-
2005
- 2005-11-15 TW TW94140033A patent/TWI267969B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9699905B2 (en) | 2012-08-09 | 2017-07-04 | Ngk Spark Plug Co., Ltd. | Wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI267969B (en) | 2006-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |